College of Engineering
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2012 conference paper
Printable Packaging for High Power, High Temperature Power Module
Presented at the IEEE Applied Power Electronics Conference, Orlando, FL.
Event: IEEE Applied Power Electronics Conference at Orlando, FL on February 5-9, 2012
2012 conference paper
Point Source Thermal Management in Dense Power Modules and Systems
Special session presented at the IEEE Applied Power Electronics Conference, Orlando, FL.
Event: IEEE Applied Power Electronics Conference at Orlando, FL on February 5-9, 2012
2012 conference paper
Results for an Al/AlN composite 350°C SiC solid-state circuit breaker module
2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012, Orlando, FL.
Event: 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012 at Orlando, FL on February 5-9, 2012
2012 journal article
Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power Package
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2012(HITEC), 000361–000372.
2012 journal article
Development of Printed Power Packaging for a High Voltage SiC Module
International Symposium on Microelectronics, 2012(1), 000955–000960.
2012 conference paper
Mean time to failure of SnAgCuNi solder joints under DC
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Presented at the 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Event: 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
2012 conference paper
Infinite horizon periodic review perturbed demand model with lead time
62nd IIE Annual Conference and Expo 2012, 540–547.
2012 conference paper
An inventory model with restricted replenishment opportunities and re-estimated demand
62nd IIE Annual Conference and Expo 2012, 531–539.
2012 conference paper
Unreliable supplier selection with fixed costs and order constraints
62nd IIE Annual Conference and Expo 2012, 280–289.
2012 journal article
Electrical conductivity of hexagonal periodic lattice structures
Virtual and Physical Prototyping, 7(1), 81–90.
2012 journal article
The effect speed and replenishment flexibility has on overall costs of sourcing apparel products
Journal of the Textile Institute, 103(6), 604–621.
2012 journal article
Patient-based pharmaceutical inventory management: a two-stage inventory and production model for perishable products with Markovian demand
Health Systems, 1(1), 69–83.
2012 conference paper
A novel fabrication method for embedding metal structures into polymers for flexible electronics
62nd IIE Annual Conference and Expo 2012, 3212–3221.
2012 conference paper
A review of emerging industrial and systems engineering trends and future directions in biomanufacturing
62nd IIE Annual Conference and Expo 2012, 2354–2361.
2012 conference paper
A process engineering perspective of scaffold fabrication methods in regenerative medicine: A review
62nd IIE Annual Conference and Expo 2012, 3096–3105.
2012 journal article
Ultrastretchable Fibers with Metallic Conductivity Using a Liquid Metal Alloy Core
Advanced Functional Materials, 23(18), 2308–2314.
2012 book
Light converts 2D shapes into 3D shapes
SPIE.
2012 journal article
Development of Glucose Sensors Composed of Soft Materials
NC State Undergraduate Research Journal.
2012 journal article
A Pressure Responsive Fluidic Microstrip Open Stub Resonator Using a Liquid Metal Alloy
IEEE Microwave and Wireless Components Letters, 22(11), 577–579.
2012 journal article
Microvascular based self-healing polymeric foam
Polymer, 53, 4231–4240.
