Center for Additive Manufacturing and Logistics

College of Engineering

Works Published in 2017

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2017 conference paper

Understanding the Machinability of MDF and HDF

Velarde, G., Saloni, D., & Kamke, F. (2017, October 23). Poster presented at the Wood Composite Center Fall Meeting, Atlanta, GA.

By: G. Velarde, D. Saloni & F. Kamke

Event: Wood Composite Center Fall Meeting at Atlanta, GA on October 23-24, 2017

Source: NC State University Libraries
Added: May 27, 2022

2017 journal article

Management system based on the measurement of temperature and humidity with prediction calculation of the durability of materials in the crawlspace of houses in the southern region of the USA

Tekhné, 20(2), 081–096.

By: D. Saloni, A. Díaz, E. Fajardo, B. Cante & G. Velarde

Source: NC State University Libraries
Added: May 27, 2022

2017 conference paper

Novel Adhesives from Soybean proteins and biopolymer blends

Poster presented at the Wood Composite Center Fall Meeting, Atlanta, GA.

By: D. Saloni, C. Salas & G. Velarde

Event: Wood Composite Center Fall Meeting at Atlanta, GA on October 23-24, 2017

Source: NC State University Libraries
Added: May 21, 2022

2017 journal article

Design and Development of Logistics Models for Residential and Commercial Biomass Pellets for Heat and Power Generation in the U.S.

BioResources, 12(1).

By: U. Lacoa, G. Velarde, M. Kay, E. Blanco & D. Saloni

Sources: Crossref, ORCID
Added: May 11, 2022

2017 article proceedings

An iterative refinement approach to fitting clearing functions to data from simulation models of production systems

Presented at the 2017 Winter Simulation Conference (WSC).

By: K. Gopalswamy & R. Uzsoy

Event: 2017 Winter Simulation Conference (WSC)

Sources: Crossref, ORCID
Added: March 5, 2022

2017 journal article

Lease-Oriented Opportunistic Maintenance for Multi-Unit Leased Systems under Product- Service Paradigm

Journal of Manufacturing Science and Engineering, Transactions of the ASME, 139(7).

Source: ORCID
Added: February 24, 2022

2017 journal article

Multistream sensor fusion-based prognostics model for systems with single failure modes

Reliability Engineering and System Safety, 159, 322–331.

By: X. Fang, K. Paynabar & N. Gebraeel

Source: ORCID
Added: February 24, 2022

2017 journal article

Scalable prognostic models for large-scale condition monitoring applications

IISE Transactions, 49(7), 698–710.

By: X. Fang, N. Gebraeel & K. Paynabar

Source: ORCID
Added: February 24, 2022

2017 article

Image-based prognostics using penalized tensor regression

ArXiv.

By: X. Fang, K. Paynabar & N. Gebraeel

Source: ORCID
Added: February 24, 2022

2017 speech

Grid Modernization – FREEDM Systems Center

Presented at the Interagency Advanced Power Group-Electronics Systems Working Group, Tallahassee, FL.

Event: Interagency Advanced Power Group-Electronics Systems Working Group at Tallahassee, FL on January 10-12, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

3D Printing Power Supply in Package Power Supply on Chip versus Discrete Packaging

Panel Discussion presented at the IEEE Applied Power Electronics Conference, Tampa, FL.

Event: IEEE Applied Power Electronics Conference at Tampa, FL on March 26-30, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

Heterogeneous Integration Integrated Power Devices Roadmap

Presented at the Electronics Packaging Symposium and Workshop, Niskayuna, NY.

Event: Electronics Packaging Symposium and Workshop at Niskayuna, NY on September 19-20, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

True 3D Power Packaging - Higher Densities Through Orthogonality

Presented at the ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

By: D. Hopkins & H. Ke

Event: ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK) at San Francisco, CA on August 29 - September 1, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

Characterization of Novel Materials for Thin Flexible Power Substrates for High-Density Power Electronics

Hopkins, D. C., Zhao, X., Jagannadham, K., Reainthippayasakul, W., Lanagan, M. T., Jiang, Y., … Fukawa, Y. (2017, August 29). Keynote presented at the ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

By: D. Hopkins, X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan, Y. Jiang, B. Gao, K. Nishiguchi, Y. Fukawa

Event: ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK) at San Francisco, CA on August 29 - September 1, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 journal article

Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules

International Symposium on Microelectronics, 2017(1), 000312–000317.

By: A. Morgan, X. Zhao, J. Rouse & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies

International Symposium on Microelectronics, 2017(1), 000353–000359.

By: X. Zhao, K. Jagannadham & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications

International Symposium on Microelectronics, 2017(1), 000151–000156.

By: X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors

International Symposium on Microelectronics, 2017(1), 000224–000230.

By: H. Ke, Y. Jiang, A. Morgan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Rheology of nanocellulose-rich aqueous suspensions: A review

BioResources, 12(4), 9556–9661. Retrieved from https://ojs.cnr.ncsu.edu/index.php/BioRes/article/view/BioRes_12_4_9556_Hubbe_Rheology_Nanocellulose_Aqueous_Suspension/5699

By: M. Hubbe, P. Tayeb, M. Joyce, P. Tyagi, M. Kehoe, K. Dimic-Misic, L. Pal

Source: NC State University Libraries
Added: December 4, 2020

2017 journal article

A survey of semiconductor supply chain models part III: master planning, production planning, and demand fulfilment

International Journal of Production Research, 56(13), 4565–4584.

By: L. Mönch, R. Uzsoy & J. Fowler

Sources: Crossref, ORCID
Added: August 28, 2020