Thorlindur Thorolfsson

Works (9)

Updated: July 5th, 2023 15:47

2013 conference paper

Exploring early design tradeoffs in 3DIC

2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.

By: P. Franzon n , S. Priyadarshi n, S. Lipa n, W. Davis n  & T. Thorolfsson*

topics (OpenAlex): 3D IC and TSV technologies; Additive Manufacturing and 3D Printing Technologies; VLSI and FPGA Design Techniques
TL;DR: This paper explores some of the approaches to creating 3D specific designs and the CAD tools that can help in that exploration, together with early results from a thermal pathfinding tool. (via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2012 article

A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration

Thorolfsson, T., Lipa, S., & Franzon, P. D. (2012, September 1). 2012 Ieee Custom Integrated Circuits Conference (Cicc).

By: T. Thorolfsson*, S. Lipa n & P. Franzon n 

topics (OpenAlex): 3D IC and TSV technologies; Advanced MEMS and NEMS Technologies; Photonic and Optical Devices
TL;DR: This paper shows how this technique was used to build the first fine-grain partitioned 3D integrated system to be demonstrated with silicon measurements in the literature, which is an ultra efficient floating-point synthetic aperture radar (SAR) DSP processing unit. (via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2012 article

Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring

Melamed, S., Thorolfsson, T., Harris, T. R., Priyadarshi, S., Franzon, P., Steer, M. B., & Davis, W. R. (2012, April 20). IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 31, pp. 676–689.

By: S. Melamed*, T. Thorolfsson*, T. Harris*, S. Priyadarshi n, P. Franzon n , M. Steer n, W. Davis n 

topics (OpenAlex): 3D IC and TSV technologies; Electronic Packaging and Soldering Technologies; Silicon Carbide Semiconductor Technologies
TL;DR: This paper presents a resistive mesh-based approach that improves on the fidelity of prior approaches by constructing a thermal model of the full structure of 3DICs, including the interconnect, and introduces a method for dividing the thermal response caused by a heat load into a high fidelity “near response” and a lower fidelity” in order to implement Power Blurring high definition (HD). (via Semantic Scholar)
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Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2011 conference paper

3D specific systems: Design and CAD

2011 Asian Test Symposium, 470–473.

By: P. Franzon n , W. Davis n , T. Thorolfsson n & S. Melamed  n

author keywords: 3DIC; 3D IC; three dimensional IC; TSV; stacked memory; memory on logic; FFT
topics (OpenAlex): 3D IC and TSV technologies; Semiconductor materials and devices; Thin-Film Transistor Technologies
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Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2011 article

Area-Efficient Antenna-Scalable MIMO Detector for K-best Sphere Decoding

Moezzi-Madani, N., Thorolfsson, T., Chiang, P., & Davis, W. R. (2011, June 3). Journal of Signal Processing Systems, Vol. 68, pp. 171–182.

By: N. Moezzi-Madani n, T. Thorolfsson n, P. Chiang* & W. Davis n 

author keywords: MIMO; K-best; Sphere decoder; VLSI
topics (OpenAlex): Advanced Wireless Communication Techniques; Wireless Communication Networks Research; Advanced MIMO Systems Optimization
TL;DR: A reconfigurable in-place architecture that is scalable to an arbitrary number of antennas at run-time, while reducing area significantly compared with other sphere decoders, and to improve the throughput of the in-place architecture without any degradation in BER performance is proposed. (via Semantic Scholar)
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7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2011 article

Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor

Thorolfsson, T., Moezzi-Madani, N., & Franzon, P. D. (2011, May 9). IET Computers & Digital Techniques, Vol. 5, pp. 198–204.

By: T. Thorolfsson n, N. Moezzi-Madani n & P. Franzon n 

topics (OpenAlex): Embedded Systems Design Techniques; Interconnection Networks and Systems; 3D IC and TSV technologies
TL;DR: A floating-point synthetic aperture radar processor that achieves a power efficiency of 18.0 mW/GFlop in simulation through the use of three-dimensional (3D) integration and reconfiguration of the data path is presented. (via Semantic Scholar)
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7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2009 article

A low power 3D integrated FFT engine using hypercube memory division

Thorolfsson, T., Moezzi-Madani, N., & Franzon, P. D. (2009, August 19). ISLPED 09, pp. 231–236.

By: T. Thorolfsson n, N. Moezzi-Madani n & P. Franzon n 

topics (OpenAlex): 3D IC and TSV technologies; Interconnection Networks and Systems; Parallel Computing and Optimization Techniques
TL;DR: A floating point FFT processor that leverages both 3D integration and a hypercube memory division scheme to reduce the power consumption of a 1024 point F FT down to 4.227 μJ is demonstrated. (via Semantic Scholar)
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2009 conference paper

Junction-level thermal extraction and simulation of 3DICs

2009 IEEE International Conference on 3d Systems Integration, 395–401.

By: S. Melamed  n, T. Thorolfsson n, A. Srinivasan *, E. Cheng*, P. Franzon n  & R. Davis n 

topics (OpenAlex): 3D IC and TSV technologies; Semiconductor materials and devices; Integrated Circuits and Semiconductor Failure Analysis
TL;DR: It was found that lowering the simulation resolution and using composite thermal conductivities failed to accurately predict the location of these tentpoles, so large isolated temperature spikes were found near groups of clock buffers at the edge of the SRAMs on the middle tier. (via Semantic Scholar)
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

conference paper

Comparative analysis of two 3D integration implementations of a SAR processor

Thorolfsson, T., Melamed, S., Charles, G., & Franzon, P. D. 2009 IEEE International Conference on 3d Systems Integration, 25–28.

By: T. Thorolfsson, S. Melamed, G. Charles & P. Franzon 

Source: NC State University Libraries
Added: August 6, 2018

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