Center for Additive Manufacturing and Logistics

Power Electronics Packaging - A Circuit Design Approach

12th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 12th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Atlanta, GA.

Electro-Discharge Consolidation of Atomized High Strength Aluminum Powders

Materials Transactions, JIM, 38(3), 226–231.

Production Engineering

In McGraw-Hill Encyclopedia of Science and Technology (8th ed.). New York: McGraw-Hill.

Decomposition Methods for Scheduling Complex Job Shops

Demirkol, E., & Uzsoy, R. (1997, October). Presented at the INFORMS National Meeting, Atlanta, GA.

Performance of Decomposition Methods for Complex Workshops Under Multiple Criteria

Proceedings of the 21st International Conference on Computers and Industrial Engineering. Presented at the 21st International Conference on Computers and Industrial Engineering, San Juan, PR.

Focusing Maintenance Improvement Efforts in a Wafer Fabrication Facility Operating Under Theory of Constraints

Production and Inventory Management, (Fourth Quarter), 51–57.

Dispatching and Maintenance Management in a Wafer Fab Operating Under Theory of Constraints

Teyner, T., & Uzsoy, R. (1997, January). Presented at the Harris Semiconductor, Melbourne, FL.

Disassembly Configurations and Supply Chain Management for Companies with Product Recovery and Remanufacturing

Uzsoy, R. (1997, September). Presented at the Xerox Corporation, East Rochester, NY.

Supply Chain Management in Electronics Manufacturing with Remanufacturing Capability

Uzsoy, R. (1997, November). Presented at the NSF/Air Force Joint Research Review Workshop, Dayton, OH.

Spare parts inventory management for semiconductor wafer fabrication facilities

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023). Presented at the 1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings.

Decomposition procedures for global scheduling of complex job shops

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium. Presented at the Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium 1997 IEMT Symposium.

Production planning for companies with product recovery and remanufacturing capability

Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment. ISEE-1997. Presented at the 1997 IEEE International Symposium on Electronics and the Environment. ISEE-1997.

MINIMIZING TOTAL WEIGHTED COMPLETION TIME ON A SINGLE BATCH PROCESSING MACHINE

Production and Operations Management, 6(1), 57–73.

Rescheduling on a Single Machine with Part Type Dependent Setup Times and Due Dates

Annals of Operations Research, 70, 93–113.

A Computational Study of Shifting Bottleneck Procedures for Shop Scheduling Problems

Journal of Heuristics, 3(2), 111–137.

Alternative facility layouts for semiconductor wafer fabrication facilities

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 20(2), 152–163.

Rolling horizon procedures for the single machine deterministic total completion time scheduling problem with release dates

Annals of Operations Research, 70, 115–125.

A Tabu search approach to scheduling an automated wet etch station

Journal of Manufacturing Systems, 16(2), 102–116.

Multiobjective stochastic scheduling of job ready times

Annals of Operations Research, 70, 221–239.

Thermal Impedance and Stress in a Power Package Due to Variations in Layer Thickness

SPIE Proceedings Series, 3235, 72–77. SPIE: Bellingham, Washington.