College of Engineering
Displaying works 1 - 20 of 40 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2004 conference paper
Power Packaging Techniques and High Current Applications
19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.
Event: 19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) at Anaheim, CA on February 22-26, 2004
2004 conference paper
Update of abrasive machining research for processing wood products
Presented at the 1st Annual Manufacturing Technology Summit Conference, Society of Manufacturing Engineers, Dearborn, MI.
Event: 1st Annual Manufacturing Technology Summit Conference, Society of Manufacturing Engineers at Dearborn, MI
2004 conference paper
Abrasive machining process characterization on power consumption when wood is used
Presented at the Industrial Engineering Research Conference, Houston, TX.
Event: Industrial Engineering Research Conference at Houston, TX
2004 speech
Modelling Capacity in Production and Supply Chain Planning
Uzsoy, R. (2004, March). Presented at the Department of Industrial and Manufacturing Systems Engineering, Pennsylvania State University.
Event: Department of Industrial and Manufacturing Systems Engineering, Pennsylvania State University
2004 speech
Modelling Capacity in Production and Supply Chain Planning
Uzsoy, R. (2004, April). Presented at the Department of Industrial Engineering and Management Science, Northwestern University, Evanston, Illinois.
Event: Department of Industrial Engineering and Management Science, Northwestern University at Evanston, Illinois
2004 speech
Modelling Capacity in Production and Supply Chain Planning
Uzsoy, R. (2004, July). Presented at the Department of Industrial Engineering and Engineering Management, Hong Kong University of Science and Technology.
Event: Department of Industrial Engineering and Engineering Management, Hong Kong University of Science and Technology
2004 speech
Transportation, Distribution and Logistics in Indiana
Uzsoy, R. (2004, April). Presented at the Indianapolis Chamber of Commerce.
Event: Indianapolis Chamber of Commerce
2004 speech
Center of Excellence in Competitive Global Logistics
Uzsoy, R. (2004, May). Presented at the Advanced Manufacturing Summit, Purdue University.
Event: Advanced Manufacturing Summit, Purdue University
2004 speech
Supply Chain Survival Strategies: Eat or Be Eaten
Uzsoy, R. (2004, September). Presented at the Lafayette Business Growth Network, Lafayette, IN.
Event: Lafayette Business Growth Network at Lafayette, IN
2004 speech
Transportation, Distribution and Logistics in Indiana
Uzsoy, R. (2004, September). Presented at the 2nd Annual Indiana 21st Century Logistics Summit, Indianapolis, IN.
Event: 2nd Annual Indiana 21st Century Logistics Summit at Indianapolis, IN
2004 conference paper
Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation
Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.
Event: 21st International Congress of Theoretical and Applied Mechanics at Warsaw, Poland on August 15-21, 2004
2004 conference paper
Damage mechanics of microelectronics solder joints under high current densities
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV.
Event: 2004 54th Electronic Components and Technology Conference at Las Vegas, NV on June 4, 2004
2004 journal article
Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing
International Journal of Solids and Structures, 41(9-10), 2743–2755.
2004 journal article
Deformation of solder joint under current stressing and numerical simulation––II
International Journal of Solids and Structures, 41(18-19), 4959–4973.
2004 journal article
Deformation of solder joint under current stressing and numerical simulation––I
International Journal of Solids and Structures, 41(18-19), 4939–4958.
2004 journal article
Mechanical Implications of High Current Densities in Flip-chip Solder Joints
International Journal of Damage Mechanics, 13(4), 335–345.
2004 journal article
Failure Modes of Flip Chip Solder Joints Under High Electric Current Density
Journal of Electronic Packaging, 127(2), 157–163.
2004 journal article
Scheduling non-similar groups on a flow line: multiple group setups
Robotics and Computer-Integrated Manufacturing, 20(6), 505–515.
2004 journal article
Integration framework of process planning based on resource independent operation summary to support collaborative manufacturing
International Journal of Computer Integrated Manufacturing, 17(5), 377–393.
2004 journal article
Rapid planning for CNC milling—A new approach for rapid prototyping
Journal of Manufacturing Systems, 23(3), 242–255.
