Center for Additive Manufacturing and Logistics

Works Published in 2004

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Displaying works 1 - 20 of 40 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2004 conference paper

Power Packaging Techniques and High Current Applications

19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.

By: D. Hopkins

Event: 19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) at Anaheim, CA on February 22-26, 2004

Source: NC State University Libraries
Added: July 22, 2023

2004 conference paper

Update of abrasive machining research for processing wood products

Presented at the 1st Annual Manufacturing Technology Summit Conference, Society of Manufacturing Engineers, Dearborn, MI.

By: D. Saloni & R. Lemaster

Event: 1st Annual Manufacturing Technology Summit Conference, Society of Manufacturing Engineers at Dearborn, MI

Source: NC State University Libraries
Added: May 27, 2022

2004 conference paper

Abrasive machining process characterization on power consumption when wood is used

Presented at the Industrial Engineering Research Conference, Houston, TX.

By: D. Saloni, R. Lemaster & S. Jackson

Event: Industrial Engineering Research Conference at Houston, TX

Source: NC State University Libraries
Added: May 27, 2022

2004 speech

Modelling Capacity in Production and Supply Chain Planning

Uzsoy, R. (2004, March). Presented at the Department of Industrial and Manufacturing Systems Engineering, Pennsylvania State University.

By: R. Uzsoy

Event: Department of Industrial and Manufacturing Systems Engineering, Pennsylvania State University

Source: NC State University Libraries
Added: May 1, 2022

2004 speech

Modelling Capacity in Production and Supply Chain Planning

Uzsoy, R. (2004, April). Presented at the Department of Industrial Engineering and Management Science, Northwestern University, Evanston, Illinois.

By: R. Uzsoy

Event: Department of Industrial Engineering and Management Science, Northwestern University at Evanston, Illinois

Source: NC State University Libraries
Added: May 1, 2022

2004 speech

Modelling Capacity in Production and Supply Chain Planning

Uzsoy, R. (2004, July). Presented at the Department of Industrial Engineering and Engineering Management, Hong Kong University of Science and Technology.

By: R. Uzsoy

Event: Department of Industrial Engineering and Engineering Management, Hong Kong University of Science and Technology

Source: NC State University Libraries
Added: May 1, 2022

2004 speech

Transportation, Distribution and Logistics in Indiana

Uzsoy, R. (2004, April). Presented at the Indianapolis Chamber of Commerce.

By: R. Uzsoy

Event: Indianapolis Chamber of Commerce

Source: NC State University Libraries
Added: May 1, 2022

2004 speech

Center of Excellence in Competitive Global Logistics

Uzsoy, R. (2004, May). Presented at the Advanced Manufacturing Summit, Purdue University.

By: R. Uzsoy

Event: Advanced Manufacturing Summit, Purdue University

Source: NC State University Libraries
Added: May 1, 2022

2004 speech

Supply Chain Survival Strategies: Eat or Be Eaten

Uzsoy, R. (2004, September). Presented at the Lafayette Business Growth Network, Lafayette, IN.

By: R. Uzsoy

Event: Lafayette Business Growth Network at Lafayette, IN

Source: NC State University Libraries
Added: May 1, 2022

2004 speech

Transportation, Distribution and Logistics in Indiana

Uzsoy, R. (2004, September). Presented at the 2nd Annual Indiana 21st Century Logistics Summit, Indianapolis, IN.

By: R. Uzsoy

Event: 2nd Annual Indiana 21st Century Logistics Summit at Indianapolis, IN

Source: NC State University Libraries
Added: May 1, 2022

2004 conference paper

Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation

Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.

By: C. Basaran, H. Ye & D. Hopkins

Event: 21st International Congress of Theoretical and Applied Mechanics at Warsaw, Poland on August 15-21, 2004

Source: NC State University Libraries
Added: November 4, 2021

2004 conference paper

Damage mechanics of microelectronics solder joints under high current densities

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV.

By: H. Ye*, C. Basaran*, D. Hopkins*, D. Frear* & J. Lin*

co-author countries: United States of America 🇺🇸

Event: 2004 54th Electronic Components and Technology Conference at Las Vegas, NV on June 4, 2004

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

International Journal of Solids and Structures, 41(9-10), 2743–2755.

By: H. Ye, C. Basaran & D. Hopkins*

author keywords: phase coarsening; current stressing; solder joints; electromigration
Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Deformation of solder joint under current stressing and numerical simulation––II

International Journal of Solids and Structures, 41(18-19), 4959–4973.

By: H. Ye, C. Basaran & D. Hopkins*

author keywords: solder joint; electromigration; Moire inteferometry; modeling
Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Deformation of solder joint under current stressing and numerical simulation––I

International Journal of Solids and Structures, 41(18-19), 4939–4958.

By: H. Ye, C. Basaran & D. Hopkins*

author keywords: electromigration; Moire interferometry; solder joint; modeling
Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

International Journal of Damage Mechanics, 13(4), 335–345.

By: H. Ye*, C. Basaran* & D. Hopkins*

co-author countries: United States of America 🇺🇸
author keywords: solder joint; reliability; electromigration; phase coarsening; thermomigration
Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Journal of Electronic Packaging, 127(2), 157–163.

By: C. Basaran*, H. Ye*, D. Hopkins*, D. Frear & J. Lin

co-author countries: United States of America 🇺🇸
author keywords: flip chip; solder joint reliability; electromigration; thermomigration; current stressing; high current density; power electronics; nanoelectronics
Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Scheduling non-similar groups on a flow line: multiple group setups

Robotics and Computer-Integrated Manufacturing, 20(6), 505–515.

By: A. Wilson*, R. King n & T. Hodgson n

co-author countries: United States of America 🇺🇸
author keywords: scheduling; flow shops; heuristics; setup time
Sources: Crossref, ORCID
Added: March 7, 2021

2004 journal article

Integration framework of process planning based on resource independent operation summary to support collaborative manufacturing

International Journal of Computer Integrated Manufacturing, 17(5), 377–393.

By: B. Kulvatunyou*, R. Wysk*, H. Cho* & A. Jones*

co-author countries: Korea (Republic of) 🇰🇷 United States of America 🇺🇸
Source: Crossref
Added: August 28, 2020

2004 journal article

Rapid planning for CNC milling—A new approach for rapid prototyping

Journal of Manufacturing Systems, 23(3), 242–255.

By: M. Frank*, R. Wysk* & S. Joshi*

co-author countries: United States of America 🇺🇸
author keywords: CNC machining; rapid manufacturing; rapid prototyping; process planning; computer-aided manufacturing
Source: Crossref
Added: August 28, 2020

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