TY - CONF TI - Preliminary research on Caribbean pine subjected to secondary machining process AU - Saloni, D. AU - Horn, T. AU - Lemaster, R. T2 - Forest Products Society. FPS 59th International Convention C2 - 2005/// CY - Quebec City, Quebec, CA DA - 2005/// PY - 2005/6// ER - TY - CONF TI - Lean manufacturing system and implementation analysis in the North Carolina wood industry AU - Saloni, D. AU - Buehlmann, U. AU - Cardenas, A. AU - Lemaster, R. AU - Meier, W. T2 - Forest Products Society. FPS 59th International Convention C2 - 2005/// CY - Quebec City, Quebec, CA DA - 2005/// PY - 2005/6// ER - TY - CONF TI - Lean Manufacturing potential in the American Wood Industry AU - Saloni, D. AU - Lemaster, R. AU - Cardenas., A. AU - Buehlmann, U. AU - Meier, W. T2 - 5th Annual Lean Management Solutions. Institute of Industrial Engineers C2 - 2005/// CY - Orlando, FL DA - 2005/// PY - 2005/12// ER - TY - CONF TI - Process monitoring applications on abrasive belt loading AU - Saloni, D. AU - Lemaster, R. T2 - Forest Products Society. FPS 59th International Convention C2 - 2005/// CY - Quebec City, CA DA - 2005/// PY - 2005/6// ER - TY - CONF TI - Machining and abrasion performance of woodfiber plastic composites AU - Buehlmann, U. AU - Ndiapi, O. AU - Saloni, D. AU - Lemaster, R. AU - Wolcott, M. T2 - Forest Products Society. FPS 59th International Convention C2 - 2005/// CY - Quebec City, Quebec, CA DA - 2005/// PY - 2005/6// ER - TY - CONF TI - Influence of woodfiber-plastic material composition on machining and abrasion performance AU - Buehlmann, U. AU - Ndiapi, O. AU - Saloni, D. AU - Lemaster, R. AU - Wolcott, M. T2 - Sixth International Conference on wood-fiber plastic composites C2 - 2005/// CY - Madison, WI DA - 2005/// PY - 2005/5// ER - TY - CONF TI - Preliminary research on cleaning characterization on abrasive machining process when wood is used AU - Saloni, D. AU - Lemaster, R. AU - Horn, T. AU - Cardenas, A. T2 - Industrial Engineering Research Conference C2 - 2005/// CY - Atlanta, GA DA - 2005/// PY - 2005/5// ER - TY - CONF TI - A Dynamic Lot Sizing Model with Congestion AU - Uzsoy, R. AU - Hwang, S. T2 - SIAM Conference on Mathematics for Industry C2 - 2005/10// CY - Detroit, MI DA - 2005/10// PY - 2005/10// ER - TY - CHAP TI - Supply Chain Management and Health-Care Delivery: Pursuing a Systems-Level Understanding AU - Uzsoy, R. T2 - Building a Better Delivery System: A New Engineering/Health Care Partnership A2 - Reid, P.P. A2 - Compton, W.D. A2 - Grossman, J.H. A2 - Fanjiang, G. PY - 2005/// PB - National Academies of Engineering ER - TY - CONF TI - Computational Comparison of Linear and Nonlinear Production Planning Formulations AU - Turkseven, C. AU - Uzsoy, R. T2 - INFORMS National Meeting C2 - 2005/11// CY - San Francisco, CA DA - 2005/11// PY - 2005/11// ER - TY - SOUND TI - Modelling Capacity in Production and Supply Chain Planning AU - Uzsoy, R. DA - 2005/4// PY - 2005/4// ER - TY - SOUND TI - Modeling Capacity in Optimization Models for Production Planning: A Review and Some New Developments AU - Uzsoy, R. DA - 2005/4// PY - 2005/4// ER - TY - SOUND TI - Nonlinear Models for Production Planning in Capacitated Production-Inventory Systems AU - Uzsoy, R. DA - 2005/6// PY - 2005/6// ER - TY - SOUND TI - E-business in the Supply Chain: Past, Present and Future AU - Uzsoy, R. DA - 2005/12// PY - 2005/12// ER - TY - JOUR TI - Implementing global factory schedules in the face of stochastic disruptions AU - Barua, A. AU - Raghavan, N. AU - Upasani, A. AU - Uzsoy *, R. T2 - International Journal of Production Research AB - The problem of implementing global factory schedules developed from an optimization-based heuristic in a manufacturing facility with executional uncertainties in the form of machine failures is considered. A simple procedure in which jobs are dispatched on the shop floor is proposed based on their start times in the global schedule is proposed. The performance of the proposed procedure relative to a number of well-known dispatching rules is evaluated using a simulation model of a scaled-down semiconductor wafer fabrication facility. Results