Works Published in 2004
Displaying works 101 - 120 of 296 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2004 patent
MIM capacitor with metal nitride electrode materials and method of formation
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Chemical vapor deposition method of forming a material over at least two substrates
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Capacitor with high dielectric constant materials and method of making
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Atomic layer deposition methods
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Atomic layer deposition methods
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
System and method for inhibiting imprinting of capacitor structures of a memory
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Methods of forming trenched isolation regions
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Methods of forming regions of differing composition over a substrate
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Methods of forming hafnium-containing materials, methods of forming hafnium oxide, and capacitor constructions comprising hafnium oxide
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Methods of forming capacitor constructions, and methods of forming constructions comprising dielectric materials
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layers
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Method of providing a structure using self-aligned features
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Method of forming a patterned substantially crystalline TA2O5 comprising material, and method of forming a capacitor having a capacitor dilelectric region comprising substantially crystalline TA2O5 comprising material
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 patent
Method for reducing physisorption during atomic layer deposition
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2004 chapter
Silicide contacts for Si/Ge devices
In Silicide technology for integrated circuits.
Source: NC State University Libraries
Added: August 6, 2018
2004 article
Circuit editing of copper and low-k dielectrics in nanotechnology devices
Mosselveld, F., Makarov, VV, Lundquist, T. R., Griffis, D. P., & Russell, P. E. (2004, June). JOURNAL OF MICROSCOPY, Vol. 214, pp. 246–251.
author keywords: copper etching; device modification; low-k dielectrics
TL;DR:
Methods to increase the etching of metallization relative to the dielectrics are reviewed, including chemistries that improve the selectivity of copper to dielectric.
(via Semantic Scholar)
onlinelibrary.wiley.com (publisher PDF)
Source: Web Of Science
Added: August 6, 2018
2004 article
Special issue on nanostructured magnetic materials: Recent progress in magnetic nanostructures - Foreword
Tiwari, A. (2004, November). JOURNAL OF ELECTRONIC MATERIALS, Vol. 33, pp. 1253–1253.
Source: Web Of Science
Added: August 6, 2018
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