Center for Additive Manufacturing and Logistics

Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing

Cheng, T.-H., Mehrotra, U., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Dynamic and Thermal IOL Test Systems for 3.3kV-6.5kV Die Development

Murthy, P., Mehrotra, U., Yu, W., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Traditional DBC-Based Power Modules for Test in Developing 3.3kV-15kV WBG Devices

Mehrotra, U., Morgan, A., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Creating a Fast Turn Lab to Package Developmental Power Devices with a Packaging Example

Hopkins, D. C. (2020, August). Presented at the NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices, Raleigh, NC.

ParaPower – Leveraging Finite Difference Simulator for Quick Thermal Design

Sinha, S. S., & Hopkins, D. C. (2020, January). Webinar presented at the FREEDM Systems Center & PREES Lab, NC State University, Raleigh, NC.

Ultra-High Density Double-Sided Half Bridge Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2020, July 23). Invited paper presented at the Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC).

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

International Symposium on Microelectronics, 2020(1), 000277–000281.

High Current Medium Voltage Bidirectional Solid State Circuit Breaker using SiC JFET Super Cascode

2020 IEEE Energy Conversion Congress and Exposition (ECCE). Presented at the 2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI.

Lithium Battery Cell Level Fusing with Aluminum Heavy Wire Bonds

International Symposium on Microelectronics, 2020(1), 000009–000014.

Optimized Highly Efficient SSCB Using Organic Substrate Packaging for Electric Vehicle Applications

2020 IEEE Transportation Electrification Conference & Expo (ITEC). Presented at the 2020 IEEE Transportation Electrification Conference & Expo (ITEC).

Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate

2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).

SIMULATION OPTIMIZATION BASED FEATURE SELECTION, A STUDY ON DATA-DRIVEN OPTIMIZATION WITH INPUT UNCERTAINTY

2020 WINTER SIMULATION CONFERENCE (WSC), pp. 2149–2160.

A SIMULATION OPTIMIZATION APPROACH FOR MANAGING PRODUCT TRANSITIONS IN MULTISTAGE PRODUCTION LINES

2020 WINTER SIMULATION CONFERENCE (WSC).

Lighter and Stronger: Cofabricated Electrodes and Variable Stiffness Elements in Dielectric Actuators

ADVANCED INTELLIGENT SYSTEMS, 10.

Witness Box Protocol: Automatic machine identification and authentication in industry 4.0

COMPUTERS IN INDUSTRY, 12.

Review: Modeling in Situ Liver Cancer

Annals of Gastroenterology and Digestive Disorders.

Biofabricated 3D in vitro model of fibrosis‐induced abnormal hepatoblast/biliary progenitors’ expansion of the developing liver

Bioengineering & Translational Medicine, 12.

Investigation of Bioplastics for Additive Manufacturing

ADVANCES IN ADDITIVE MANUFACTURING, MODELING SYSTEMS AND 3D PROTOTYPING, pp. 365–376.

3D Photoinduced Spatiotemporal Resolution of Cellulose-Based Hydrogels for Fabrication of Biomedical Devices

ACS APPLIED BIO MATERIALS, 3(8), 5007–5019.

Ultrasound-assisted vat photopolymerization 3D printing of preferentially organized carbon fiber reinforced polymer composites

JOURNAL OF MANUFACTURING PROCESSES, 56, 1340–1343.