Energy Collaborative

Monolithic 4-Terminal 1.2 kV/20 A 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Integrated JBS Diodes

Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).

1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop

Materials Science Forum, 1004, 872–881.

Natural Gas Conversion to Olefins via Chemical Looping

In Direct Natural Gas Conversion to Value-Added Chemicals (pp. 71–94).

Continuous flow synthesis of phase transition-resistant titania microparticles with tunable morphologies

RSC Advances, 10(14), 8340–8347.

Substituted SrFeO3 as robust oxygen sorbents for thermochemical air separation: correlating redox performance with compositional and structural properties

Physical Chemistry Chemical Physics, 22(16), 8924–8932.

Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing

Cheng, T.-H., Mehrotra, U., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Dynamic and Thermal IOL Test Systems for 3.3kV-6.5kV Die Development

Murthy, P., Mehrotra, U., Yu, W., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Traditional DBC-Based Power Modules for Test in Developing 3.3kV-15kV WBG Devices

Mehrotra, U., Morgan, A., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Creating a Fast Turn Lab to Package Developmental Power Devices with a Packaging Example

Hopkins, D. C. (2020, August). Presented at the NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices, Raleigh, NC.

ParaPower – Leveraging Finite Difference Simulator for Quick Thermal Design

Sinha, S. S., & Hopkins, D. C. (2020, January). Webinar presented at the FREEDM Systems Center & PREES Lab, NC State University, Raleigh, NC.

Ultra-High Density Double-Sided Half Bridge Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2020, July 23). Invited paper presented at the Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC).

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

International Symposium on Microelectronics, 2020(1), 000277–000281.

High Current Medium Voltage Bidirectional Solid State Circuit Breaker using SiC JFET Super Cascode

2020 IEEE Energy Conversion Congress and Exposition (ECCE). Presented at the 2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI.

Lithium Battery Cell Level Fusing with Aluminum Heavy Wire Bonds

International Symposium on Microelectronics, 2020(1), 000009–000014.

Optimized Highly Efficient SSCB Using Organic Substrate Packaging for Electric Vehicle Applications

2020 IEEE Transportation Electrification Conference & Expo (ITEC). Presented at the 2020 IEEE Transportation Electrification Conference & Expo (ITEC).

Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate

2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).

Adaptive Droop Control Method for Suppressing Circulating Currents in DC Microgrids

IEEE OPEN ACCESS JOURNAL OF POWER AND ENERGY, 7, 100–110.

An Accurate Calorimetric Loss Measurement Method for SiC MOSFETs

IEEE Journal of Emerging and Selected Topics in Power Electronics, 8(2), 1644–1656.

Analysis and Design Considerations of a Contactless Magnetic Plug for Charging Electric Vehicles Directly From the Medium-Voltage DC Grid With Arc Flash Mitigation

IEEE Journal of Emerging and Selected Topics in Industrial Electronics, 1(1), 3–13.

Power Conversion With a Magnetically-Geared Permanent Magnet Generator for Low-Speed Wave Energy Converter

IEEE Transactions on Industry Applications, 56(5), 5308–5318.