Center for Additive Manufacturing and Logistics

Advanced Power Electronics Packaging High-Current High Temperature Applications

21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), New Orleans, LA.

Analisis de la implementacion de la manufactura esbelta en la industria maderera

Presented at the Solutions Conference / Latin American Track. Institute of Industrial Engineers, Orlando, FL.

Abrasive cleaning analysis when thermal-shock techniques are used

Presented at the Industrial Engineering Research Conference. Institute of Industrial Engineers, Orlando, FL.

Abrasive loading prevention by controlling temperature using thermal-shock techniques

Presented at the Industrial Engineering Research Conference. Institute of Industrial Engineers, Orlando, FL.

Integrating Production Planning and Safety Stock Determination

Uzsoy, R., & Ravindran, A. (2006, November). Presented at the INFORMS National Meeting, Pittsburgh, PA.

Integrated Production Planning and Pricing with Congestion-Prone Production Resources

Upasani, A., & Uzsoy, R. (2006, November). Presented at the INFORMS National Meeting, Pittsburgh, PA.

Multiproduct Dynamic Lot Sizing with Work in Process and Congestion

Hwang, S., & Uzsoy, R. (2006, November). Presented at the INFORMS National Meeting, Pittsburgh, PA.

A Common Modeling Framework for Transportation and Production Planning Problems with Congestion Phenomena

Kalafatas, G., Peeta, S., & Uzsoy, R. (2006, November). Presented at the INFORMS National Meeting, Pittsburgh, PA.

A Genetic Algorithm for a Single Product Network Design Model with Lead Time and Safety Stock Considerations

Sourirajan, K., Ozsen, L., & Uzsoy, R. (2006, November). Presented at the INFORMS National Meeting, Pittsburgh, PA.

A Multi-Product Break-Bulk Network Design Model with Lead Time and Safety Stock Considerations

Sourirajan, K., Ozsen, L., & Uzsoy, R. (2006, November). Presented at the INFORMS National Meeting, Pittsburgh, PA.

From Engineering the System to Engineering Information

Deshmukh, A., & Uzsoy, R. (2006, February). Presented at the Committee on the Next Decade in Industrial Engineering Workshop, Ann Arbor, MI.

Heuristics for Scheduling a Single Machine with Family Dependent Setup Times

Uzsoy, R., & Velasquez, J. D. (2006, November). Presented at the INFORMS National Meeting, Pittsburgh, PA.

Scheduling Engineering and Production Lots in Wafer Fabrication

Crist, K., & Uzsoy, R. (2006, November). Presented at the INFORMS National Meeting, Pittsburgh, PA.

Juggling Tasks: Mine, Yours and Ours...

Mendez, L. I., & Uzsoy, R. (2006, November). Presented at the INFORMS National Meeting, Pittsburgh, PA.

Using System Dynamics Simulations to Compare Capacity Models for Production Planning

Presented at the 2006 Winter Simulation Conference.

A Problem Reduction Approach for Scheduling Semiconductor Wafer Fabrication Facilities

IEEE Transactions on Semiconductor Manufacturing, 19(2), 216–225.

Tractable Nonlinear Production Planning Models for Semiconductor Wafer Fabrication Facilities

IEEE Transactions on Semiconductor Manufacturing, 19(1), 95–111.

Aluminum-Based High-Temperature (>200°C) Packaging for SiC Power Converters

Proceedings 2006 International Symposium on Microelectronics : October 8-12, 2006 : San Diego Convention Center, San Diego, Calif., 734–741. Washington, D.C.: IMAPS.

High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation

High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation. Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. Presented at the Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06., Dallas, TX.

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2006 International Mechanical Engineering Congress and Exposition.