Center for Additive Manufacturing and Logistics

Non-parametric Uncertainty Bias and Variance Estimation via Nested Bootstrapping and Influence Functions

Proceedings of the 2021 Winter Simulation Conference.

Improved Complexity of Trust-region Optimization for Zeroth-order Stochastic Oracles with Adaptive Sampling

Proceedings of the 2021 Winter Simulation Conference.

Are Contact Angle Measurements Useful for Oxide-Coated Liquid Metals?

LANGMUIR, 9.

3D Visible-Light-Driven Plasmonic Oxide Frameworks Deviated from Liquid Metal Nanodroplets

Alsaif, M. M. Y. A., Haque, F., Alkathiri, T., Krishnamurthi, V., Walia, S., Hu, Y., … Ou, J. Z. (2021, September 27). ADVANCED FUNCTIONAL MATERIALS, Vol. 9.

A Liquid Metal Mediated Metallic Coating for Antimicrobial and Antiviral Fabrics

Kwon, K. Y., Cheeseman, S., Frias-De-Diego, A., Hong, H., Yang, J., Jung, W., … Kim, T.-il. (2021, September 22). ADVANCED MATERIALS, Vol. 9.

Dynamic matching with deep reinforcement learning for a two-sided Manufacturing-as-a-Service (MaaS) marketplace

MANUFACTURING LETTERS, 8.

Minimizing Total Logistics Cost for Long-Haul Multi-Stop Truck Transportation

Kay, M. G., Karagul, K., Sahin, Y., & Gunduz, G. (2021, September 23). TRANSPORTATION RESEARCH RECORD, Vol. 9.

A Liquid Metal Artificial Muscle

Shu, J., Ge, D.-A., Wang, E., Ren, H., Cole, T., Tang, S.-Y., … Zhang, S. (2021, September 12). ADVANCED MATERIALS, Vol. 9.

Liquid Metal Hybrid Composites with High-Sensitivity and Large Dynamic Range Enabled by Micro- and Macrostructure Engineering

ACS Applied Polymer Materials, 9.

Performance tradeoffs for spare parts supply chains with additive manufacturing capability servicing intermittent demand

Journal of Defense Analytics and Logistics, ahead-of-print(ahead-of-print).

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Wang, H., Xing, W., Chen, S., Song, C., Dickey, M. D., & Deng, T. (2021, September 12). ADVANCED MATERIALS, Vol. 9, p. 2103104.

Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design

Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules

Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Advances in Highly Thermally Conductive Organic Power Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)

Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.

Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications

Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.

Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower

Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method

Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Scalable Cascaded SuperCascode High Voltage Power Switch

Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules

Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.