Center for Additive Manufacturing and Logistics

Understanding the Machinability of MDF and HDF

Velarde, G., Saloni, D., & Kamke, F. (2017, October 23). Poster presented at the Wood Composite Center Fall Meeting, Atlanta, GA.

Management system based on the measurement of temperature and humidity with prediction calculation of the durability of materials in the crawlspace of houses in the southern region of the USA

Tekhné, 20(2), 081–096.

Novel Adhesives from Soybean proteins and biopolymer blends

Poster presented at the Wood Composite Center Fall Meeting, Atlanta, GA.

Design and Development of Logistics Models for Residential and Commercial Biomass Pellets for Heat and Power Generation in the U.S.

BioResources, 12(1).

An iterative refinement approach to fitting clearing functions to data from simulation models of production systems

Presented at the 2017 Winter Simulation Conference (WSC).

Lease-Oriented Opportunistic Maintenance for Multi-Unit Leased Systems under Product- Service Paradigm

Journal of Manufacturing Science and Engineering, Transactions of the ASME, 139(7).

Multistream sensor fusion-based prognostics model for systems with single failure modes

Reliability Engineering and System Safety, 159, 322–331.

Scalable prognostic models for large-scale condition monitoring applications

IISE Transactions, 49(7), 698–710.

Image-based prognostics using penalized tensor regression

ArXiv. http://www.scopus.com/inward/record.url?eid=2-s2.0-85092884816&partnerID=MN8TOARS

Grid Modernization – FREEDM Systems Center

Presented at the Interagency Advanced Power Group-Electronics Systems Working Group, Tallahassee, FL.

3D Printing Power Supply in Package Power Supply on Chip versus Discrete Packaging

Panel Discussion presented at the IEEE Applied Power Electronics Conference, Tampa, FL.

Heterogeneous Integration Integrated Power Devices Roadmap

Presented at the Electronics Packaging Symposium and Workshop, Niskayuna, NY.

True 3D Power Packaging - Higher Densities Through Orthogonality

Presented at the ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

Characterization of Novel Materials for Thin Flexible Power Substrates for High-Density Power Electronics

Hopkins, D. C., Zhao, X., Jagannadham, K., Reainthippayasakul, W., Lanagan, M. T., Jiang, Y., … Fukawa, Y. (2017, August 29). Keynote presented at the ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules

International Symposium on Microelectronics, 2017(1), 000312–000317.

Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies

International Symposium on Microelectronics, 2017(1), 000353–000359.

Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications

International Symposium on Microelectronics, 2017(1), 000151–000156.

Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors

International Symposium on Microelectronics, 2017(1), 000224–000230.

Rheology of nanocellulose-rich aqueous suspensions: A review

BioResources, 12(4), 9556–9661. https://ojs.cnr.ncsu.edu/index.php/BioRes/article/view/BioRes_12_4_9556_Hubbe_Rheology_Nanocellulose_Aqueous_Suspension/5699

A survey of semiconductor supply chain models part III: master planning, production planning, and demand fulfilment

International Journal of Production Research, 56(13), 4565–4584.