Center for Additive Manufacturing and Logistics - 1998

Hopkins, D. C., & Pitarressi, J. M. (1998). Thermal Impedance and Induced Stress in a Power Package Due to Variation in Layer Thickness. International Journal of Microcircuits and Electronic Packaging.

Hopkins, D. C., O’Mathuna, S. C., & Alderman, A. N. (1998). A Four-Dimensional Road-Mapping Framework for Power Packaging Technology. Proceedings of the 1998 IMAPS International Symposium on Microelectronics. Presented at the 1998 International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Diego, CA.

Hopkins, D. C., Pitarressi, J. M., & Karker, J. A. (1998). Systems Design Considerations for Using a Direct-Attached-Ceramic MMC Power Package. International Journal on Microelectronics Reliability.

Huang, J. C. C., Culbreth, C. T., Joines, J. A., King, R. E., & Hodgson, T. J. (1998). Decision support system for lumber procurement and dry kiln scheduling. Forest Products Journal, 48(9), 51–59.

Janet, J. A., White, M. W., Kay, M. G., Sutton, J. C., & Brickley, J. J. (1998). Fusing a hyper-ellipsoid clustering Kohonen network with the Julier-Uhlmann-Kalman filter for autonomous mobile robot map building and tracking. Proceedings - IEEE International Conference on Robotics and Automation, 2, 1405–1410. https://doi.org/10.1109/ROBOT.1998.677301

Seifert, R. W., Kay, M., & Wilson, J. R. (1998). Evaluation of AGV routeing strategies using hierarchical simulation. International Journal of Production Research, 36(7), 1961–1976. https://doi.org/10.1080/002075498193057