Center for Additive Manufacturing and Logistics - 2004

Basaran, C., Ye, H., & Hopkins, D. C. (2004). Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation. Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.

Basaran, C., Ye, H., Hopkins, D. C., Frear, D., & Lin, J. K. (2004). Failure Modes of Flip Chip Solder Joints Under High Electric Current Density. Journal of Electronic Packaging, 127(2), 157–163. https://doi.org/10.1115/1.1898338

Frank, M. C., Wysk, R. A., & Joshi, S. B. (2004). Rapid planning for CNC milling—A new approach for rapid prototyping. Journal of Manufacturing Systems, 23(3), 242–255. https://doi.org/10.1016/S0278-6125(04)80037-2

Kay, M. G., & Jain, A. (2004). Pricing a public logistics network. IIE Annual Conference and Exhibition 2004, 439.

Kulvatunyou, B., Wysk, R. A., Cho, H., & Jones, A. (2004). Integration framework of process planning based on resource independent operation summary to support collaborative manufacturing. International Journal of Computer Integrated Manufacturing, 17(5), 377–393. https://doi.org/10.1080/09511920310001607104

Ramakrishnan, S., Wysk, R. A., & Prabhu, V. V. (2004). Prediction of process parameters for intelligent control of tunnel freezers using simulation. Journal of Food Engineering, 65(1), 23–31. https://doi.org/10.1016/j.jfoodeng.2003.05.001

Stanfield, P. M., Wilson, J. R., & King, R. E. (2004). Flexible modelling of correlated operation times with application in product-reuse facilities. International Journal of Production Research, 42(11), 2179–2196. https://doi.org/10.1080/0020754042000203903

Uzsoy, R. (2004, April). Modelling Capacity in Production and Supply Chain Planning. Presented at the Department of Industrial Engineering and Management Science, Northwestern University, Evanston, Illinois.

Uzsoy, R. (2004, April). Transportation, Distribution and Logistics in Indiana. Presented at the Indianapolis Chamber of Commerce.

Uzsoy, R. (2004, July). Modelling Capacity in Production and Supply Chain Planning. Presented at the Department of Industrial Engineering and Engineering Management, Hong Kong University of Science and Technology.

Uzsoy, R. (2004, March). Modelling Capacity in Production and Supply Chain Planning. Presented at the Department of Industrial and Manufacturing Systems Engineering, Pennsylvania State University.

Uzsoy, R. (2004, May). Center of Excellence in Competitive Global Logistics. Presented at the Advanced Manufacturing Summit, Purdue University.

Uzsoy, R. (2004, September). Supply Chain Survival Strategies: Eat or Be Eaten. Presented at the Lafayette Business Growth Network, Lafayette, IN.

Uzsoy, R. (2004, September). Transportation, Distribution and Logistics in Indiana. Presented at the 2nd Annual Indiana 21st Century Logistics Summit, Indianapolis, IN.

Wilson, A. D., King, R. E., & Hodgson, T. J. (2004). Scheduling non-similar groups on a flow line: multiple group setups. Robotics and Computer-Integrated Manufacturing, 20(6), 505–515. https://doi.org/10.1016/j.rcim.2004.07.002

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Deformation of solder joint under current stressing and numerical simulation––I. International Journal of Solids and Structures, 41(18-19), 4939–4958. https://doi.org/10.1016/j.ijsolstr.2004.04.002

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Deformation of solder joint under current stressing and numerical simulation––II. International Journal of Solids and Structures, 41(18-19), 4959–4973. https://doi.org/10.1016/j.ijsolstr.2004.04.003

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Mechanical Implications of High Current Densities in Flip-chip Solder Joints. International Journal of Damage Mechanics, 13(4), 335–345. https://doi.org/10.1177/1056789504044282

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing. International Journal of Solids and Structures, 41(9-10), 2743–2755. https://doi.org/10.1016/j.ijsolstr.2003.12.001

Ye, H., Basaran, C., Hopkins, D. C., Frear, D., & Lin, J.-K. (2004). Damage mechanics of microelectronics solder joints under high current densities. 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV. https://doi.org/10.1109/ectc.2004.1319460