TY - CONF TI - Power Packaging Techniques with Emphasis on High Current Applications AU - Hopkins, Douglas C. T2 - 18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) C2 - 2003/2/9/ C3 - 18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) CY - Miami Beach, FL. DA - 2003/2/9/ PY - 2003/2/9/ ER - TY - CONF TI - Woodfiber-Plastic Composites Machining Characteristics AU - Saloni, D. AU - Buehlmann, U. AU - Lemaster, R. T2 - 14th The International Conference on Composite Materials, Society of Manufacturing Engineers C2 - 2003/// CY - San Diego, CA DA - 2003/// PY - 2003/7// ER - TY - CONF TI - Comparison between different geometric shapes of engineered abrasives on material removal and surface quality AU - Saloni, D. AU - Carrano, A. AU - Lemaster, R. T2 - Industrial Engineering Research Conference C2 - 2003/// CY - Portland, OR DA - 2003/// PY - 2003/5// ER - TY - SOUND TI - Capacity Modelling in Production and Supply Chain Planning AU - Asmundsson, J. AU - Uzsoy, R. DA - 2003/1// PY - 2003/1// ER - TY - SOUND TI - Modelling in Production and Supply Chain Planning: History and a New Approach AU - Asmundsson, J. AU - Uzsoy, R. DA - 2003/2// PY - 2003/2// ER - TY - SOUND TI - Supply Chain Management: Pursuing a System-Level Understanding AU - Uzsoy, R. DA - 2003/3// PY - 2003/3// ER - TY - CONF TI - Supply Chain Optimization and Protocol Environment (SCOPE) for Rapid Prototyping of Supply Chains AU - Orcun, S. AU - Asmundsson, J. AU - Pekny, J. AU - Rardin, R.L. AU - Uzsoy, R. T2 - Conference on Industrial Engineering and Production Management C2 - 2003/5// C3 - Proceedings of the Conference on Industrial Engineering and Production Management CY - Porto, Portugal DA - 2003/5// PY - 2003/5// ER - TY - JOUR TI - Observations on the interactions among deadlock avoidance policies and dispatching rules in automated manufacturing systems AU - Aytug, H. AU - Barua, A. AU - Lawley, M. AU - Uzsoy, R. T2 - International Journal of Production Research AB - In automated manufacturing systems, deadlock avoidance policies guarantee deadlock-free operation while performance controllers, such as dispatching rules, attempt to achieve performance thresholds. In an automated system, dispatching rules must work within the constraints imposed by the deadlock avoidance policy in order to assure continuing system operation, and thus, the deadlock avoidance logic defines the decision space over which the dispatching rule can work. This paper investigates the interactions that arise between deadlock avoidance flexibility and the effectiveness of dispatching rules in achieving good system performance. Two major findings are that the positive effects of intelligent dispatching are highly influenced by the flexibility of the deadlock avoidance policy, and that a naÿve dispatching rule can sometimes achieve better system performance under an inflexible deadlock avoidance policy. DA - 2003/1// PY - 2003/1// DO - 10.1080/00207540210163955 VL - 41 IS - 1 SP - 81-95 J2 - International Journal of Production Research LA - en OP - SN - 0020-7543 1366-588X UR - http://dx.doi.org/10.1080/00207540210163955 DB - Crossref ER - TY - JOUR TI - Measures of subproblem criticality in decomposition algorithms for shop scheduling AU - Aytug, H. AU - Kempf, K. AU - Uzsoy, R. T2 - International Journal of Production Research AB - Work centre-based decomposition approaches, especially variants of the Shifting Bottleneck algorithm, have been very successful in solving job-shop-scheduling problems. These methods decompose the problem into subproblems involving a single work centre (usually a single machine), which they solve sequentially. We propose new measures of subproblem criticality and show via computational experiments that several of these provide solutions comparable in quality with those obtained from previous work in substantially less central processing unit time. DA - 2003/1// PY - 2003/1// DO - 10.1080/0020754021000037856 VL - 41 IS - 5 SP - 865-882 J2 - International Journal of Production Research LA - en OP - SN - 0020-7543 1366-588X UR - http://dx.doi.org/10.1080/0020754021000037856 DB - Crossref ER - TY - JOUR TI - Measuring Joint Reliability: Applying the Moire Interferometry Technique AU - Ye, H. AU - Basaran, C. AU - Hopkins, D.C. T2 - Advanced Microelectronics Magazine DA - 2003/5// PY - 2003/5// VL - 12 IS - 5 SP - 17–20 ER - TY - JOUR TI - Flip Chip and BGA Solder Joint Reliability AU - Ye, Hua AU - Basaran, Cemal AU - Hopkins, Douglas C. AU - Liu, Heng AU - Cartright, Alexander T2 - Advanced Packaging DA - 2003/5// PY - 2003/5// VL - 12 IS - 5 SP - 17–19 ER - TY - JOUR TI - Measurement of Electrical Current Density Effects in Solder Joints AU - Ye, Hua AU - Hopkins, Douglas C. AU - Basaran, Cemal T2 - Advancing Microelectronics DA - 2003/9// PY - 2003/9// VL - 30 IS - 5 ER - TY - CONF TI - Partitioning digitally programmable power-control for applications to ballasts AU - Hopkins, D.C. AU - Moronski, J. T2 - APEC 2002 - Applied Power Electronics Conference and Exposition AB - The move to full digital control of power electronic circuits has been mixed. This paper describes the procession of technology to embed digital power control in power supply circuits, with particular attention to dimmable fluorescent lighting ballasts. Partitioning of power circuits shows a near optimum match with the evolving system on chip (SoC) approach taken for microcontrollers to provide an integrated digital power control. A performance description of several approaches is given with performance bounds. C2 - 2003/6/25/ C3 - APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335) CY - Dallas, TX DA - 2003/6/25/ PY - 2002/3/10/ DO - 10.1109/apec.2002.989356 PB - IEEE SN - 0780374045 UR - http://dx.doi.org/10.1109/apec.2002.989356 ER - TY - CONF TI - Reliability of solder joints under electrical stressing - strain evolution of solder joints AU - Ye, Hua AU - Basaran, C. AU - Hopkins, D. AU - Cartwright, A. T2 - ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems AB - Damage mechanics of solder interconnects under electrical stressing is an important reliability issue for next generation power electronic packaging as well as for future IC packaging. The high electrical stressing in solder joints leads to electromigration and thus could not be ignored. In this paper, the state-of-the-art research on electromigration in solder joints is reviewed. An experimental electromigration study on solder joints is conducted and results are reported in this paper. The strain field in the solder joints under electrical stressing is measured with Moire Interferometry technique. C2 - 2003/6/25/ C3 - ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) CY - San Diego, CA DA - 2003/6/25/ PY - 2002/5/30/ DO - 10.1109/itherm.2002.1012558 PB - IEEE SN - 0780371526 UR - http://dx.doi.org/10.1109/itherm.2002.1012558 KW - electromigration KW - Moire Interferometry KW - electronic packaging KW - power electronics ER - TY - JOUR TI - Mechanical degradation of microelectronics solder joints under current stressing AU - Ye, Hua AU - Basaran, Cemal AU - Hopkins, Douglas C. T2 - International Journal of Solids and Structures AB - Understanding the mechanical degradation of microelectronic solder joints under high electric current stressing is an important step to develop a damage mechanics model in order to predict the reliability of a solder joint under such loading. In this paper, the experiment results for flip chip solder joints under high current stressing are reported. Nano-indentation tests suggest that mechanical property, e.g. Young’s modulus, degrades in the localized area where void nucleates during current stressing. The experiments also show that thermomigration due to the thermal gradient within solder joint caused by joule heating is significant during current stressing. A three-dimensional coupled thermal electrical finite element analysis shows the existence of a significant thermal gradient in solder joint during current stressing. DA - 2003/12// PY - 2003/12// DO - 10.1016/j.ijsolstr.2003.08.019 VL - 40 IS - 26 SP - 7269-7284 J2 - International Journal of Solids and Structures LA - en OP - SN - 0020-7683 UR - http://dx.doi.org/10.1016/j.ijsolstr.2003.08.019 DB - Crossref ER - TY - JOUR TI - Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing AU - Ye, Hua AU - Basaran, Cemal AU - Hopkins, Douglas T2 - Applied Physics Letters AB - Electromigration of solder joint under high dc