Center for Additive Manufacturing and Logistics

College of Engineering

Works Published in 2016

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2016 conference paper

Modelling the Impact of New Product Introductions on Factory Throughput

Manda, A. B., Uzsoy, R., Kempf, K. G., & Kim, S. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

By: A. Manda, R. Uzsoy, K. Kempf & S. Kim

Event: INFORMS National Meeting at Nashville, TN

Source: NC State University Libraries
Added: May 1, 2022

2016 conference paper

Estimating Clearing Functions using Generalized Regression

Gopalswamy, K., & Uzsoy, R. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

By: K. Gopalswamy & R. Uzsoy

Event: INFORMS National Meeting at Nashville, TN

Source: NC State University Libraries
Added: May 1, 2022

2016 conference paper

Modeling the Equitable and Effective Distribution of Food Donations under Stochastic Capacities

Sengul Orgut, I., Ivy, J. S., & Uzsoy, R. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

By: I. Sengul Orgut, J. Ivy & R. Uzsoy

Event: INFORMS National Meeting at Nashville, TN

Source: NC State University Libraries
Added: May 1, 2022

2016 speech

Modeling and Analysis of Semiconductor Supply Chains

Fowler, J. W., Monch, L., & Uzsoy, R. (2016, February). Presented at the Workshop on Modeling the Semiconductor Supply Chain, Schloss Dagstuhl, Germany.

By: J. Fowler, L. Monch & R. Uzsoy

Event: Workshop on Modeling the Semiconductor Supply Chain at Schloss Dagstuhl, Germany

Source: NC State University Libraries
Added: May 1, 2022

2016 speech

Demand Modeling with Forecast Evolution: An Application to Production Planning

Uzsoy, R. (2016, February). Presented at the Fernuniversitat Hagen, Hagen, Germany & University of Wisconsin-Madison.

By: R. Uzsoy

Event: Fernuniversitat Hagen, Hagen, Germany & University of Wisconsin-Madison

Source: NC State University Libraries
Added: May 1, 2022

2016 conference paper

Solving Stochastic Inventory Problems by Integer Programming

Arts, J., Albey, E., Uzsoy, R., de Kok, A. G., & Orcun, S. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

By: J. Arts, E. Albey, R. Uzsoy, A. de Kok & S. Orcun

Event: INFORMS National Meeting at Nashville, TN

Source: NC State University Libraries
Added: May 1, 2022

2016 conference paper

A Systematic Literature Review of Rolling Methods for Production Planning

Wollmann, R. G., de Sampaio, R., & Uzsoy, R. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

By: R. Wollmann, R. de Sampaio & R. Uzsoy

Event: INFORMS National Meeting at Nashville, TN

Source: NC State University Libraries
Added: May 1, 2022

2016 conference paper

Estimating Clearing Functions for Production Resources using Simulation Optimization

Kacar, N. B., & Uzsoy, R. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

By: N. Kacar & R. Uzsoy

Event: INFORMS National Meeting at Nashville, TN

Source: NC State University Libraries
Added: May 1, 2022

2016 conference paper

A Lagrangian Relaxation Approach for a Multiproduct Stochastic Production Planning Problem

Albey, E., Uzsoy, R., & Kempf, K. G. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

By: E. Albey, R. Uzsoy & K. Kempf

Event: INFORMS National Meeting at Nashville, TN

Source: NC State University Libraries
Added: May 1, 2022

2016 conference paper

A Lagrangian Approach for Coordinating Capacity Negotiations in a Semiconductor Firm

Bansal, A., Uzsoy, R., & Kempf K., G. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

By: A. Bansal, R. Uzsoy & G. Kempf K.

Event: INFORMS National Meeting at Nashville, TN

Source: NC State University Libraries
Added: May 1, 2022

2016 speech

Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond

Presented at the RTP CFO Forum.

Event: RTP CFO Forum on March 4, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 speech

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.

Event: Carolina PCB at McKimmon Center, Raleigh, NC

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules

Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.

By: Y. Xu & D. Hopkins

Event: International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016) at Raleigh, NC on June 13-15, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)

Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.

By: D. Hopkins, Y. Xu, H. Ke & A. Morgan

Event: Electronics Packaging Symp & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics

Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.

By: X. Zhao, B. Gao & D. Hopkins

Event: Electronics Packaging Symposium & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.

By: X. Zhao, H. Ke, Y. Jiang, A. Morgan, Y. Xu & D. Hopkins

Event: 49th International Symposium on Microelectronics at Pasadena, CA on October 10-13, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 journal article

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

By: X. Zhao, H. Ke, Y. Jiang, A. Morgan, Y. Xu & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: X. Zhao, Y. Xu & D. Hopkins

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: B. Gao & D. Hopkins

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 journal article

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

By: X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021