Electrical & Computer Engineering - 2003

Hasselstrom, J., Lubkeman, D., Li, F., Wang, J., & Liao, Y. (2003). Web-based Asset Management Tools. Proceedings of DistribuTech Conference. Presented at the DistribuTech Conference, Las Vegas, NV.

Hopkins, D. C., & Moronski, J. (2003). Partitioning digitally programmable power-control for applications to ballasts. APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX. https://doi.org/10.1109/apec.2002.989356

Ibrahim, K. Z., & Byrd, G. T. (2003). Extending OpenMP to support slipstream execution mode. Proceedings - International Parallel and Distributed Processing Symposium, IPDPS 2003, 10. https://doi.org/10.1109/IPDPS.2003.1213119

Lunardi, L., Welser, J., & Candelaria, J. (2003). Welcome from the general chair. Technical Digest - International Electron Devices Meeting.

O, K. K., Kim, K., Floyd, B., Mehta, J., Yoon, H., Hung, C.-M., … Brewer, J. (2003). Wireless communications using integrated antennas. Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003, 111–113. https://doi.org/10.1109/IITC.2003.1219727

Reynolds, S., Floyd, B., Pfeiffer, U., & Zwick, T. (2003). 60GHz transceiver circuits in SiGe bipolar technology. Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 47.

Tuck, J. M. (2003). A novel compiler framework for a chip-multiprocessor architecture with thread-level speculation. University of Illinois at Urbana-Champaign.

Ye, H., Basaran, C., & Hopkins, D. (2003). Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing. Applied Physics Letters, 82(7), 1045–1047. https://doi.org/10.1063/1.1554775

Ye, H., Basaran, C., & Hopkins, D. C. (2003). Damage mechanics of microelectronics solder joints under high current densities. International Journal of Solids and Structures, 40(15), 4021–4032. https://doi.org/10.1016/s0020-7683(03)00175-6

Ye, H., Basaran, C., & Hopkins, D. C. (2003). Measuring Joint Reliability: Applying the Moire Interferometry Technique. Advanced Microelectronics Magazine, 12(5), 17–20.

Ye, H., Basaran, C., & Hopkins, D. C. (2003). Mechanical degradation of microelectronics solder joints under current stressing. International Journal of Solids and Structures, 40(26), 7269–7284. https://doi.org/10.1016/j.ijsolstr.2003.08.019

Ye, H., Basaran, C., & Hopkins, D. C. (2003). Numerical simulation of stress evolution during electromigration in IC interconnect lines. IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681. https://doi.org/10.1109/tcapt.2003.817877

Ye, H., Basaran, C., Hopkins, D. C., Liu, H., & Cartright, A. (2003). Flip Chip and BGA Solder Joint Reliability. Advanced Packaging, 12(5), 17–19.

Ye, H., Basaran, C., Hopkins, D., & Cartwright, A. (2003). Reliability of solder joints under electrical stressing - strain evolution of solder joints. ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA. https://doi.org/10.1109/itherm.2002.1012558

Ye, H., Hopkins, D. C., & Basaran, C. (2003). Measurement of Electrical Current Density Effects in Solder Joints. Advancing Microelectronics, 30(5).

Ye, H., Hopkins, D. C., & Basaran, C. (2003). Measurement of high electrical current density effects in solder joints. Microelectronics Reliability, 43(12), 2021–2029. https://doi.org/10.1016/s0026-2714(03)00131-8

Zhou, H. (2003). Code size aware compilation for real-time applications [Technical Report]. Computer Science Department, University of Central Florida.

Zhou, H., & Conte, T. M. (2003). Enhancing Memory Level Parallelism via Recovery-Free Value Prediction. The 2003 International Conference on Supercomputing (ICS'03), 326–335.

Zhou, H., & Conte, T. M. (2003). Performance modeling of memory latency hiding techniques [Technical Report,]. Raleigh, NC: Department of Electrical and Computer Engineering, North Carolina State University.

Öztürk, M. C., Trussell, J., Townsend, C., Byrd, G., Mortazavi, A., Baran, M., … Brickley, J. (2003). A new introductory laboratory course for electrical and computer engineering. ASEE Annual Conference Proceedings, 11378–11391.