current density is known as a reliability concern for the future high-density flip chip packaging and power packaging. Biased mass diffusion within solder joint from cathode to anode under high dc current density is observed in these experiments. In this letter, the experiments on flip chip solder joints under dc current stressing are conducted and thermomigration due to the thermal gradient in the solder joint caused by joule heating is reported. A three-dimensional coupled electric thermal finite-element (FE) simulation of a realistic flip chip module shows the existence of thermal gradient in the solder joint which is high enough to trigger thermomigration. DA - 2003/2/17/ PY - 2003/2/17/ DO - 10.1063/1.1554775 VL - 82 IS - 7 SP - 1045-1047 J2 - Appl. Phys. Lett. LA - en OP - SN - 0003-6951 1077-3118 UR - http://dx.doi.org/10.1063/1.1554775 DB - Crossref ER - TY - JOUR TI - Numerical simulation of stress evolution during electromigration in IC interconnect lines AU - Ye, Hua AU - Basaran, C. AU - Hopkins, D.C. T2 - IEEE Transactions on Components and Packaging Technologies AB - A finite element simulation of stress evolution in thin metal film during electromigration is reported in this paper. The electromigration process is modeled by a coupled diffusion- mechanical partial differential equations (PDEs). The PDEs are implemented with a plane strain formulation and numerically solved with the finite element (FE) method. The evolutions of hydrostatic stress, each component of the deviatoric stress tensor, and Von Mises' stress were simulated for several cases with different line lengths and current densities. Two types of displacement boundary conditions are considered. The simulation results are compared with Korhonen's analytical model and Black and Blech's experimentalesults. DA - 2003/9// PY - 2003/9// DO - 10.1109/tcapt.2003.817877 VL - 26 IS - 3 SP - 673-681 J2 - IEEE Trans. Comp. Packag. Technol. LA - en OP - SN - 1521-3331 UR - http://dx.doi.org/10.1109/tcapt.2003.817877 DB - Crossref KW - deviatoric stress tensor KW - electromigration KW - FE KW - hydrostatic stress KW - PDEs KW - stress evolution ER - TY - JOUR TI - Damage mechanics of microelectronics solder joints under high current densities AU - Ye, Hua AU - Basaran, Cemal AU - Hopkins, Douglas C. T2 - International Journal of Solids and Structures AB - The electromigration damage in flip chip solder joints of eutectic SnPb was studied under current stressing at room temperature with a current density of 1.3 × 104 A/cm2. The height of the solder joints was 100 μm. The mass accumulation near anode side and void nucleation near cathode were observed during current stressing. The nano-indentation test was performed on solder joints for electromigration test. Surface marker movement was used to measure the atomic flux driven by electromigration and to calculate the product of effective charge number and diffusivity, D×Z∗, of the solder at room temperature. The effective charge number can be extracted with the solder diffusivity at room temperature known. Pb phase coarsening was observed during current stressing. DA - 2003/7// PY - 2003/7// DO - 10.1016/s0020-7683(03)00175-6 VL - 40 IS - 15 SP - 4021-4032 J2 - International Journal of Solids and Structures LA - en OP - SN - 0020-7683 UR - http://dx.doi.org/10.1016/s0020-7683(03)00175-6 DB - Crossref KW - solder joint KW - reliability KW - electromigration KW - nano-indentation KW - coarsening ER - TY - JOUR TI - Measurement of high electrical current density effects in solder joints AU - Ye, Hua AU - Hopkins, Douglas C. AU - Basaran, Cemal T2 - Microelectronics Reliability AB - Measuring mechanical implications of high current densities in microelectronic packaging interconnects has always been a challenging goal. Due to small interconnect size this task has typically been accomplished by measuring the change in electrical resistance of the joint. This measurement parameter is global and does not give local mechanical state information. Also, understanding strain evolution in the solder over time is an important step toward developing a damage mechanics model. The real-time, full-field, strain displacement in a eutectic Sn/Pb solder joint during electrical