Center for Additive Manufacturing and Logistics

College of Engineering

Works Published in 2003

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2003 conference paper

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

By: D. Hopkins & J. Moronski

Event: APEC 2002 - Applied Power Electronics Conference and Exposition at Dallas, TX on March 10-14, 2002

Sources: Crossref, ORCID
Added: September 5, 2021

2003 conference paper

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

By: H. Ye, C. Basaran, D. Hopkins & A. Cartwright

Event: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems at San Diego, CA on May 30 - June 1, 2002

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures, 40(15), 4021–4032.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Measurement of high electrical current density effects in solder joints

Microelectronics Reliability, 43(12), 2021–2029.

By: H. Ye, D. Hopkins & C. Basaran

Sources: Crossref, ORCID
Added: September 4, 2021

2003 conference paper

Advances in step and flash imprint lithography

Proceedings of the society of photo-optical instrumentation engineers, 5037, 197–202.

By: S. Johnson, T. Bailey, M. Dickey, B. Smith, E. Kim, A. Jamieson, N. Stacey, J. Ekerdt, C. Willson

Source: NC State University Libraries
Added: August 6, 2018

2003 journal article

Satisfying due-dates in a job shop with sequence-dependent family set-ups

International Journal of Production Research, 41(17), 4153–4169.

By: M. Taner, T. Hodgson, R. King & K. Thoney

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2003 journal article

Rapid prototyping for treatment of canine limb deformities

Rapid Prototyping Journal, 9(1), 37–42.

Source: NC State University Libraries
Added: August 6, 2018

2003 journal article

Integrated job release and shop-floor scheduling to minimize WIP and meet due-dates

International Journal of Production Research, 41(1), 31–45.

By: A. Zozom, T. Hodgson, R. King, A. Weintraub & D. Cormier

Sources: NC State University Libraries, ORCID
Added: August 6, 2018