indicate that the procedure combining the global schedule and dispatching outperforms the benchmark dispatching rules in terms of several performance measures as long as the level of variability in the system is compatible with the frequency of rescheduling. DA - 2005/2/15/ PY - 2005/2/15/ DO - 10.1080/00207540412331282024 VL - 43 IS - 4 SP - 793-818 J2 - International Journal of Production Research LA - en OP - SN - 0020-7543 1366-588X UR - http://dx.doi.org/10.1080/00207540412331282024 DB - Crossref KW - decomposition heuristics KW - rescheduling KW - global schedules KW - semiconductor manufacturing KW - dispatching KW - simmulation ER - TY - CONF TI - Implementing Digital Power Control In Automotive Alternators AU - Thondapu, C. AU - Hopkins, D.C. AU - Holguin, G. T2 - Digital Power Forum C2 - 2005/// CY - Boston MA DA - 2005/// PY - 2006/9/12/ ER - TY - JOUR TI - Flip chip solder joint failure modes AU - Basaran, C. AU - Ye, H. AU - Hopkins, D.C. AU - Frear, D. AU - Lin, J.K. T2 - Advanced Packaging DA - 2005/10// PY - 2005/10// VL - 14 IS - 10 SP - 14–19 ER - TY - CONF TI - Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing AU - Ye, Hua AU - Basaran, C. AU - Hopkins, D.C. AU - Lin, Minghui T2 - 2005 55th Electronic Components and Technology Conference AB - In this paper, Moire interferometry technique is used to measure the in-situ displacement evolution of lead-free solder joint under electric current stressing. Large deformation was observed in solder joint under high density (10/sup 4/A/cm/sup 2/) current stressing. The deformation was found to be due to electromigration in the solder joint. An electromigration constitutive model is developed to simulate deformation of lead-free solder joint under current stressing. The simulation predicts reasonably close displacements results to Moire interferometry experimental results in both spatial distribution and time history evolution, which indicates that the electromigration model is reasonably good for predicting the mechanical behavior of lead-free solder alloy under electric current stressing. This is the first part of the papers reporting the deformation of solder joint under current stressing. More experimental results are reported in the second paper. C2 - 2005/7/27/ C3 - Proceedings Electronic Components and Technology, 2005. ECTC '05. DA - 2005/7/27/ DO - 10.1109/ectc.2005.1441975 PB - IEEE SN - 0780389069 UR - http://dx.doi.org/10.1109/ectc.2005.1441975 DB - Crossref ER - TY - JOUR TI - Three-Dimensional Reconstruction for Medical-CAD Modeling AU - Starly, B. AU - Fang, Z. AU - Sun, W. AU - Shokoufandeh, A. AU - Regli, W. T2 - Computer-Aided Design and Applications AB - AbstractCAD has been traditionally used to assist in engineering design and modeling for representation, analysis and manufacturing. Advances in Information Technology and in Biomedicine have created new uses for CAD with many novel and important biomedical applications, particularly in tissue engineering in which the CAD based bio-tissue informatics model provides critical information of tissue biological, biophysical, and biochemical properties for modeling, design, and fabrication of complex tissue substitutes. This paper will present some salient advances of bio-CAD modeling and application in computer-aided tissue engineering, including biomimetic design, analysis, simulation and freeform fabrication of tissue engineered substitutes. An overview of computer-aided tissue engineering will be given. Methodology to generate bio-CAD models from high resolution non-invasive imaging, the medical image process and the 3D reconstruction technique will be described. Enabling state-of-the-art computer programs ... DA - 2005/1// PY - 2005/1// DO - 10.1080/16864360.2005.10738392 VL - 2 IS - 1-4 SP - 431-438 J2 - Computer-Aided Design and Applications LA - en OP - SN - 1686-4360 UR - http://dx.doi.org/10.1080/16864360.2005.10738392 DB - Crossref ER - TY - JOUR TI - Development and benchmarking of an epoch time synchronization method for distributed simulation AU - Rathore, Adityavijay AU - Balaraman, Balaji AU - Zhao, Xiaobing AU - Venkateswaran, Jayendran AU - Son, Young-Jun AU - Wysk, Richard A. T2 - Journal of Manufacturing Systems AB - In this paper, a new epoch time synchronization approach for distributed simulation federates is presented. The approach allows federates in the simulation system to advance their local times at full speed while it is safe to do so. That is, the simulation moves rapidly to the minimum next epoch (interaction) event time, which is calculated using the minimum sojourn time for each federate, and then slows for federation synchronization. The proposed approach is demonstrated using a manufacturing supply chain simulation composed of four distributed federates. Experiments are executed to benchmark the proposed epoch time synchronization method against conventional conservative synchronization methods to show typical improvements for simulation operation. The experimental results reveal that the proposed approach reduces supply chain simulation execution time significantly while maintaining complete accuracy as compared with traditional conservative federation coordination approaches. DA - 2005/1// PY - 2005/1// DO - 10.1016/S0278-6125(05)80008-1 VL - 24 IS - 2 SP - 69-78 J2 - Journal of Manufacturing Systems LA - en OP - SN - 0278-6125 UR - http://dx.doi.org/10.1016/S0278-6125(05)80008-1 DB - Crossref KW - distributed simulation KW - time synchronization KW - look-ahead algorithm KW - supply chain modeling ER - TY - CONF TI - Implementing a pricing mechanism for public logistics networks AU - Kay, M.G. AU - Jain, A. C2 - 2005/// C3 - IIE Annual Conference and Exposition 2005 DA - 2005/// UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-33749254634&partnerID=MN8TOARS ER - TY - JOUR TI - Outbound supply chain network design with mode selection, lead times and capacitated vehicle distribution centers AU - Eskigun, Erdem AU - Uzsoy, Reha AU - Preckel, Paul V. AU - Beaujon, George AU - Krishnan, Subramanian AU - Tew, Jeffrey D. T2 - European Journal of Operational Research AB - Most distribution network design models considered to date have focused on minimizing fixed costs of facility location and transportation costs. Measures of customer satisfaction driven by the operational dynamics such as lead times have seldom been considered. We consider the design of an outbound supply chain network considering lead times, location of distribution facilities and choice of transportation mode. We present a Lagrangian heuristic that gives excellent solution quality in reasonable computational time. Scenario analyses are conducted on industrial data using this algorithm to observe how the supply chain behaves under different parameter values. DA - 2005/8// PY - 2005/8// DO - 10.1016/j.ejor.2003.11.029 VL - 165 IS - 1 SP - 182-206 J2 - European Journal of Operational Research LA - en OP - SN - 0377-2217 UR - http://dx.doi.org/10.1016/j.ejor.2003.11.029 DB - Crossref KW - supply chain KW - network design KW - Lagrangian heuristic KW - capacitated distribution centers ER - TY - JOUR TI - Executing production schedules in the face of uncertainties: A review and some future directions AU - Aytug, Haldun AU - Lawley, Mark A. AU - McKay, Kenneth AU - Mohan, Shantha AU - Uzsoy, Reha T2 - European Journal of Operational Research AB - We review the literature on executing production schedules in the presence of unforeseen disruptions on the shop floor. We discuss a number of issues related to problem formulation, and discuss the functions of the production schedule in the organization and provide a taxonomy of the different types of uncertainty faced by scheduling algorithms. We then review previous research relative to these issues, and suggest a number of directions for future work in this area. DA - 2005/2// PY - 2005/2// DO - 10.1016/j.ejor.2003.08.027 VL - 161 IS - 1 SP - 86-110 J2 - European Journal of Operational Research LA - en OP - SN - 0377-2217 UR - http://dx.doi.org/10.1016/j.ejor.2003.08.027 DB - Crossref KW - production scheduling KW - rescheduling KW - structural control ER - TY - JOUR TI - Short-term capacity allocation problem with tool and setup constraints AU - Akçalı, Elif AU - Üngör, Alper AU - Uzsoy, Reha