Center for Additive Manufacturing and Logistics

College of Engineering

Works Published in 2012

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2012 conference paper

Printable Packaging for High Power, High Temperature Power Module

Presented at the IEEE Applied Power Electronics Conference, Orlando, FL.

Event: IEEE Applied Power Electronics Conference at Orlando, FL on February 5-9, 2012

Source: NC State University Libraries
Added: October 16, 2021

2012 conference paper

Point Source Thermal Management in Dense Power Modules and Systems

Special session presented at the IEEE Applied Power Electronics Conference, Orlando, FL.

Event: IEEE Applied Power Electronics Conference at Orlando, FL on February 5-9, 2012

Source: NC State University Libraries
Added: October 16, 2021

2012 conference paper

Results for an Al/AlN composite 350°C SiC solid-state circuit breaker module

2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012, Orlando, FL.

By: K. Bhat, Y. Guo, Y. Xu, T. Baltis, D. Hazelmyer & D. Hopkins

Event: 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012 at Orlando, FL on February 5-9, 2012

Sources: Crossref, ORCID
Added: September 5, 2021

2012 journal article

Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power Package

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2012(HITEC), 000361–000372.

By: D. Hopkins, T. Baltis, J. Pitaress & D. Hazelmyer

Sources: Crossref, ORCID
Added: September 5, 2021

2012 journal article

Development of Printed Power Packaging for a High Voltage SiC Module

International Symposium on Microelectronics, 2012(1), 000955–000960.

By: H. Ke & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2012 conference paper

Mean time to failure of SnAgCuNi solder joints under DC

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Presented at the 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

By: C. Basaran, S. Li, D. Hopkins & W. Yao

Event: 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Sources: Crossref, ORCID
Added: September 5, 2021

2012 conference paper

Infinite horizon periodic review perturbed demand model with lead time

62nd IIE Annual Conference and Expo 2012, 540–547.

By: J. Lavin, R. King, A. Vila-Parrish, D. Warsing & S. Ahiska

Source: ORCID
Added: October 23, 2020

2012 conference paper

An inventory model with restricted replenishment opportunities and re-estimated demand

62nd IIE Annual Conference and Expo 2012, 531–539.

By: N. Buch, R. King, A. Vila-Parrish & D. Warsing

Source: ORCID
Added: October 23, 2020

2012 conference paper

Unreliable supplier selection with fixed costs and order constraints

62nd IIE Annual Conference and Expo 2012, 280–289.

By: Y. Wang, D. Warsing, R. King, A. Vila-Parrish & S. Sebnem Ahiska

Source: ORCID
Added: October 23, 2020

2012 journal article

Electrical conductivity of hexagonal periodic lattice structures

Virtual and Physical Prototyping, 7(1), 81–90.

By: V. Kumar, D. Cormier & O. Harrysson

Source: Crossref
Added: February 24, 2020

2012 journal article

The effect speed and replenishment flexibility has on overall costs of sourcing apparel products

Journal of the Textile Institute, 103(6), 604–621.

By: L. Hartman, J. Joines, K. Thoney & R. King

Sources: Crossref, ORCID
Added: February 24, 2020

2012 journal article

Patient-based pharmaceutical inventory management: a two-stage inventory and production model for perishable products with Markovian demand

Health Systems, 1(1), 69–83.

By: A. Vila-Parrish, J. Ivy, R. King & S. Abel

Sources: Crossref, ORCID
Added: February 24, 2020

2012 conference paper

A novel fabrication method for embedding metal structures into polymers for flexible electronics

62nd IIE Annual Conference and Expo 2012, 3212–3221.

By: H. Carrion, S. Joshi, R. Shirwaiker & S. Fonash

Source: ORCID
Added: September 6, 2019

2012 conference paper

A review of emerging industrial and systems engineering trends and future directions in biomanufacturing

62nd IIE Annual Conference and Expo 2012, 2354–2361.

By: Z. Tan & R. Shirwaiker

Source: ORCID
Added: September 6, 2019

2012 conference paper

A process engineering perspective of scaffold fabrication methods in regenerative medicine: A review

62nd IIE Annual Conference and Expo 2012, 3096–3105.

By: G. Kazemi-Tutunchi, C. Wei, R. Shirwaiker & J. Dong

Source: ORCID
Added: September 6, 2019

2012 journal article

Ultrastretchable Fibers with Metallic Conductivity Using a Liquid Metal Alloy Core

Advanced Functional Materials, 23(18), 2308–2314.

By: S. Zhu, J. So, R. Mays, S. Desai, W. Barnes, B. Pourdeyhimi, M. Dickey

Source: ORCID
Added: December 6, 2018

2012 book

Light converts 2D shapes into 3D shapes

SPIE.

By: Y. Liu, J. Genzer & M. Dickey

Source: ORCID
Added: December 6, 2018

2012 journal article

Development of Glucose Sensors Composed of Soft Materials

NC State Undergraduate Research Journal.

By: D. Jain, D. Morales, M. Dickey & O. Velev

Source: ORCID
Added: December 6, 2018

2012 journal article

A Pressure Responsive Fluidic Microstrip Open Stub Resonator Using a Liquid Metal Alloy

IEEE Microwave and Wireless Components Letters, 22(11), 577–579.

By: M. Khan, G. Hayes, S. Zhang, M. Dickey & G. Lazzi

Source: ORCID
Added: December 6, 2018

2012 journal article

Microvascular based self-healing polymeric foam

Polymer, 53, 4231–4240.

By: J. Patrick, N. Sottos & S. White

Source: NC State University Libraries
Added: August 6, 2018