Materials Science and Engineering

Photo electron emission microscopy of polarity-patterned materials

Yang, W. C., Rodriguez, B. J., Gruverman, A., & Nemanich, R. J. (2005, April 27). JOURNAL OF PHYSICS-CONDENSED MATTER, Vol. 17, pp. S1415–S1426.

Nanoscale polarization relaxation in a polycrystalline ferroelectric thin film: Role of local environments

Applied Physics Letters, 86(26).

Hollow to bamboolike internal structure transition observed in carbon nanotube films

JOURNAL OF APPLIED PHYSICS, 98(1).

Fabrication of wafer scale, aligned sub-25 nm nanowire and nanowire templates using planar edge defined alternate layer process

PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES, 28(2), 107–114.

Fabrication and thermal evaluation of silicon on diamond wafers

JOURNAL OF ELECTRONIC MATERIALS, 34(7), 1089–1094.

Effect of UV/VUV enhanced RTP on process variation and device performance of metal gate high-kappa gate stacks for the sub-90-nm CMOS regime

IEEE Transactions on Semiconductor Manufacturing, 18(1), 55–62.

Diffusion-controlled reactive coupling at polymer-polymer interfaces

MACROMOLECULES, 38(9), 3543–3546.

Design of an RF-heated bulk AlN growth reactor: Induction heating and heat transfer modeling

CRYSTAL GROWTH & DESIGN, 5(4), 1491–1498.

Copper compatible barium titanate thin films for embedded passives

JOURNAL OF ELECTROCERAMICS, 14(2), 95–102.

The effects of oxygen, nitrogen, and hydrogen annealing on Mg acceptors in GaN as monitored by electron paramagnetic resonance spectroscopy

JOURNAL OF ELECTRONIC MATERIALS, 34(1), 34–39.

Tensile properties of in situ consolidated nanocrystalline Cu

ACTA MATERIALIA, 53(5), 1521–1533.

Microcontact patterning of ruthenium gate electrodes by selective area atomic layer deposition

APPLIED PHYSICS LETTERS, 86(5).

Lead zirconate titanate thin films directly on copper electrodes for ferroelectric, dielectric and piezoelectric applications

NATURE MATERIALS, 4(3), 233–237.

Kinematic, stress, and hardening analysis in finite double slip

INTERNATIONAL JOURNAL OF PLASTICITY, 21(1), 83–99.

Imaging temperature-dependent field emission from carbon nanotube films: Single versus multiwalled

APPLIED PHYSICS LETTERS, 86(6).

Solid-state complexation of poly(ethylene glycol) with alpha-cyclodextrin

MACROMOLECULES, 38(2), 537–541.

Preparation and characterization of atomically clean, stoichlometric surfaces of AIN(0001)

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 23(1), 72–77.

Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts

Washington, DC: U.S. Patent and Trademark Office.

Low loss tungsten-based electrode technology for microwave frequency BST varactors

JOURNAL OF ELECTROCERAMICS, 14(1), 75–81.

Effect of grain size from millimeters to nanometers on the flow stress and deformation kinetics of Ag

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 391(1-2), 272–284.