Center for Additive Manufacturing and Logistics

College of Engineering

Works Published in 2020

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2020 conference paper

Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing

Cheng, T.-H., Mehrotra, U., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

By: T. Cheng, U. Mehrotra & D. Hopkins

Event: Power America Institute Annual Meeting at Raleigh, NC on February 25-27, 2020

Source: NC State University Libraries
Added: September 11, 2021

2020 conference paper

Dynamic and Thermal IOL Test Systems for 3.3kV-6.5kV Die Development

Murthy, P., Mehrotra, U., Yu, W., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

By: P. Murthy, U. Mehrotra, W. Yu & D. Hopkins

Event: Power America Institute Annual Meeting at Raleigh, NC on February 25-27, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 conference paper

Traditional DBC-Based Power Modules for Test in Developing 3.3kV-15kV WBG Devices

Mehrotra, U., Morgan, A., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

By: U. Mehrotra, A. Morgan & D. Hopkins

Event: Power America Institute Annual Meeting at Raleigh, NC on February 25-27, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 speech

Creating a Fast Turn Lab to Package Developmental Power Devices with a Packaging Example

Hopkins, D. C. (2020, August). Presented at the NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices, Raleigh, NC.

Event: NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices at Raleigh, NC on August 3-5, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 speech

ParaPower – Leveraging Finite Difference Simulator for Quick Thermal Design

Sinha, S. S., & Hopkins, D. C. (2020, January). Webinar presented at the FREEDM Systems Center & PREES Lab, NC State University, Raleigh, NC.

By: S. Sinha & D. Hopkins

Event: FREEDM Systems Center & PREES Lab, NC State University at Raleigh, NC on January 24, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 conference paper

Ultra-High Density Double-Sided Half Bridge Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2020, July 23). Invited paper presented at the Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC).

By: D. Hopkins, T. Cheng & U. Mehrotra

Event: Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC) on July 23, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 journal article

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

International Symposium on Microelectronics, 2020(1), 000277–000281.

By: T. Cheng, K. Nishiguchi, Y. Fukawa, B. Baliga, S. Bhattacharya & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2020 conference paper

High Current Medium Voltage Bidirectional Solid State Circuit Breaker using SiC JFET Super Cascode

2020 IEEE Energy Conversion Congress and Exposition (ECCE). Presented at the 2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI.

By: U. Mehrotra, B. Ballard & D. Hopkins

Event: 2020 IEEE Energy Conversion Congress and Exposition (ECCE) at Detroit, MI on October 11-15, 2020

Sources: Crossref, ORCID
Added: September 5, 2021

2020 journal article

Lithium Battery Cell Level Fusing with Aluminum Heavy Wire Bonds

International Symposium on Microelectronics, 2020(1), 000009–000014.

By: U. Mehrotra, A. Brazzle, M. McKeown & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2020 conference paper

Optimized Highly Efficient SSCB Using Organic Substrate Packaging for Electric Vehicle Applications

2020 IEEE Transportation Electrification Conference & Expo (ITEC). Presented at the 2020 IEEE Transportation Electrification Conference & Expo (ITEC).

By: U. Mehrotra, B. Ballard, T. Cheng, B. Baliga, S. Bhattacharya & D. Hopkins

Event: 2020 IEEE Transportation Electrification Conference & Expo (ITEC)

Sources: Crossref, ORCID
Added: September 5, 2021

2020 conference paper

Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate

2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).

By: U. Mehrotra, T. Cheng, A. Kanale, A. Agarwal, K. Han, B. Baliga, S. Bhattacharya, D. Hopkins

Event: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Sources: Crossref, ORCID
Added: September 5, 2021

2020 article

SIMULATION OPTIMIZATION BASED FEATURE SELECTION, A STUDY ON DATA-DRIVEN OPTIMIZATION WITH INPUT UNCERTAINTY

2020 WINTER SIMULATION CONFERENCE (WSC), pp. 2149–2160.

Sources: ORCID, Web Of Science
Added: August 7, 2021

2020 article

A SIMULATION OPTIMIZATION APPROACH FOR MANAGING PRODUCT TRANSITIONS IN MULTISTAGE PRODUCTION LINES

2020 WINTER SIMULATION CONFERENCE (WSC).

Sources: Web Of Science, ORCID
Added: August 7, 2021

2020 journal article

Lighter and Stronger: Cofabricated Electrodes and Variable Stiffness Elements in Dielectric Actuators

ADVANCED INTELLIGENT SYSTEMS, 10.

By: E. Piskarev, J. Shintake, V. Ramachandran, N. Baugh, M. Dickey & D. Floreano

Sources: Web Of Science, ORCID
Added: August 2, 2021

2020 journal article

Witness Box Protocol: Automatic machine identification and authentication in industry 4.0

COMPUTERS IN INDUSTRY, 12.

By: N. Mehdi & B. Starly

Sources: Web Of Science, ORCID
Added: July 19, 2021

2020 journal article

Review: Modeling in Situ Liver Cancer

Annals of Gastroenterology and Digestive Disorders.

Source: ORCID
Added: May 28, 2021

2020 journal article

Biofabricated 3D in vitro model of fibrosis‐induced abnormal hepatoblast/biliary progenitors’ expansion of the developing liver

Bioengineering & Translational Medicine, 12.

By: M. Brovold, D. Keller, M. Devarasetty, A. Dominijanni, R. Shirwaiker & S. Soker

Source: ORCID
Added: May 28, 2021

2020 article

Investigation of Bioplastics for Additive Manufacturing

ADVANCES IN ADDITIVE MANUFACTURING, MODELING SYSTEMS AND 3D PROTOTYPING, pp. 365–376.

By: D. Saloni & N. Mervine

Source: Web Of Science
Added: May 24, 2021

2020 journal article

3D Photoinduced Spatiotemporal Resolution of Cellulose-Based Hydrogels for Fabrication of Biomedical Devices

ACS APPLIED BIO MATERIALS, 3(8), 5007–5019.

Sources: Web Of Science, ORCID
Added: February 1, 2021

2020 journal article

Ultrasound-assisted vat photopolymerization 3D printing of preferentially organized carbon fiber reinforced polymer composites

JOURNAL OF MANUFACTURING PROCESSES, 56, 1340–1343.

Sources: Web Of Science, ORCID
Added: February 1, 2021