2013 conference paper
Exploring early design tradeoffs in 3DIC
2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.
Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013
2012 conference paper
A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration
2012 ieee custom integrated circuits conference (cicc).
2012 journal article
Area-Efficient Antenna-Scalable MIMO Detector for K-best Sphere Decoding
JOURNAL OF SIGNAL PROCESSING SYSTEMS FOR SIGNAL IMAGE AND VIDEO TECHNOLOGY, 68(2), 171–182.
2012 journal article
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.
2011 conference paper
3D specific systems: Design and CAD
2011 Asian Test Symposium, 470–473.
Event: 2011 Asian Test Symposium at New Delhi, India on November 20-23, 2011
2011 journal article
Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor
IET COMPUTERS AND DIGITAL TECHNIQUES, 5(3), 198–204.
2009 conference paper
A low power 3D integrated FFT engine using hypercube memory division
ISLPED 09, 231–236.
2009 conference paper
Junction-level thermal extraction and simulation of 3DICs
2009 IEEE International Conference on 3d Systems Integration, 395–401.
Event: 2009 IEEE International Conference on 3D System Integration at San Francisco, CA on September 28-30, 2009
conference paper
Comparative analysis of two 3D integration implementations of a SAR processor
Thorolfsson, T., Melamed, S., Charles, G., & Franzon, P. D. 2009 IEEE International Conference on 3d Systems Integration, 25–28.
