2013 conference paper
Exploring early design tradeoffs in 3DIC
2013 ieee international symposium on circuits and systems (iscas), 545–549.
2012 conference paper
A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration
2012 ieee custom integrated circuits conference (cicc).
2012 journal article
Area-efficient antenna-scalable MIMO detector for K-best sphere decoding
Journal of Signal Processing Systems for Signal Image and Video Technology, 68(2), 171–182.
2012 journal article
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.
2011 conference paper
3D specific systems: Design and CAD
2011 20th asian test symposium (ats), 470–473.
2011 journal article
Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor
IET Computers and Digital Techniques, 5(3), 198–204.
2009 conference paper
A low power 3D integrated FFT engine using hypercube memory division
ISLPED 09, 231–236.
conference paper
Comparative analysis of two 3D integration implementations of a SAR processor
Thorolfsson, T., Melamed, S., Charles, G., & Franzon, P. D. 2009 IEEE International Conference on 3d Systems Integration, 25–28.
conference paper
Junction-level thermal extraction and simulation of 3DICs
Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, R. 2009 IEEE International Conference on 3d Systems Integration, 395–401.
