Center for Additive Manufacturing and Logistics

Works Published in 2003

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Displaying works 1 - 20 of 23 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2003 conference paper

Power Packaging Techniques with Emphasis on High Current Applications

18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Miami Beach, FL.

By: D. Hopkins

Event: 18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) at Miami Beach, FL. on February 9-13, 2003

Source: NC State University Libraries
Added: July 22, 2023

2003 conference paper

Woodfiber-Plastic Composites Machining Characteristics

Presented at the 14th The International Conference on Composite Materials, Society of Manufacturing Engineers, San Diego, CA.

By: D. Saloni, U. Buehlmann & R. Lemaster

Event: 14th The International Conference on Composite Materials, Society of Manufacturing Engineers at San Diego, CA

Source: NC State University Libraries
Added: May 27, 2022

2003 conference paper

Comparison between different geometric shapes of engineered abrasives on material removal and surface quality

Presented at the Industrial Engineering Research Conference, Portland, OR.

By: D. Saloni, A. Carrano & R. Lemaster

Event: Industrial Engineering Research Conference at Portland, OR

Source: NC State University Libraries
Added: May 27, 2022

2003 speech

Capacity Modelling in Production and Supply Chain Planning

Asmundsson, J., & Uzsoy, R. (2003, January). Presented at the Workshop on Transport Equations in Supply Chains, Transport and Biology, Arizona State University.

By: J. Asmundsson & R. Uzsoy

Event: Workshop on Transport Equations in Supply Chains, Transport and Biology at Arizona State University

Source: NC State University Libraries
Added: May 1, 2022

2003 speech

Modelling in Production and Supply Chain Planning: History and a New Approach

Asmundsson, J., & Uzsoy, R. (2003, February). Presented at the Workshop on Supply Chain Management, University of Florida, Gainesville, FL.

By: J. Asmundsson & R. Uzsoy

Event: Workshop on Supply Chain Management at University of Florida, Gainesville, FL

Source: NC State University Libraries
Added: May 1, 2022

2003 speech

Supply Chain Management: Pursuing a System-Level Understanding

Uzsoy, R. (2003, March). Presented at the Workshop on Engineering the Health Care System, National Academy of Engineering, Washington, DC.

By: R. Uzsoy

Event: Workshop on Engineering the Health Care System at National Academy of Engineering, Washington, DC

Source: NC State University Libraries
Added: May 1, 2022

2003 conference paper

Supply Chain Optimization and Protocol Environment (SCOPE) for Rapid Prototyping of Supply Chains

Proceedings of the Conference on Industrial Engineering and Production Management. Presented at the Conference on Industrial Engineering and Production Management, Porto, Portugal.

By: S. Orcun, J. Asmundsson, J. Pekny, R. Rardin & R. Uzsoy

Event: Conference on Industrial Engineering and Production Management at Porto, Portugal

Source: NC State University Libraries
Added: May 1, 2022

2003 journal article

Observations on the interactions among deadlock avoidance policies and dispatching rules in automated manufacturing systems

International Journal of Production Research, 41(1), 81–95.

By: H. Aytug*, A. Barua*, M. Lawley* & R. Uzsoy*

co-author countries: United States of America 🇺🇸
Sources: Crossref, ORCID
Added: March 6, 2022

2003 journal article

Measures of subproblem criticality in decomposition algorithms for shop scheduling

International Journal of Production Research, 41(5), 865–882.

co-author countries: United States of America 🇺🇸
Sources: Crossref, ORCID
Added: March 5, 2022

2003 journal article

Measuring Joint Reliability: Applying the Moire Interferometry Technique

Advanced Microelectronics Magazine, 12(5), 17–20.

By: H. Ye, C. Basaran & D. Hopkins

Source: NC State University Libraries
Added: October 28, 2021

2003 journal article

Flip Chip and BGA Solder Joint Reliability

Advanced Packaging, 12(5), 17–19.

By: H. Ye, C. Basaran, D. Hopkins, H. Liu & A. Cartright

Source: NC State University Libraries
Added: October 28, 2021

2003 journal article

Measurement of Electrical Current Density Effects in Solder Joints

Advancing Microelectronics, 30(5).

By: H. Ye, D. Hopkins & C. Basaran

Source: NC State University Libraries
Added: October 28, 2021

2003 conference paper

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

By: D. Hopkins* & J. Moronski*

co-author countries: United States of America 🇺🇸

Event: APEC 2002 - Applied Power Electronics Conference and Exposition at Dallas, TX on March 10-14, 2002

Sources: Crossref, ORCID
Added: September 5, 2021

2003 conference paper

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

By: H. Ye, C. Basaran*, D. Hopkins* & A. Cartwright*

co-author countries: United States of America 🇺🇸

Event: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems at San Diego, CA on May 30 - June 1, 2002

author keywords: electromigration; Moire Interferometry; electronic packaging; power electronics
Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

By: H. Ye*, C. Basaran* & D. Hopkins*

co-author countries: United States of America 🇺🇸
Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

By: H. Ye*, C. Basaran* & D. Hopkins*

co-author countries: United States of America 🇺🇸
Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

By: H. Ye, C. Basaran* & D. Hopkins*

co-author countries: United States of America 🇺🇸
author keywords: deviatoric stress tensor; electromigration; FE; hydrostatic stress; PDEs; stress evolution
Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures, 40(15), 4021–4032.

By: H. Ye*, C. Basaran* & D. Hopkins*

co-author countries: United States of America 🇺🇸
author keywords: solder joint; reliability; electromigration; nano-indentation; coarsening
Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Measurement of high electrical current density effects in solder joints

Microelectronics Reliability, 43(12), 2021–2029.

By: H. Ye, D. Hopkins* & C. Basaran

Sources: Crossref, ORCID
Added: September 4, 2021

2003 conference paper

Advances in step and flash imprint lithography

Proceedings of the society of photo-optical instrumentation engineers, 5037, 197–202.

By: S. Johnson, T. Bailey, M. Dickey, B. Smith, E. Kim, A. Jamieson, N. Stacey, J. Ekerdt, C. Willson

Source: NC State University Libraries
Added: August 6, 2018

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