Center for Additive Manufacturing and Logistics

Power Packaging Techniques with Emphasis on High Current Applications

18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Miami Beach, FL.

Woodfiber-Plastic Composites Machining Characteristics

Presented at the 14th The International Conference on Composite Materials, Society of Manufacturing Engineers, San Diego, CA.

Comparison between different geometric shapes of engineered abrasives on material removal and surface quality

Presented at the Industrial Engineering Research Conference, Portland, OR.

Capacity Modelling in Production and Supply Chain Planning

Asmundsson, J., & Uzsoy, R. (2003, January). Presented at the Workshop on Transport Equations in Supply Chains, Transport and Biology, Arizona State University.

Modelling in Production and Supply Chain Planning: History and a New Approach

Asmundsson, J., & Uzsoy, R. (2003, February). Presented at the Workshop on Supply Chain Management, University of Florida, Gainesville, FL.

Supply Chain Management: Pursuing a System-Level Understanding

Uzsoy, R. (2003, March). Presented at the Workshop on Engineering the Health Care System, National Academy of Engineering, Washington, DC.

Supply Chain Optimization and Protocol Environment (SCOPE) for Rapid Prototyping of Supply Chains

Proceedings of the Conference on Industrial Engineering and Production Management. Presented at the Conference on Industrial Engineering and Production Management, Porto, Portugal.

Observations on the interactions among deadlock avoidance policies and dispatching rules in automated manufacturing systems

International Journal of Production Research, 41(1), 81–95.

Measures of subproblem criticality in decomposition algorithms for shop scheduling

International Journal of Production Research, 41(5), 865–882.

Measuring Joint Reliability: Applying the Moire Interferometry Technique

Advanced Microelectronics Magazine, 12(5), 17–20.

Flip Chip and BGA Solder Joint Reliability

Advanced Packaging, 12(5), 17–19.

Measurement of Electrical Current Density Effects in Solder Joints

Advancing Microelectronics, 30(5).

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures, 40(15), 4021–4032.

Measurement of high electrical current density effects in solder joints

Microelectronics Reliability, 43(12), 2021–2029.

Advances in step and flash imprint lithography

Proceedings of the society of photo-optical instrumentation engineers, 5037, 197–202.