Center for Additive Manufacturing and Logistics

College of Engineering

Works Published in 2021

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2021 conference paper

Non-parametric Uncertainty Bias and Variance Estimation via Nested Bootstrapping and Influence Functions

Proceedings of the 2021 Winter Simulation Conference.

Source: ORCID
Added: October 13, 2021

2021 conference paper

Improved Complexity of Trust-region Optimization for Zeroth-order Stochastic Oracles with Adaptive Sampling

Proceedings of the 2021 Winter Simulation Conference.

Source: ORCID
Added: October 13, 2021

2021 journal article

Are Contact Angle Measurements Useful for Oxide-Coated Liquid Metals?

LANGMUIR, 9.

By: I. Joshipura, K. Persson, J. Oh, M. Kong, M. Vong, C. Ni, M. Alsafatwi, D. Parekh, H. Zhao, M. Dickey

Sources: Web Of Science, ORCID
Added: October 12, 2021

2021 article

3D Visible-Light-Driven Plasmonic Oxide Frameworks Deviated from Liquid Metal Nanodroplets

Alsaif, M. M. Y. A., Haque, F., Alkathiri, T., Krishnamurthi, V., Walia, S., Hu, Y., … Ou, J. Z. (2021, September 27). ADVANCED FUNCTIONAL MATERIALS, Vol. 9.

By: M. Alsaif, F. Haque, T. Alkathiri, V. Krishnamurthi, S. Walia, Y. Hu, A. Jannat, M. Mohiuddin ...

Sources: Web Of Science, ORCID
Added: October 12, 2021

2021 article

A Liquid Metal Mediated Metallic Coating for Antimicrobial and Antiviral Fabrics

Kwon, K. Y., Cheeseman, S., Frias-De-Diego, A., Hong, H., Yang, J., Jung, W., … Kim, T.-il. (2021, September 22). ADVANCED MATERIALS, Vol. 9.

By: K. Kwon, S. Cheeseman, A. Frias-De-Diego, H. Hong, J. Yang, W. Jung, H. Yin, B. Murdoch ...

Sources: Web Of Science, ORCID
Added: October 4, 2021

2021 journal article

Dynamic matching with deep reinforcement learning for a two-sided Manufacturing-as-a-Service (MaaS) marketplace

MANUFACTURING LETTERS, 8.

Sources: Web Of Science, ORCID
Added: October 4, 2021

2021 article

Minimizing Total Logistics Cost for Long-Haul Multi-Stop Truck Transportation

Kay, M. G., Karagul, K., Sahin, Y., & Gunduz, G. (2021, September 23). TRANSPORTATION RESEARCH RECORD, Vol. 9.

By: M. Kay, K. Karagul, Y. Sahin & G. Gunduz

Sources: ORCID, Web Of Science
Added: September 24, 2021

2021 article

A Liquid Metal Artificial Muscle

Shu, J., Ge, D.-A., Wang, E., Ren, H., Cole, T., Tang, S.-Y., … Zhang, S. (2021, September 12). ADVANCED MATERIALS, Vol. 9.

By: J. Shu, D. Ge, E. Wang, H. Ren, T. Cole, S. Tang, X. Li, X. Zhou ...

Sources: Web Of Science, ORCID
Added: September 20, 2021

2021 journal article

Liquid Metal Hybrid Composites with High-Sensitivity and Large Dynamic Range Enabled by Micro- and Macrostructure Engineering

ACS Applied Polymer Materials, 9.

By: G. Yun, S. Tang, H. Lu, T. Cole, S. Sun, J. Shu, J. Zheng, Q. Zhang ...

Source: ORCID
Added: September 18, 2021

2021 journal article

Performance tradeoffs for spare parts supply chains with additive manufacturing capability servicing intermittent demand

Journal of Defense Analytics and Logistics, ahead-of-print(ahead-of-print).

By: K. McDermott, R. Winz, T. Hodgson, M. Kay, R. King & B. McConnell

Source: ORCID
Added: September 14, 2021

2021 article

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Wang, H., Xing, W., Chen, S., Song, C., Dickey, M. D., & Deng, T. (2021, September 12). ADVANCED MATERIALS, Vol. 9, p. 2103104.

By: H. Wang, W. Xing, S. Chen, C. Song, M. Dickey & T. Deng

Sources: ORCID, Web Of Science
Added: September 13, 2021

2021 conference paper

Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design

Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: U. Mehrotra, A. Morgan, M. McKeown & D. Hopkins

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules

Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: T. Cheng & D. Hopkins

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Advances in Highly Thermally Conductive Organic Power Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: D. Hopkins, T. Cheng & U. Mehrotra

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)

Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.

By: D. Hopkins, T. Cheng, U. Mehrotra & W. Yu

Event: IEEE Applied Power Electronics Conference on June 14-17, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications

Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.

By: S. Shah, S. Bhattacharya, A. Kanale, T. Cheng, U. Mehrotra, A. Agarwal, B. Baliga, D. Hopkins

Event: IEEE Energy Conversion Congress and Exposition at Vancouver, Canada on October 10-14, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower

Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: K. Maru & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method

Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: S. Sinha & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Scalable Cascaded SuperCascode High Voltage Power Switch

Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: U. Mehrotra & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules

Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: D. Hopkins, W. Yu, U. Mehrotra, T. Cheng, S. Sinha, K. Maru, N. Mescia

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021