Zack Coutant

College of Engineering

Works (3)

Updated: June 16th, 2023 22:08

2021 article proceedings

Design and Fabrication of Single-Element CMUTs for Forming a Transcranial Array for Focused Beam Applications

By: T. Minhaj n , O. Adelegan n, A. Biliroglu n, M. Annayev n, Z. Coutant n, F. Yamaner n , O. Oralkan n 

author keywords: ultrasound; focused; ultrasound; transducer; transcranial; fabrication; stimulation
topics (OpenAlex): Ultrasound and Hyperthermia Applications; Ultrasound Imaging and Elastography; Ultrasound and Cavitation Phenomena
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Sources: Web Of Science, NC State University Libraries, ORCID, Crossref
Added: August 15, 2022

2021 article

Design and Fabrication of Wideband Air-Coupled Capacitive Micromachined Ultrasonic Transducers With Varying Width Annular-Ring and Spiral Cell Structures

Adelegan, O. J., Coutant, Z. A., Wu, X., Yamaner, F. Y., & Oralkan, O. (2021, April 27). IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control, Vol. 8, pp. 2749–2759.

By: O. Adelegan n, Z. Coutant n, X. Wu n , F. Yamaner n  & O. Oralkan n 

author keywords: Annular; anodic bonding process; capacitive micromachined ultrasonic transducer (CMUT); glass substrate; spiral
topics (OpenAlex): Advanced MEMS and NEMS Technologies; Advanced Sensor and Energy Harvesting Materials; Ultrasound Imaging and Elastography
TL;DR: A design strategy and fabrication process for developing improved concentric annular- and novel spiral-shaped capacitive micromachined ultrasonic transducers that can generate high output pressure and provide wide bandwidth in air are presented. (via Semantic Scholar)
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Sources: Web Of Science, NC State University Libraries, ORCID
Added: August 9, 2021

2021 article

Fabrication of 32 × 32 2D Capacitive Micromachined Ultrasonic Transducer (CMUT) Arrays on a Borosilicate Glass Substrate With Silicon-Through-Wafer Interconnects Using Sacrificial Release Process

Adelegan, O. J., Coutant, Z. A., Minhaj, T. I., Seok, C., Biliroglu, A. O., Yamaner, F. Y., & Oralkan, O. (2021, September 20). Journal of Microelectromechanical Systems, Vol. 30, pp. 968–979.

By: O. Adelegan n, Z. Coutant n, T. Minhaj n , C. Seok n, A. Biliroglu n, F. Yamaner n , O. Oralkan n 

author keywords: Capacitive micromachined ultrasonic transducer (CMUT); 2D arrays; glass substrate; silicon-through-glass-vias (Si-TGV); sacrificial release process
topics (OpenAlex): Advanced Sensor and Energy Harvesting Materials; Advanced MEMS and NEMS Technologies; 3D IC and TSV technologies
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Sources: Web Of Science, ORCID, NC State University Libraries
Added: November 10, 2021

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