Center for Additive Manufacturing and Logistics - 2004

Basaran, C., Ye, H., & Hopkins, D. C. (2004). Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation. Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.

Basaran, C., Ye, H., Hopkins, D. C., Frear, D., & Lin, J. K. (2004). Failure Modes of Flip Chip Solder Joints Under High Electric Current Density. Journal of Electronic Packaging, 127(2), 157–163. https://doi.org/10.1115/1.1898338

Burns, R. L., Johnson, S. C., Schmid, G. M., Kim, E. K., Dickey, M., Meiring, J., … Resnick, D. J. (2004). Mesoscale modeling for SFIL simulating polymerization kinetics and densification. Proceedings of the society of photo-optical instrumentation engineers, 5374, 348–360. https://doi.org/10.1117/12.536216

Dickey, M. D., & Willson, C. G. (2004). Effects of oxygen on Step and Flash Imprint Lithography photopolymerization kinetics. Polymeric Materials Science and Engineering, 90, 24–25.

Dickey, M. D., Collister, E., Kim, E. K., & Willson, C. G. (2004). Tailoring photopolymerization materials for nanotechnology. Polymer Preprints (American Chemical Society, Division of Polymer Chemistry, 45(2), 126–127.

Frank, M. C., Wysk, R. A., & Joshi, S. B. (2004). Rapid planning for CNC milling—A new approach for rapid prototyping. Journal of Manufacturing Systems, 23(3), 242–255. https://doi.org/10.1016/S0278-6125(04)80037-2

Johnson, S., Burns, R., Kim, E. K., Schmid, G., Dickey, M., Meiring, J., … Resnick, D. J. (2004). Step and flash imprint lithography modeling and process development. Journal of Photopolymer Science and Technology, 17(3), 417–419. https://doi.org/10.2494/photopolymer.17.417

Kay, M. G., & Jain, A. (2004). Pricing a public logistics network. IIE Annual Conference and Exhibition 2004, 439.

Kulvatunyou, B., Wysk, R. A., Cho, H., & Jones, A. (2004). Integration framework of process planning based on resource independent operation summary to support collaborative manufacturing. International Journal of Computer Integrated Manufacturing, 17(5), 377–393. https://doi.org/10.1080/09511920310001607104

Nam, J., Starly, B., Darling, A., & Sun, W. (2004). Computer Aided Tissue Engineering for Modeling and Design of Novel Tissue Scaffolds. Computer-Aided Design and Applications, 1(1-4), 633–640. https://doi.org/10.1080/16864360.2004.10738308

Ramakrishnan, S., Wysk, R. A., & Prabhu, V. V. (2004). Prediction of process parameters for intelligent control of tunnel freezers using simulation. Journal of Food Engineering, 65(1), 23–31. https://doi.org/10.1016/j.jfoodeng.2003.05.001

Stanfield, P. M., Wilson, J. R., & King, R. E. (2004). Flexible modelling of correlated operation times with application in product-reuse facilities. International Journal of Production Research, 42(11), 2179–2196. https://doi.org/10.1080/0020754042000203903

Sun, W., Darling, A., Starly, B., & Nam, J. (2004). Computer-aided tissue engineering: overview, scope and challenges. Biotechnology and Applied Biochemistry, 39(1), 29. https://doi.org/10.1042/ba20030108

Sun, W., Starly, B., Darling, A., & Gomez, C. (2004). Computer-aided tissue engineering: application to biomimetic modelling and design of tissue scaffolds. Biotechnology and Applied Biochemistry, 39(1), 49. https://doi.org/10.1042/ba20030109

Wilson, A. D., King, R. E., & Hodgson, T. J. (2004). Scheduling non-similar groups on a flow line: multiple group setups. Robotics and Computer-Integrated Manufacturing, 20(6), 505–515. https://doi.org/10.1016/j.rcim.2004.07.002

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Deformation of solder joint under current stressing and numerical simulation––I. International Journal of Solids and Structures, 41(18-19), 4939–4958. https://doi.org/10.1016/j.ijsolstr.2004.04.002

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Deformation of solder joint under current stressing and numerical simulation––II. International Journal of Solids and Structures, 41(18-19), 4959–4973. https://doi.org/10.1016/j.ijsolstr.2004.04.003

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Mechanical Implications of High Current Densities in Flip-chip Solder Joints. International Journal of Damage Mechanics, 13(4), 335–345. https://doi.org/10.1177/1056789504044282

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing. International Journal of Solids and Structures, 41(9-10), 2743–2755. https://doi.org/10.1016/j.ijsolstr.2003.12.001

Ye, H., Basaran, C., Hopkins, D. C., Frear, D., & Lin, J.-K. (2004). Damage mechanics of microelectronics solder joints under high current densities. 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV. https://doi.org/10.1109/ectc.2004.1319460