Center for Additive Manufacturing and Logistics - 2003 Hopkins, D. C. (2003). Power Packaging Techniques with Emphasis on High Current Applications. 18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Miami Beach, FL. Saloni, D., Buehlmann, U., & Lemaster, R. (2003). Woodfiber-Plastic Composites Machining Characteristics. Presented at the 14th The International Conference on Composite Materials, Society of Manufacturing Engineers, San Diego, CA. Saloni, D., Carrano, A., & Lemaster, R. (2003). Comparison between different geometric shapes of engineered abrasives on material removal and surface quality. Presented at the Industrial Engineering Research Conference, Portland, OR. Asmundsson, J., & Uzsoy, R. (2003, January). Capacity Modelling in Production and Supply Chain Planning. Presented at the Workshop on Transport Equations in Supply Chains, Transport and Biology, Arizona State University. Asmundsson, J., & Uzsoy, R. (2003, February). Modelling in Production and Supply Chain Planning: History and a New Approach. Presented at the Workshop on Supply Chain Management, University of Florida, Gainesville, FL. Uzsoy, R. (2003, March). Supply Chain Management: Pursuing a System-Level Understanding. Presented at the Workshop on Engineering the Health Care System, National Academy of Engineering, Washington, DC. Orcun, S., Asmundsson, J., Pekny, J., Rardin, R. L., & Uzsoy, R. (2003). Supply Chain Optimization and Protocol Environment (SCOPE) for Rapid Prototyping of Supply Chains. Proceedings of the Conference on Industrial Engineering and Production Management. Presented at the Conference on Industrial Engineering and Production Management, Porto, Portugal. Aytug, H., Barua, A., Lawley, M., & Uzsoy, R. (2003). Observations on the interactions among deadlock avoidance policies and dispatching rules in automated manufacturing systems. International Journal of Production Research, 41(1), 81–95. https://doi.org/10.1080/00207540210163955 Aytug, H., Kempf, K., & Uzsoy, R. (2003). Measures of subproblem criticality in decomposition algorithms for shop scheduling. International Journal of Production Research, 41(5), 865–882. https://doi.org/10.1080/0020754021000037856 Ye, H., Basaran, C., & Hopkins, D. C. (2003). Measuring Joint Reliability: Applying the Moire Interferometry Technique. Advanced Microelectronics Magazine, 12(5), 17–20. Ye, H., Basaran, C., Hopkins, D. C., Liu, H., & Cartright, A. (2003). Flip Chip and BGA Solder Joint Reliability. Advanced Packaging, 12(5), 17–19. Ye, H., Hopkins, D. C., & Basaran, C. (2003). Measurement of Electrical Current Density Effects in Solder Joints. Advancing Microelectronics, 30(5). Hopkins, D. C., & Moronski, J. (2003). Partitioning digitally programmable power-control for applications to ballasts. APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX. https://doi.org/10.1109/apec.2002.989356 Ye, H., Basaran, C., Hopkins, D., & Cartwright, A. (2003). Reliability of solder joints under electrical stressing - strain evolution of solder joints. ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA. https://doi.org/10.1109/itherm.2002.1012558 Ye, H., Basaran, C., & Hopkins, D. C. (2003). Mechanical degradation of microelectronics solder joints under current stressing. International Journal of Solids and Structures, 40(26), 7269–7284. https://doi.org/10.1016/j.ijsolstr.2003.08.019 Ye, H., Basaran, C., & Hopkins, D. (2003). Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing. Applied Physics Letters, 82(7), 1045–1047. https://doi.org/10.1063/1.1554775 Ye, H., Basaran, C., & Hopkins, D. C. (2003). Numerical simulation of stress evolution during electromigration in IC interconnect lines. IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681. https://doi.org/10.1109/tcapt.2003.817877 Ye, H., Basaran, C., & Hopkins, D. C. (2003). Damage mechanics of microelectronics solder joints under high current densities. International Journal of Solids and Structures, 40(15), 4021–4032. https://doi.org/10.1016/s0020-7683(03)00175-6 Ye, H., Hopkins, D. C., & Basaran, C. (2003). Measurement of high electrical current density effects in solder joints. Microelectronics Reliability, 43(12), 2021–2029. https://doi.org/10.1016/s0026-2714(03)00131-8 Johnson, S. C., Bailey, T. C., Dickey, M. D., Smith, B. J., Kim, E. K., Jamieson, A. T., … Willson, C. G. (2003). Advances in step and flash imprint lithography. Proceedings of the society of photo-optical instrumentation engineers, 5037, 197–202. Taner, M. R., Hodgson, T. J., King, R. E., & Thoney, K. A. (2003). Satisfying due-dates in a job shop with sequence-dependent family set-ups. INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, 41(17), 4153–4169. https://doi.org/10.1080/0020754031000149167 Harrysson, O. L. A., Cormier, D. R., Marcellin-Little, D. J., & Jajal, K. (2003). Rapid prototyping for treatment of canine limb deformities. RAPID PROTOTYPING JOURNAL, Vol. 9, pp. 37–42. https://doi.org/10.1108/13552540310455647 Zozom, A., Hodgson, T. J., King, R. E., Weintraub, A. J., & Cormier, D. (2003). Integrated job release and shop-floor scheduling to minimize WIP and meet due-dates. INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, 41(1), 31–45. https://doi.org/10.1080/00207540210162992