T2 - Naval Research Logistics AB - Abstract We consider a short‐term capacity allocation problem with tool and setup constraints that arises in the context of operational planning in a semiconductor wafer fabrication facility. The problem is that of allocating the available capacity of parallel nonidentical machines to available work‐in‐process (WIP) inventory of operations. Each machine can process a subset of the operations and a tool setup is required on a machine to change processing from one operation to another. Both the number of tools available for an operation and the number of setups that can be performed on a machine during a specified time horizon are limited. We formulate this problem as a degree‐constrained network flow problem on a bipartite graph, show that the problem is NP‐hard, and propose constant factor approximation algorithms. We also develop constructive heuristics and a greedy randomized adaptive search procedure for the problem. Our computational experiments demonstrate that our solution procedures solve the problem efficiently, rendering the use of our algorithms in real environment feasible. © 2005 Wiley Periodicals, Inc. Naval Research Logistics, 2005 DA - 2005/12// PY - 2005/12// DO - 10.1002/nav.20112 VL - 52 IS - 8 SP - 754-764 J2 - Naval Research Logistics LA - en OP - SN - 0894-069X 1520-6750 UR - http://dx.doi.org/10.1002/nav.20112 DB - Crossref KW - network flows KW - degree constraints KW - approximation algorithms KW - heuristics KW - capacity allocation KW - semiconductor manufacturing ER - TY - JOUR TI - Computer-aided characterization for effective mechanical properties of porous tissue scaffolds AU - Fang, Z. AU - Starly, B. AU - Sun, W. T2 - Computer-Aided Design AB - Performance of various functions of the tissue structure depends on porous scaffold microstructures with specific porosity characteristics that influence the behavior of the incorporated or ingrown cells. Understanding the mechanical properties of porous tissue scaffold is important for its biological and biomechanical tissue engineering application. This paper presents a computer aided characterization approach to evaluate the effective mechanical properties of porous tissue scaffold. An outline of a computer-aided tissue engineering approach for design and fabrication of porous tissue scaffold, procedure of computer-aided characterization and its interface with design model, development of a computational algorithm for finite element implementation and numerical solution of asymptotic homogenization theory is presented. Application of the algorithm to characterize the effective mechanical properties of porous poly-ε-caprolactone scaffold manufactured by precision extruding freeform deposition will also be presented, along with a parametric study of the process and design parameter to the structural properties of tissue scaffold. DA - 2005/1// PY - 2005/1// DO - 10.1016/j.cad.2004.04.002 VL - 37 IS - 1 SP - 65-72 J2 - Computer-Aided Design LA - en OP - SN - 0010-4485 UR - http://dx.doi.org/10.1016/j.cad.2004.04.002 DB - Crossref KW - computer-aided tissue engineering KW - tissue engineering KW - tissue scaffold KW - freeform fabrication KW - effective properties ER - TY - JOUR TI - Creation of a unit block library of architectures for use in assembled scaffold engineering AU - Wettergreen, M.A. AU - Bucklen, B.S. AU - Starly, B. AU - Yuksel, E. AU - Sun, W. AU - Liebschner, M.A.K. T2 - Computer-Aided Design AB - Guided tissue regeneration is gaining importance in the field of orthopaedic tissue engineering as need and technology permits the development of site-specific engineering approaches. Computer Aided Design (CAD) and Finite Element Analysis (FEA) hybridized with manufacturing techniques such as Solid Freeform Fabrication (SFF), is hypothesized to allow for virtual design, characterization, and production of scaffolds optimized for tissue replacement. However, a design scope this broad is not often realized due to limitations in preparing scaffolds both for biological functionality and mechanical longevity. To aid scientists in fabrication of a successful scaffold, we