Center for Additive Manufacturing and Logistics - 2002

Bowers, J. S., Hopkins, D. C., & Sarjeant, W. J. (2002). Packaging issues for next generation high voltage, high temperature power electronic modules. Proceedings of APEC 97 - Applied Power Electronics Conference. Presented at the APEC 97 - Applied Power Electronics Conference, Atlanta, GA. https://doi.org/10.1109/apec.1997.581483

Bowers, J. S., Hopkins, D. C., & Sarjeant, W. J. (2002). Power packaging of a 12 kV, 240°C passive electronic module. APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA. https://doi.org/10.1109/apec.1998.647736

Craig, A. H., Hopkins, D. C., & Driscoll, J. C. (2002). A high speed pulser thyristor. APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA. https://doi.org/10.1109/apec.1998.653980

Hopkins, D. C., & Bowers, J. S. (2002). Characterization of advanced materials for high voltage/high temperature power electronics packaging. APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181). Presented at the 16th Annual Applied Power Electronics Conference - APEC 2001, Anaheim, CA. https://doi.org/10.1109/apec.2001.912498

Hopkins, D. C., & Root, D. W. (2002). Synthesis of a new class of converters that utilize energy recirculation. Proceedings of 1994 Power Electronics Specialist Conference - PESC'94. Presented at the 1994 Power Electronics Specialist Conference - PESC'94, Taipei, Taiwan. https://doi.org/10.1109/pesc.1994.373830

Hopkins, D. C., Mathuna, S. C. O., Alderman, A. N., & Flannery, J. (2002). A framework for developing power electronics packaging. APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA. https://doi.org/10.1109/apec.1998.647663

Jacobsen, J. B., & Hopkins, D. C. (2002). Optimally selecting packaging technologies and circuit partitions based on cost and performance. APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058). Presented at the APEC 2000 - Applied Power Electronics Conference, New Orleans, LA. https://doi.org/10.1109/apec.2000.826079

Joines, J. A., & Kay, M. G. (2002). Hybrid genetic algorithms and random linkage. Proceedings of the 2002 Congress on Evolutionary Computation, CEC 2002, 2, 1733–1738. https://doi.org/10.1109/CEC.2002.1004504

Joines, J. A., Gupta, D., Gokce, M. A., King, R. E., & Kay, M. G. (2002). Supply chain multi-objective simulation optimization. Winter Simulation Conference Proceedings, 2, 1306–1314.

King, R. E., Brain, L. A. C., & Thoney, K. A. (2002). Control of yarn inventory for a cotton spinning plant: part 1: Uncorrelated demand. Journal of Textile and Apparel Management, 2(2).

King, R. E., Brain, L. A. C., & Thoney, K. A. (2002). Control of yarn inventory for a cotton spinning plant: part 2: Correlated demand and seasonality. Journal of Textile and Apparel Management, 2(2).

King, R. E., Moon, W. K., Nuttle, H. L. W., & Thoney, K. A. (2002). Case Study Analysis of Inventory Stocking Policies to Support Replenishment: A Supply-chain Perspective. Journal of the Textile Institute, 93(3), 25–35. https://doi.org/10.1080/00405000208658356

Mattila, H., King, R., & Ojala, N. (2002). Retail performance measures for seasonal fashion. Journal of Fashion Marketing and Management: An International Journal, 6(4), 340–351. https://doi.org/10.1108/13612020210448637

Thoney, K. A., Hodgson, T., King, R., Taner, M. R., & Wilson, A. D. (2002). Satisfying due-dates in large multi-factory supply chains. IIE Transactions, 34(9), 803–811. https://doi.org/10.1080/07408170208928913

Ye, H., Basaran, C., & Hopkins, D. (2002). Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement. SPIE proceedings series, 4828, 231–236. SPIE: Bellingham, Washington.

Ye, H., Basaran, C., & Hopkins, D. (2002). Mechanical Implications of High Current Densities in Flip Chip Solder Joints. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2002 International Mechanical Engineering Congress and Exposition. https://doi.org/10.1115/imece2002-33650

Ye, H., Hopkins, D. C., & Basaran, C. (2002). Measurement and Effects of High Electrical Current Stress in Solder Joints. Proceedings of the 35th International Symposium on Microelectronics, 427–432.