Works (2)

Updated: April 11th, 2023 10:13

2014 journal article

Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(11), 1862–1870.

By: . Chen n, T. Zhu, W. Davis & P. Franzon

author keywords: 3-D integrated circuit (3-D IC); adaptive; clock distribution; deskew; optimization; process-voltage-temperature (PVT) variation; stacking; thermal profile; through-silicon-via (TSV); tunable-delay-buffer (TDB)
Sources: Web Of Science, ORCID
Added: August 6, 2018

2011 conference paper

Adaptive clock distribution for 3D integrated circuits

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 91–94.

By: X. Chen, W. Davis & P. Franzon

Event: 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems at San Jose, CA on October 23-26, 2011

Sources: NC State University Libraries, ORCID
Added: August 6, 2018