propose characterization and documentation of a library of micro-architectures, capable of being seamlessly merged according to the mechanical properties (stiffness, strength), flow perfusion characteristics, and porosity, determined by the scientist based on application and anatomic location. The methodology is discussed in the sphere of bone regeneration, and examples of catalogued shapes are presented. Similar principles may apply for other organs as well. DA - 2005/9// PY - 2005/9// DO - 10.1016/j.cad.2005.02.005 VL - 37 IS - 11 SP - 1141-1149 J2 - Computer-Aided Design LA - en OP - SN - 0010-4485 UR - http://dx.doi.org/10.1016/j.cad.2005.02.005 DB - Crossref KW - rapid prototyping KW - tissue engineering KW - computer-aided designs KW - scaffolds KW - computer-aided tissue engineering (CATE) KW - cellular solids KW - permeability ER - TY - JOUR TI - Direct slicing of STEP based NURBS models for layered manufacturing AU - Starly, B. AU - Lau, A. AU - Sun, W. AU - Lau, W. AU - Bradbury, T. T2 - Computer-Aided Design AB - Direct slicing of CAD models to generate process planning instructions for solid freeform fabrication may overcome inherent disadvantages of using stereolithography format in terms of the process accuracy, ease of file management, and incorporation of multiple materials. This paper will present the results of our development of a direct slicing algorithm for layered freeform fabrication. The direct slicing algorithm was based on a neutral, international standard (ISO 10303) STEP-formatted non-uniform rational B-spline (NURBS) geometric representation and is intended to be independent of any commercial CAD software. The following aspects of the development effort will be presented: (1) determination of optimal build direction based upon STEP-based NURBS models; (2) adaptive subdivision of NURBS data for geometric refinement; and (3) ray-casting slice generation into sets of raster patterns. The development also provides for multi-material slicing and will provide an effective tool in heterogeneous slicing processes. DA - 2005/4// PY - 2005/4// DO - 10.1016/j.cad.2004.06.014 VL - 37 IS - 4 SP - 387-397 J2 - Computer-Aided Design LA - en OP - SN - 0010-4485 UR - http://dx.doi.org/10.1016/j.cad.2004.06.014 DB - Crossref KW - direct slicing KW - solid freeform fabrication KW - layered manufacturing KW - biomodeling KW - medical rapid prototyping ER - TY - JOUR TI - Bio-CAD modeling and its applications in computer-aided tissue engineering AU - Sun, W. AU - Starly, B. AU - Nam, J. AU - Darling, A. T2 - Computer-Aided Design AB - CAD has been traditionally used to assist in engineering design and modeling for representation, analysis and manufacturing. Advances in Information Technology and in Biomedicine have created new uses for CAD with many novel and important biomedical applications, particularly tissue engineering in which CAD based bio-tissue informatics model provides critical information of tissue biological, biophysical, and biochemical properties for modeling, design, and fabrication of complex tissue substitutes. This paper will present some salient advances of bio-CAD modeling and application in computer-aided tissue engineering, including biomimetic design, analysis, simulation and freeform fabrication of tissue engineered substitutes. Overview of computer-aided tissue engineering will be given. Methodology to generate bio-CAD models from high resolution non-invasive imaging, the medical imaging process and the 3D reconstruction technique will be described. Enabling state-of-the-art computer software in assisting 3D reconstruction and in bio-modeling development will be introduced. Utilization of the bio-CAD model for the description and representation of the morphology, heterogeneity, and organizational structure of tissue anatomy, and the generation of bio-blueprint modeling will also be presented. DA - 2005/9// PY - 2005/9// DO - 10.1016/j.cad.2005.02.002 VL - 37 IS - 11 SP - 1097-1114 J2 - Computer-Aided Design LA - en OP - SN - 0010-4485 UR - http://dx.doi.org/10.1016/j.cad.2005.02.002 DB - Crossref KW - CAD Bio-CAD KW - biomodeling KW - computer-aided tissue engineering KW - tissue scaffold design ER - TY - JOUR TI - A Computer-aided Multi-scale Modeling and Direct Fabrication of Bone Structure AU - Fang, Zhibin AU - Starly, Binil AU - Shokoufandeh, Ali AU - Regli, William AU - Sun, Wei T2 - Computer-Aided Design and Applications AB - A multi-scale voxel modeling approach was presented to model the bone structure both in macroscopic and microscopic level. Based on the digital image, the overall macroscopic geometry of the vertebrate was acquired by traditional reverse engineering technology and the microscopic random trabecular network was described by two-point correlation function and the function was then used to reconstruct the bone microstructure. It was shown that the reconstructed model is statistically equivalent to the original structure in the microscopic level and the design intension can be integrated in the developed model. A direct-fabrication process planning was also developed based on the voxel model. The advantage is that there is no need for slicing process in this process which is a costly and essential process for traditional rapid prototype technology. DA - 2005/1// PY - 2005/1// DO - 10.1080/16864360.2005.10738327 VL - 2 IS - 5 SP - 627-635 J2 - Computer-Aided Design and Applications LA - en OP - SN - 1686-4360 UR - http://dx.doi.org/10.1080/16864360.2005.10738327 DB - Crossref ER - TY - JOUR TI - Direct imprinting of dielectric materials for dual Damascene processing AU - Stewart, MD AU - Wetzel, JT AU - Schmid, GM AU - Palmieri, F AU - Thompson, E AU - Kim, EK AU - Wang, D AU - Sotodeh, K AU - Jen, K AU - Johnson, SC AU - Hao, JJ AU - Dickey, MD AU - Nishimura, Y AU - Laine, RM AU - Resnick, DJ AU - Willson, CG T2 - Emerging Lithographic Technologies IX, Pts 1 and 2 AB - Advanced microprocessors require several (eight or more) levels of wiring to carry signal and power from transistor to transistor and to the outside world. Each wiring level must make connection to the levels above and below it through via/contact layers. The dual damascene approach to fabricating these interconnected structures creates a wiring level and a via level simultaneously, thereby reducing the total number of processing steps. However, the dual damascene strategy (of which there are several variations) still requires around twenty process steps per wiring layer. In this work, an approach to damascene processing that is based on step-and-flash imprint lithography (SFIL) is discussed. This imprint damascene process requires fewer than half as many steps as the standard photolithographic dual damascene approach. By using an imprint template with two levels of patterning, a single imprint lithography step can replace two photolithography steps. Further efficiencies are possible if the imprint resist material is itself a functional dielectric material. This work is a demonstration of the compatibility of imprint lithography (specifically SFIL) with back-end-of-line processing using a dual damascene approach with functional materials. DA - 2005/// PY - 2005/// DO - 10.1117/12.599977 VL - 5751 SP - 210-218 SN - 0277-786X KW - SFIL KW - dual damascene KW - nanoimprint lithography KW - multi-tier template KW - interconnect ER - TY - JOUR TI - Vinyl ether formulations for step and flash imprint lithography AU - Kim, EK AU - Stewart, MD AU - Wu, K AU - Palmieri, FL AU - Dickey, MD AU - Ekerdt, JG AU - Willson, CG T2 - JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B AB - Acrylates have been used as patterning monomers in step and flash imprint lithography. Vinyl ether formulations have a lower viscosity, faster curing rate, and higher tensile strength than acrylate formulations. However, the lack of commercially available, silicon-containing vinyl ether monomers has required the synthesis of several new vinyl ethers. An ideal monomer has low viscosity and low vapor pressure. The vapor pressure of silicon-containing vinyl ethers was predicted using the Joback-Reid, Lyderson, and Lee-Kesler methods. BVMDSO (1,1,3,3-tetramethyl-1,3-bis(vinyloxymethyl)-disiloxane) has the lowest viscosity of the synthesized silicon-containing