Center for Additive Manufacturing and Logistics

College of Engineering

Works Published in 2016

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2016 speech

Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond

Presented at the RTP CFO Forum.

Event: RTP CFO Forum on March 4, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 speech

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.

Event: Carolina PCB at McKimmon Center, Raleigh, NC

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules

Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.

By: Y. Xu & D. Hopkins

Event: International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016) at Raleigh, NC on June 13-15, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)

Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.

By: D. Hopkins, Y. Xu, H. Ke & A. Morgan

Event: Electronics Packaging Symp & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics

Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.

By: X. Zhao, B. Gao & D. Hopkins

Event: Electronics Packaging Symposium & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.

By: X. Zhao, H. Ke, Y. Jiang, A. Morgan, Y. Xu & D. Hopkins

Event: 49th International Symposium on Microelectronics at Pasadena, CA on October 10-13, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 journal article

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

By: X. Zhao, H. Ke, Y. Jiang, A. Morgan, Y. Xu & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: X. Zhao, Y. Xu & D. Hopkins

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: B. Gao & D. Hopkins

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 journal article

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

By: X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2016 journal article

Forecasting communications technology products with leading economic indicators

Journal of Business Forecasting, 35(3), 21–23, 26–27.

By: J. Hussein, T. Hodgson, R. King, S. Jackson & K. Thoney Barletta

Source: NC State University Libraries
Added: April 5, 2021

2016 book

Supply chain engineering: Models and applications

In Supply Chain Engineering: Models and Applications (pp. 1–548).

By: A. Ravi Ravindran & D. Warsing

Source: ORCID
Added: October 23, 2020

2016 journal article

Thickness dependency of mechanical properties for thin-walled titanium parts manufactured by Electron Beam Melting (EBM) ®

Additive Manufacturing, 12, 45–50.

By: J. Algardh, T. Horn, H. West, R. Aman, A. Snis, H. Engqvist, J. Lausmaa, O. Harrysson

Source: Crossref
Added: August 28, 2020

2016 journal article

Correction to “Self-Running Liquid Metal Drops that Delaminate Metal Films at Record Velocities”

Correction to “Self-Running Liquid Metal Drops that Delaminate Metal Films at Record Velocities.” ACS Applied Materials & Interfaces, 8(24), 15855–15855.

By: M. Mohammed, R. Sundaresan & M. Dickey

Sources: Crossref, ORCID
Added: January 25, 2020

2016 conference paper

ASTRO-DF: Adaptive sampling trust-region optimization algorithms, heuristics, and numerical experience

2016 Winter Simulation Conference (WSC).

Source: ORCID
Added: October 10, 2019

2016 article

Liquid Metals for Soft and Stretchable Electronics

Stretchable Bioelectronics for Medical Devices and Systems, pp. 3–30.

By: M. Dickey

Source: ORCID
Added: December 6, 2018

2016 journal article

4D Biomimetic Printing

News & Views, Nature Materials.

By: M. Dickey

Source: ORCID
Added: December 6, 2018

2016 journal article

3D printing of liquid metals as fugitive inks for fabrication of 3D microfluidic channels

Lab on a Chip, 16(10), 1812–1820.

By: D. Parekh, C. Ladd, L. Panich, K. Moussa & M. Dickey

Source: ORCID
Added: December 6, 2018

2016 journal article

Drawing liquid metal wires at room temperature

Extreme Mechanics Letters, 7, 55–63.

By: Y. Lin, C. Ladd, S. Wang, A. Martin, J. Genzer, S. Khan, M. Dickey

Source: ORCID
Added: December 6, 2018

2016 journal article

Localized Instabilities of Liquid Metal Films via In-Plane Recapillarity

Advanced Materials Interfaces, 3(23), 1600546.

By: M. Khan, J. Bell & M. Dickey

Source: ORCID
Added: December 6, 2018