Xiao Zhang
Works (10)
Updated: October 23rd, 2023 08:15
2019 journal article
An FPGA-Based Backend System for Intravascular Photoacoustic and Ultrasound Imaging
IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 66(1), 45–56.
co-author countries:
United States of America 🇺🇸
author keywords: Data acquisition; finite-state machine (FSM); field-programmable gate array (FPGA); photoacoustic (PA) imaging; software/hardware codesign; ultrasound (US) imaging; velocity measurement
MeSH headings : Algorithms; Equipment Design; Image Processing, Computer-Assisted / methods; Phantoms, Imaging; Photoacoustic Techniques / instrumentation; Photoacoustic Techniques / methods; Transducers; Ultrasonography, Interventional / instrumentation; Ultrasonography, Interventional / methods
Sources: Web Of Science, ORCID
Added: February 18, 2019
2018 article
Summary of Advances in Heat-Pulse Methods: Measuring Near-Surface Soil Water Content
SOIL SCIENCE SOCIETY OF AMERICA JOURNAL, Vol. 82, pp. 1015–1015.
co-author countries:
China 🇨🇳 United States of America 🇺🇸
lib.dr.iastate.edu (repository)
Sources: Web Of Science, ORCID
Added: October 19, 2018
2017 journal article
Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducers With Through-Glass-Via Interconnects Using Anodic Bonding
Journal of Microelectromechanical Systems, 26(1), 226–234.
co-author countries:
Türkiye 🇹🇷 United States of America 🇺🇸
Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018
2016 conference paper
2D CMUT array based ultrasonic micromanipulation platform
2016 IEEE International Ultrasonics Symposium (IUS). Presented at the 2016 IEEE International Ultrasonics Symposium (IUS).
co-author countries:
Türkiye 🇹🇷 United States of America 🇺🇸
Event: 2016 IEEE International Ultrasonics Symposium (IUS)
Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018
2016 conference paper
A MEMS T/R switch embedded in CMUT structure for ultrasound imaging frontends
2016 IEEE International Ultrasonics Symposium (IUS). Presented at the 2016 IEEE International Ultrasonics Symposium (IUS).
co-author countries:
Türkiye 🇹🇷 United States of America 🇺🇸
Event: 2016 IEEE International Ultrasonics Symposium (IUS)
Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018
2016 conference paper
CMUTs on glass with ITO bottom electrodes for improved transparency
2016 IEEE International Ultrasonics Symposium (IUS). Presented at the 2016 IEEE International Ultrasonics Symposium (IUS).
co-author countries:
Türkiye 🇹🇷 United States of America 🇺🇸
Event: 2016 IEEE International Ultrasonics Symposium (IUS)
Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018
2015 journal article
A Three-Mask Process for Fabricating Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducers Using Anodic Bonding
IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 62(5), 972–982.
co-author countries:
Türkiye 🇹🇷 United States of America 🇺🇸
MeSH headings : Electrodes; Equipment Design; Microtechnology; Models, Theoretical; Silicon Compounds / chemistry; Transducers; Ultrasonography / instrumentation; Vacuum
Sources: Web Of Science, ORCID
Added: August 6, 2018
2015 conference paper
Design of high-frequency broadband CMUT arrays
2015 IEEE International Ultrasonics Symposium (IUS). Presented at the 2015 IEEE International Ultrasonics Symposium (IUS).
co-author countries:
Türkiye 🇹🇷 United States of America 🇺🇸
Event: 2015 IEEE International Ultrasonics Symposium (IUS)
author keywords: High frequency transducer array; Broadband; CMUT; Anodic bonding; Glass
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018
2015 conference paper
Fabrication of capacitive micromachined ultrasonic transducers with through-glass-via interconnects
2015 IEEE International Ultrasonics Symposium (IUS). Presented at the 2015 IEEE International Ultrasonics Symposium (IUS).
co-author countries:
Türkiye 🇹🇷 United States of America 🇺🇸
Event: 2015 IEEE International Ultrasonics Symposium (IUS)
author keywords: CMUT; TGV; Anodic bonding; 3D integration; Glass
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018
2014 article
Fabrication of Anodically Bonded Capacitive Micromachined Ultrasonic Transducers with Vacuum-Sealed Cavities
2014 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), pp. 604–607.
co-author countries:
United States of America 🇺🇸
Sources: Web Of Science, ORCID
Added: August 6, 2018