vinyl ethers that meet the volatility requirement for a 80 pl dispense volume. The formulation of BVMDSO, CHDVE (cyclohexanedimethanol divinyl ether), and TEGDVE (triethylene glycol divinyl ether) shows good tensile strength and modulus. The formulation of BVMDSO, CHDVE, TEGDVE, and fluorinated acetate can print a 30 nm line because it has a low separation force and high tensile modulus. DA - 2005/// PY - 2005/// DO - 10.1116/1.2131881 VL - 23 IS - 6 SP - 2967-2971 SN - 2166-2746 ER - TY - JOUR TI - Study of the kinetics of step and flash imprint lithography photopolymerization AU - Dickey, MD AU - Burns, RL AU - Kim, EK AU - Johnson, SC AU - Stacey, NA AU - Willson, CG T2 - AICHE JOURNAL AB - Abstract Step and Flash Imprint Lithography (SFIL) is a promising high‐resolution, yet low‐cost patterning technique that uses a UV induced photopolymerization to replicate features on a patterned template. The SFIL process utilizes an acrylate‐based free radical polymerization, which is inhibited by oxygen. A semiempirical kinetic model is presented that demonstrates the effects of oxygen on SFIL. On the basis of kinetic measurements, dissolved oxygen causes an inhibition period at the onset of exposure that extends the required exposure time. Oxygen inhibition also results in a thin perimeter of under‐cured material surrounding the template due to oxygen diffusion from the ambient during polymerization. The model allows us to study the impact of oxygen on SFIL as a function of various formulation and exposure variables. Methods of limiting the impact of oxygen are presented, such as alternative chemistries and inerting techniques. © 2005 American Institute of Chemical Engineers AIChE J, 2005 DA - 2005/9// PY - 2005/9// DO - 10.1002/aic.10477 VL - 51 IS - 9 SP - 2547-2555 SN - 1547-5905 KW - nanoimprint lithography KW - reaction kinetics KW - photopolymerization ER - TY - JOUR TI - Electric field and dewetting induced hierarchical structure formation in polymer/polymer/air trilayers AU - Leach, KA AU - Gupta, S AU - Dickey, MD AU - Willson, CG AU - Russell, TP T2 - CHAOS AB - Electrohydrodynamics were studied in a trilayer thin film system consisting of two different polymeric layers and air. A polymer with a higher dielectric constant, poly(methyl methacrylate), was sandwiched between air and a lower dielectric constant polymer, polystyrene. An electric field was applied normal to the interfaces. Along with electrostatic forces, dewetting forces were significant at two of the interfaces, namely, the polystyrene/silicon wafer and the polystyrene/poly(methyl methacrylate) interfaces. These two combined forces produce novel closed-cell structures that are difficult to produce by other existing techniques. DA - 2005/12// PY - 2005/12// DO - 10.1063/1.2132248 VL - 15 IS - 4 SP - SN - 1089-7682 ER - TY - JOUR TI - Effects of etch barrier densification on step and flash imprint lithography AU - Johnson, S AU - Burns, R AU - Kim, EK AU - Dickey, M AU - Schmid, G AU - Meiring, J AU - Burns, S AU - Willson, CG AU - Convey, D AU - Wei, Y AU - Fejes, P AU - Gehoski, K AU - Mancini, D AU - Nordquist, K AU - Dauksher, WJ AU - Resnick, DJ T2 - JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B AB - Previous work with the mechanical properties of step and flash imprint lithography etch barrier materials has shown bulk volumetric shrinkage trends that could impact imprinted feature dimensions and profile. This article uses mesoscopic and finite element modeling techniques to model the behavior of the etch barrier during polymerization. Model results are then compared to cross section images of template and etch barrier. Volumetric shrinkage is seen to impact imprinted feature profiles largely as a change in feature height. DA - 2005/// PY - 2005/// DO - 10.1116/1.2102971 VL - 23 IS - 6 SP - 2553-2556 SN - 1071-1023 ER - TY - JOUR TI - Abrasive machining process characterization on material removal rate, final surface texture, and power consumption for wood AU - Saloni, D. E. AU - Lemaster, R. L. AU - Jackson, S. D. T2 - Forest Products Journal DA - 2005/// PY - 2005/// VL - 55 IS - 12 SP - 35-41 ER -