Center for Additive Manufacturing and Logistics

Simulation Optimization Library

https://github.com/simopt-admin/simopt

Monolithic 4-Terminal 1.2 kV/20 A 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Integrated JBS Diodes

Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).

1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop

Materials Science Forum, 1004, 872–881.

Evaluation of Electron Beam Powder Bed Fusion Additive Manufacturing of High Purity Copper for Overhang Structures Using In-Situ Real Time Backscatter Electron Monitoring

Procedia Manufacturing, 48, 828–838.

Smooth, Possibly Glossy, and Superior Printing

In Make Paper Products Stand Out. Strategic use of wet end chemical additives (pp. 229–278). Atlanta, GA: TAPPI.

Cryogenic mechanical alloying of aluminum matrix composites for powder bed fusion additive manufacturing

JOURNAL OF COMPOSITE MATERIALS.

Accuracy of three-dimensionally printed animal-specific drill guides for implant placement in canine thoracic vertebrae: A cadaveric study

VETERINARY SURGERY.

Bioplastic Modified with Woodflour for Additive Manufacturing

A Review of Sustainable Materials Used in Thermoplastic Extrusion and Powder Bed Melting Additive Manufacturing

A Lagrangian Approach for Stochastic Multiproduct Production Planning with Forecast Evolution

Proceedings of the International Working Seminar on Production Economics. Presented at the International Working Seminar on Production Economics, Innsbruck, Austria.

Multi-sensor prognostics modeling for applications with highly incomplete signals

IISE TRANSACTIONS, Vol. 53, pp. 597–613.

Constraint violation reduction search for 0-1 mixed integer linear programming problems

ENGINEERING OPTIMIZATION.

Production Planning with Capacitated Resources and Congestion

Design and Test of Copper Printed RF Cavities

2020 IEEE 21ST INTERNATIONAL CONFERENCE ON VACUUM ELECTRONICS (IVEC 2020), pp. 149–150.

Additive Manufacture of RF Loads for ITER

2020 IEEE 21ST INTERNATIONAL CONFERENCE ON VACUUM ELECTRONICS (IVEC 2020), pp. 143–144.

Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing

Cheng, T.-H., Mehrotra, U., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Dynamic and Thermal IOL Test Systems for 3.3kV-6.5kV Die Development

Murthy, P., Mehrotra, U., Yu, W., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Traditional DBC-Based Power Modules for Test in Developing 3.3kV-15kV WBG Devices

Mehrotra, U., Morgan, A., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Creating a Fast Turn Lab to Package Developmental Power Devices with a Packaging Example

Hopkins, D. C. (2020, August). Presented at the NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices, Raleigh, NC.

ParaPower – Leveraging Finite Difference Simulator for Quick Thermal Design

Sinha, S. S., & Hopkins, D. C. (2020, January). Webinar presented at the FREEDM Systems Center & PREES Lab, NC State University, Raleigh, NC.