Works (10)

Updated: October 23rd, 2023 08:15

2019 journal article

An FPGA-Based Backend System for Intravascular Photoacoustic and Ultrasound Imaging

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 66(1), 45–56.

By: X. Wu n, J. Sanders n, X. Zhang n, F. Yamaner n & O. Oralkan n

author keywords: Data acquisition; finite-state machine (FSM); field-programmable gate array (FPGA); photoacoustic (PA) imaging; software/hardware codesign; ultrasound (US) imaging; velocity measurement
MeSH headings : Algorithms; Equipment Design; Image Processing, Computer-Assisted / methods; Phantoms, Imaging; Photoacoustic Techniques / instrumentation; Photoacoustic Techniques / methods; Transducers; Ultrasonography, Interventional / instrumentation; Ultrasonography, Interventional / methods
Sources: Web Of Science, ORCID
Added: February 18, 2019

2018 article

Summary of Advances in Heat-Pulse Methods: Measuring Near-Surface Soil Water Content

SOIL SCIENCE SOCIETY OF AMERICA JOURNAL, Vol. 82, pp. 1015–1015.

By: X. Zhang*, T. Ren*, J. Heitman n & R. Horton*

co-author countries: China 🇨🇳
Sources: Web Of Science, ORCID
Added: October 19, 2018

2017 journal article

Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducers With Through-Glass-Via Interconnects Using Anodic Bonding

Journal of Microelectromechanical Systems, 26(1), 226–234.

By: X. Zhang n, F. Yamaner* & O. Oralkan n

co-author countries: Türkiye 🇹🇷
Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2016 conference paper

2D CMUT array based ultrasonic micromanipulation platform

2016 IEEE International Ultrasonics Symposium (IUS). Presented at the 2016 IEEE International Ultrasonics Symposium (IUS).

By: A. Zeshan*, X. Zhang n, O. Oralkan n & F. Yamaner*

co-author countries: Türkiye 🇹🇷

Event: 2016 IEEE International Ultrasonics Symposium (IUS)

Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2016 conference paper

A MEMS T/R switch embedded in CMUT structure for ultrasound imaging frontends

2016 IEEE International Ultrasonics Symposium (IUS). Presented at the 2016 IEEE International Ultrasonics Symposium (IUS).

By: X. Zhang n, A. Zeshan*, O. Adelegan n, F. Yamaner* & O. Oralkan n

co-author countries: Türkiye 🇹🇷

Event: 2016 IEEE International Ultrasonics Symposium (IUS)

Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2016 conference paper

CMUTs on glass with ITO bottom electrodes for improved transparency

2016 IEEE International Ultrasonics Symposium (IUS). Presented at the 2016 IEEE International Ultrasonics Symposium (IUS).

By: X. Zhang n, O. Adelegan n, F. Yamaner* & O. Oralkan n

co-author countries: Türkiye 🇹🇷

Event: 2016 IEEE International Ultrasonics Symposium (IUS)

Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2015 journal article

A Three-Mask Process for Fabricating Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducers Using Anodic Bonding

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 62(5), 972–982.

By: F. Yamaner*, X. Zhang n & O. Oralkan n

co-author countries: Türkiye 🇹🇷
MeSH headings : Electrodes; Equipment Design; Microtechnology; Models, Theoretical; Silicon Compounds / chemistry; Transducers; Ultrasonography / instrumentation; Vacuum
Sources: Web Of Science, ORCID
Added: August 6, 2018

2015 conference paper

Design of high-frequency broadband CMUT arrays

2015 IEEE International Ultrasonics Symposium (IUS). Presented at the 2015 IEEE International Ultrasonics Symposium (IUS).

By: X. Zhang n, F. Yamanery, O. Adelegan n & O. Oralkan n

co-author countries: Türkiye 🇹🇷

Event: 2015 IEEE International Ultrasonics Symposium (IUS)

author keywords: High frequency transducer array; Broadband; CMUT; Anodic bonding; Glass
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018

2015 conference paper

Fabrication of capacitive micromachined ultrasonic transducers with through-glass-via interconnects

2015 IEEE International Ultrasonics Symposium (IUS). Presented at the 2015 IEEE International Ultrasonics Symposium (IUS).

By: X. Zhang n, F. Yamanery & O. Oralkan n

co-author countries: Türkiye 🇹🇷

Event: 2015 IEEE International Ultrasonics Symposium (IUS)

author keywords: CMUT; TGV; Anodic bonding; 3D integration; Glass
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018

2014 article

Fabrication of Anodically Bonded Capacitive Micromachined Ultrasonic Transducers with Vacuum-Sealed Cavities

2014 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), pp. 604–607.

By: F. Yamaner n, X. Zhang n & O. Oralkan n

Sources: Web Of Science, ORCID
Added: August 6, 2018

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