Works (9)

Updated: July 5th, 2023 15:47

2013 conference paper

Exploring early design tradeoffs in 3DIC

2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.

By: P. Franzon n , S. Priyadarshi n, S. Lipa n, W. Davis n  & T. Thorolfsson*

co-author countries: United States of America πŸ‡ΊπŸ‡Έ

Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration

2012 ieee custom integrated circuits conference (cicc).

By: T. Thorolfsson n, S. Lipa n & P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Area-Efficient Antenna-Scalable MIMO Detector for K-best Sphere Decoding

JOURNAL OF SIGNAL PROCESSING SYSTEMS FOR SIGNAL IMAGE AND VIDEO TECHNOLOGY, 68(2), 171–182.

By: N. Moezzi-Madani n, T. Thorolfsson n, P. Chiang* & W. Davis n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
author keywords: MIMO; K-best; Sphere decoder; VLSI
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

By: S. Melamed*, T. Thorolfsson*, T. Harris*, S. Priyadarshi n, P. Franzon n , M. Steer n, W. Davis n 

co-author countries: Japan πŸ‡―πŸ‡΅ United States of America πŸ‡ΊπŸ‡Έ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2011 conference paper

3D specific systems: Design and CAD

2011 Asian Test Symposium, 470–473.

By: P. Franzon n , W. Davis n , T. Thorolfsson n & S. Melamed  n

co-author countries: United States of America πŸ‡ΊπŸ‡Έ

Event: 2011 Asian Test Symposium at New Delhi, India on November 20-23, 2011

author keywords: 3DIC; 3D IC; three dimensional IC; TSV; stacked memory; memory on logic; FFT
Sources: Web Of Science, ORCID
Added: August 6, 2018

2011 journal article

Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor

IET COMPUTERS AND DIGITAL TECHNIQUES, 5(3), 198–204.

By: T. Thorolfsson n, N. Moezzi-Madani n & P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2009 conference paper

A low power 3D integrated FFT engine using hypercube memory division

ISLPED 09, 231–236.

By: T. Thorolfsson n, N. Moezzi-Madani n & P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2009 conference paper

Junction-level thermal extraction and simulation of 3DICs

2009 IEEE International Conference on 3d Systems Integration, 395–401.

By: S. Melamed  n, T. Thorolfsson n, A. Srinivasan*, E. Cheng*, P. Franzon n  & R. Davis n

co-author countries: United States of America πŸ‡ΊπŸ‡Έ

Event: 2009 IEEE International Conference on 3D System Integration at San Francisco, CA on September 28-30, 2009

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

conference paper

Comparative analysis of two 3D integration implementations of a SAR processor

Thorolfsson, T., Melamed, S., Charles, G., & Franzon, P. D. 2009 IEEE International Conference on 3d Systems Integration, 25–28.

By: T. Thorolfsson, S. Melamed, G. Charles & P. Franzon 

Source: NC State University Libraries
Added: August 6, 2018

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