Center for Additive Manufacturing and Logistics

Modelling the Impact of New Product Introductions on Factory Throughput

Manda, A. B., Uzsoy, R., Kempf, K. G., & Kim, S. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

Estimating Clearing Functions using Generalized Regression

Gopalswamy, K., & Uzsoy, R. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

Modeling the Equitable and Effective Distribution of Food Donations under Stochastic Capacities

Sengul Orgut, I., Ivy, J. S., & Uzsoy, R. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

Modeling and Analysis of Semiconductor Supply Chains

Fowler, J. W., Monch, L., & Uzsoy, R. (2016, February). Presented at the Workshop on Modeling the Semiconductor Supply Chain, Schloss Dagstuhl, Germany.

Demand Modeling with Forecast Evolution: An Application to Production Planning

Uzsoy, R. (2016, February). Presented at the Fernuniversitat Hagen, Hagen, Germany & University of Wisconsin-Madison.

Solving Stochastic Inventory Problems by Integer Programming

Arts, J., Albey, E., Uzsoy, R., de Kok, A. G., & Orcun, S. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

A Systematic Literature Review of Rolling Methods for Production Planning

Wollmann, R. G., de Sampaio, R., & Uzsoy, R. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

Estimating Clearing Functions for Production Resources using Simulation Optimization

Kacar, N. B., & Uzsoy, R. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

A Lagrangian Relaxation Approach for a Multiproduct Stochastic Production Planning Problem

Albey, E., Uzsoy, R., & Kempf, K. G. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

A Lagrangian Approach for Coordinating Capacity Negotiations in a Semiconductor Firm

Bansal, A., Uzsoy, R., & Kempf K., G. (2016, November). Presented at the INFORMS National Meeting, Nashville, TN.

Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond

Presented at the RTP CFO Forum.

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.

Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules

Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.

A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)

Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.

Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics

Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.

Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.