Center for Additive Manufacturing and Logistics

3D Packaging for High Density And High Performance GaN-Based Circuits

2015 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), Charlotte, NC.

AIMS- a metal additive-hybrid manufacturing system: System architecture and attributes

43rd North American Manufacturing Research Conference, NAMRC, 43, 273–286.

Design and development of a U.S. logistics model for residential and commercial biomass

Presented at the Sun Grant Regional Conference, Auburn, AL.

A Column Generation Approach for MultipleProduct Dynamic Lot Sizing with Congestion

Kang, Y., Albey, E., & Uzsoy, R. (2015, August). Presented at the International Workshop on Lot Sizing, Haute Etudes Commercial, Montreal, Canada.

Lead time modeling in production planning

Presented at the 2015 Winter Simulation Conference (WSC).

Simulation-based performance assessment of production planning formulations for semiconductor wafer fabrication

Presented at the 2015 Winter Simulation Conference (WSC).

A random keys genetic algorithm for a bicriterion project selection and scheduling problem

International Journal of Planning and Scheduling, 2(2), 110.

Additive Manufacturing In Power Electronics Packaging

Special session presented at the IEEE Applied Power Electronics Conference, Charlotte, NC.

3D Power Electronics Packaging and Additive Manufacturing

Hopkins, D. C. (2015, November). Presented at the 3rd IEEE Workshop on Wide Bandgap Power Devices and Applications, Blacksburg, VA.

Additive Manufacturing (a.k.a. 3D Printing) for Designing Power Electronic Systems

Hopkins, D. C. (2015, October 20). Presented at the Manufacturing Conference 2015 (MFGCON), Raleigh, NC.

Physical Rf Circuit Techniques And The Implications On Future Power Module Design

Morgan, A. J., Hopkins, D. C., & McKeown, M. (2015, May). Presented at the International Microelectronics Assembly & Packaging Society, Northeast Symposium.

The Evolution and Future Development of Power Electronics as an Essential Element of Power Generation/Delivery, Energy Efficiency, and Industrial Automation

Lawrence, R., & Hopkins, D. C. (2015, December 12). Presented at the North Carolina IEEE Power Electronic Society (PELS) Chapter Seminar, Raleigh, NC.

A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode

International Symposium on Microelectronics, 2015(1), 000359–000364.

Analysis of a Downward Substitution Strategy in a Manufacturing/Remanufacturing System

In E. Pinson, F. Valente, & B. Vitoriano (Eds.), Operations Research and Enterprise Systems (pp. 186–198).

Identifying potential bottlenecks in production systems using dual prices from a mathematical programming model

International Journal of Production Research, 54(7), 2000–2018.

AIMS – A Metal Additive-hybrid Manufacturing System: System Architecture and Attributes

Procedia Manufacturing, 1, 273–286.

Novel Materials and Structures Fabricated by Electron Beam Melting

Microscopy and Microanalysis, 21(S3), 461–462.

Biopolymers: Multidimensional Vascularized Polymers using Degradable Sacrificial Templates (Adv. Funct. Mater. 7/2015)

Advanced Functional Materials, 25(7), 1042–1042.

Microfluidics: Recapillarity: Electrochemically Controlled Capillary Withdrawal of a Liquid Metal Alloy from Microchannels (Adv. Funct. Mater. 5/2015)

Advanced Functional Materials, 25(5), 654–654.

Biofabrication of Multimaterial Three-Dimensional Constructs Embedded With Patterned Alginate Strands Encapsulating PC12 Neural Cell Lines

Journal of Nanotechnology in Engineering and Medicine, 6(2).