Materials Science and Engineering - 1991

SOUK, J. H., PARSONS, G. N., BATEY, J., MADAN, A., HAMAKAWA, Y., THOMPSON, M. J., … LECOMBER, P. G. (1991). COMPOSITION AND PROPERTIES OF PECVD SILICON-NITRIDE FILMS DEPOSITED FROM SIH4, N-2, HE GASES. In Amorphous Silicon Technology - 1991 (Vol. 219, pp. 787–792). https://doi.org/10.1557/PROC-219-787

Singh, R. K., Jagannadham, K., & Narayan, J. (1991). Nature of textured growth of laser-deposited YBaCuO thin films on (100) MgO. Materials Science and Engineering B, 7(4), 287–296. https://doi.org/10.1016/0921-5107(91)90006-H

Jagannadham, K., & Narayan, J. (1991). Nucleation of a 60° glide dislocation in two-dimensional or three-dimensional growth of epilayers. Journal of Electronic Materials, 20(7), 767–774. https://doi.org/10.1007/BF02665963

Jagannadham, K., & Narayan, J. (1991). Grain boundary modeling in high critical temperature superconductors. Materials Science and Engineering B, 8(1), 5–21. https://doi.org/10.1016/0921-5107(91)90014-M

Rajan, K., Fitzgerald, E., Jagannadham, K., & Jesser, W. A. (1991). Misfit accommodation at epitaxial interfaces. Journal of Electronic Materials, 20(7), 861–867. https://doi.org/10.1007/BF02665975

Jagannadham, K., & Narayan, J. (1991). Critical thickness during two-dimensional and three-dimensional epitaxial growth in semiconductor heterostructures. Materials Science and Engineering B, 8(2), 107–124. https://doi.org/10.1016/0921-5107(91)90024-P

Jagannadham, K., & Narayan, J. (1991). A comparative study of grain boundary structure and critical current density in 123-YBaCuO, 2212-BiSrCaCuO and 2223-TlBaCaCuO high temperature superconductors. Materials Science and Engineering B, 8(3), 201–218. https://doi.org/10.1016/0921-5107(91)90039-X

ZHU, Y. T., & DEVLETIAN, J. H. (1991). PRECISE DTA TESTING OF HIGHLY REACTIVE ALLOYS. ADVANCED MATERIALS & PROCESSES, 140(4), 51–53.

ZHU, Y. T., & DEVLETIAN, J. H. (1991). PRECISE DETERMINATION OF ISOMORPHOUS AND EUTECTOID TRANSFORMATION TEMPERATURES IN BINARY AND TERNARY ZR ALLOYS. JOURNAL OF MATERIALS SCIENCE, 26(22), 6218–6222.

ZHU, Y. T., & DEVLETIAN, J. H. (1991). DETERMINATION OF EQUILIBRIUM SOLID-PHASE TRANSITION-TEMPERATURE USING DTA. METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 22(9), 1993–1998.

Narayan, J., Godbole, V. P., & White, C. W. (1991). Laser method for synthesis and processing of continuous diamond films on nondiamond substrates. Science, 252(5004), 416–418.

PARSONS, G. N. (1991). SELECTIVE DEPOSITION OF SILICON BY PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION USING PULSED SILANE FLOW. APPLIED PHYSICS LETTERS, 59(20), 2546–2548. https://doi.org/10.1063/1.105948

PARSONS, G. N., SOUK, J. H., & BATEY, J. (1991). LOW HYDROGEN CONTENT STOICHIOMETRIC SILICON-NITRIDE FILMS DEPOSITED BY PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION. JOURNAL OF APPLIED PHYSICS, 70(3), 1553–1560. https://doi.org/10.1063/1.349544

Reeber, R., Chu, W., & Yu, N. (1991). Surface modification of boron carbide to form pockets of solid lubricant. Washington, DC: U.S. Patent and Trademark Office.

Palmour, J. W. (1991). Dry etching of silicon carbide. Washington, DC: U.S. Patent and Trademark Office.

Sonnenberg, N., Kingon, A. I., & Paterson, A. W. (1991). Sintered ceramic product. Washington, DC: U.S. Patent and Trademark Office.

Kong, H. S., Glass, J. T., & Davis, R. F. (1991). Homoepitaxial growth of Alpha-SiC thin films and semiconductor devices fabricated thereon. Washington, DC: U.S. Patent and Trademark Office.

DAVIS, R. F., KELNER, G., SHUR, M., PALMOUR, J. W., & EDMOND, J. A. (1991). THIN-FILM DEPOSITION AND MICROELECTRONIC AND OPTOELECTRONIC DEVICE FABRICATION AND CHARACTERIZATION IN MONOCRYSTALLINE ALPHA AND BETA SILICON-CARBIDE. PROCEEDINGS OF THE IEEE, 79(5), 677–701. https://doi.org/10.1109/5.90132

DAVIS, R. F. (1991). III-V NITRIDES FOR ELECTRONIC AND OPTOELECTRONIC APPLICATIONS. PROCEEDINGS OF THE IEEE, 79(5), 702–712. https://doi.org/10.1109/5.90133

KHEDRO, T., & HAVNER, K. S. (1991). INVESTIGATION OF A ONE-PARAMETER FAMILY OF HARDENING RULES IN SINGLE SLIP IN FCC CRYSTALS. INTERNATIONAL JOURNAL OF PLASTICITY, 7(6), 477–503. https://doi.org/10.1016/0749-6419(91)90041-V