Center for Additive Manufacturing and Logistics

College of Engineering

Works Published in 2017

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2017 speech

Grid Modernization – FREEDM Systems Center

Presented at the Interagency Advanced Power Group-Electronics Systems Working Group, Tallahassee, FL.

Event: Interagency Advanced Power Group-Electronics Systems Working Group at Tallahassee, FL on January 10-12, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

3D Printing Power Supply in Package Power Supply on Chip versus Discrete Packaging

Panel Discussion presented at the IEEE Applied Power Electronics Conference, Tampa, FL.

Event: IEEE Applied Power Electronics Conference at Tampa, FL on March 26-30, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

Heterogeneous Integration Integrated Power Devices Roadmap

Presented at the Electronics Packaging Symposium and Workshop, Niskayuna, NY.

Event: Electronics Packaging Symposium and Workshop at Niskayuna, NY on September 19-20, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

True 3D Power Packaging - Higher Densities Through Orthogonality

Presented at the ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

By: D. Hopkins & H. Ke

Event: ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK) at San Francisco, CA on August 29 - September 1, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

Characterization of Novel Materials for Thin Flexible Power Substrates for High-Density Power Electronics

Hopkins, D. C., Zhao, X., Jagannadham, K., Reainthippayasakul, W., Lanagan, M. T., Jiang, Y., … Fukawa, Y. (2017, August 29). Keynote presented at the ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

By: D. Hopkins, X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan, Y. Jiang, B. Gao, K. Nishiguchi, Y. Fukawa

Event: ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK) at San Francisco, CA on August 29 - September 1, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 journal article

Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules

International Symposium on Microelectronics, 2017(1), 000312–000317.

By: A. Morgan, X. Zhao, J. Rouse & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies

International Symposium on Microelectronics, 2017(1), 000353–000359.

By: X. Zhao, K. Jagannadham & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications

International Symposium on Microelectronics, 2017(1), 000151–000156.

By: X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors

International Symposium on Microelectronics, 2017(1), 000224–000230.

By: H. Ke, Y. Jiang, A. Morgan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Rheology of nanocellulose-rich aqueous suspensions: A review

BioResources, 12(4), 9556–9661. Retrieved from https://ojs.cnr.ncsu.edu/index.php/BioRes/article/view/BioRes_12_4_9556_Hubbe_Rheology_Nanocellulose_Aqueous_Suspension/5699

By: M. Hubbe, P. Tayeb, M. Joyce, P. Tyagi, M. Kehoe, K. Dimic-Misic, L. Pal

Source: NC State University Libraries
Added: December 4, 2020

2017 journal article

A survey of semiconductor supply chain models part III: master planning, production planning, and demand fulfilment

International Journal of Production Research, 56(13), 4565–4584.

By: L. Mönch, R. Uzsoy & J. Fowler

Source: Crossref
Added: August 28, 2020

2017 journal article

A survey of semiconductor supply chain models part I: semiconductor supply chains, strategic network design, and supply chain simulation

International Journal of Production Research, 56(13), 4524–4545.

By: L. Mönch, R. Uzsoy & J. Fowler

Source: Crossref
Added: August 28, 2020

2017 journal article

Cover Image, Volume 11, Issue 4

Biofuels, Bioproducts and Biorefining, 11(4), i-i.

By: C. de Assis, C. Houtman, R. Phillips, E. Bilek, O. Rojas, L. Pal, M. Peresin, H. Jameel, R. Gonzalez

Sources: Crossref, ORCID
Added: February 24, 2020

2017 journal article

Pre-clinical evaluation of the mechanical properties of a low-stiffness cement-injectable hip stem

Journal of Medical Engineering & Technology, 41(8), 681–691.

By: I. Eldesouky, O. Harrysson, D. Marcellin-Little, H. West & H. El-Hofy

Source: Crossref
Added: February 24, 2020

2017 journal article

Electron beam melted scaffolds for orthopedic applications

Additive Manufacturing, 17, 169–175.

By: I. Eldesouky, O. Harrysson, H. West & H. Elhofy

Source: Crossref
Added: February 24, 2020

2017 journal article

Repeated healing of delamination damage in vascular composites by pressurized delivery of reactive agents

Composites Science and Technology, 151, 1–9.

By: K. Hart, S. Lankford, I. Freund, J. Patrick, B. Krull, E. Wetzel, N. Sottos, S. White

Source: Crossref
Added: February 24, 2020

2017 journal article

Erratum: Corrigendum: Wafer-scale two-dimensional semiconductors from printed oxide skin of liquid metals

Nature Communications, 8(1).

By: B. Carey, J. Ou, R. Clark, K. Berean, A. Zavabeti, A. Chesman, S. Russo, D. Lau ...

Sources: Crossref, ORCID
Added: January 25, 2020

2017 journal article

Sensors: Stretchable Capacitive Sensors of Torsion, Strain, and Touch Using Double Helix Liquid Metal Fibers (Adv. Funct. Mater. 20/2017)

Advanced Functional Materials, 27(20).

By: C. Cooper, K. Arutselvan, Y. Liu, D. Armstrong, Y. Lin, M. Khan, J. Genzer, M. Dickey

Sources: Crossref, ORCID
Added: January 25, 2020

2017 journal article

Sensor Data and Information Fusion to Construct Digital-twins Virtual Machine Tools for Cyber-physical Manufacturing

Procedia Manufacturing, 10, 1031–1042.

By: Y. Cai, B. Starly, P. Cohen & Y. Lee

Sources: Crossref, ORCID
Added: January 25, 2020

2017 journal article

Streaming Machine Generated Data to Enable a Third-Party Ecosystem of Digital Manufacturing Apps

Procedia Manufacturing, 10, 1020–1030.

By: S. Singh, A. Angrish, J. Barkley, B. Starly, Y. Lee & P. Cohen

Sources: Crossref, ORCID
Added: January 25, 2020