current stressing was measured with Moiré interferometry (Post et al., High sensitivity Moire, Springer, New York, 1994) under in situ conditions. A finite element model simulation for thermal stressing was performed and compared with measured strain. The initial results show that the measured strain was largely due to thermal stressing versus the current density of 1.8 × 102 A/cm2. A second Moiré interferometry experiment with thermal control distinguishes deformation of solder joint due to pure current stressing above 5000 A/cm2. DA - 2003/12// PY - 2003/12// DO - 10.1016/s0026-2714(03)00131-8 VL - 43 IS - 12 SP - 2021-2029 J2 - Microelectronics Reliability LA - en OP - SN - 0026-2714 UR - http://dx.doi.org/10.1016/s0026-2714(03)00131-8 DB - Crossref ER - TY - CONF TI - Advances in step and flash imprint lithography AU - Johnson, S. C. AU - Bailey, T. C. AU - Dickey, M. D. AU - Smith, B. J. AU - Kim, E. K. AU - Jamieson, A. T. AU - Stacey, N. A. AU - Ekerdt, J. G. AU - Willson, C. G. C2 - 2003/// C3 - Proceedings of the society of photo-optical instrumentation engineers DA - 2003/// VL - 5037 SP - 197-202 ER - TY - JOUR TI - Satisfying due-dates in a job shop with sequence-dependent family set-ups AU - Taner, MR AU - Hodgson, TJ AU - King, RE AU - Thoney, KA T2 - INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH AB - This paper addresses job shop scheduling with sequence dependent family set-ups. Based on a simple, single-machine dynamic scheduling problem, state dependent scheduling rules for the single machine problem are developed and tested using Markov Decision Processes. Then, a generalized scheduling policy for the job shop problem is established based on a characterization of the optimal policy. The policy is combined with a 'forecasting' mechanism to utilize global shop floor information for local dispatching decisions. Computational results show that performance is significantly better than that of existing alternative policies. DA - 2003/11/20/ PY - 2003/11/20/ DO - 10.1080/0020754031000149167 VL - 41 IS - 17 SP - 4153-4169 SN - 0020-7543 ER - TY - JOUR TI - Rapid prototyping for treatment of canine limb deformities AU - Harrysson, OLA AU - Cormier, DR AU - Marcellin-Little, DJ AU - Jajal, K T2 - RAPID PROTOTYPING JOURNAL AB - This report describes Rapid Prototyping (RP) ‐aided assessment and preoperative planning for treatment of bilateral multifocal pelvic limb deformities in a 1 year old German Shepherd dog. Computed tomography (CT) scans were acquired on a General Electric CT scanner and converted to solid models using Mimics software from Materialise. Stereolithography patterns were prototyped using QuickCast build style on a SLA ‐190. Room temperature vulcanized silicone molds were constructed and three sets of polyurethane patterns were cast for pre‐surgical planning and rehearsal. The paper compares traditional osteotomy planning procedures using only radiographs and 2D CT images to planning with full‐scale physical biomodels. The biomodels had a clearly beneficial impact on the accuracy of surgery and positively influenced the clinical outcome. DA - 2003/// PY - 2003/// DO - 10.1108/13552540310455647 VL - 9 IS - 1 SP - 37-42 SN - 1355-2546 KW - rapid prototyping KW - medical KW - surgery ER - TY - JOUR TI - Integrated job release and shop-floor scheduling to minimize WIP and meet due-dates AU - Zozom, A AU - Hodgson, TJ AU - King, RE AU - Weintraub, AJ AU - Cormier, D T2 - INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH AB - We address the problem of releasing jobs to the factory floor while meeting delivery dates and minimizing the work-in-process inventory. Heuristic algorithms were developed that used an efficient, detailed shop-floor scheduling model to determine the release times of new jobs. The process starts with the current shop floor conditions and determines the sequencing of both in-process and new jobs on machines in order to minimize the maximum lateness (L max ). The approach is tractable for industrial-sized problems and provides solutions close to a calculated lower bound for WIP. Computational experience is given. DA - 2003/// PY - 2003/// DO - 10.1080/00207540210162992 VL - 41 IS - 1 SP - 31-45 SN - 1366-588X ER -