College of Engineering
Displaying works 241 - 260 of 418 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2021 article
Networked HIL Simulation System for Modeling Large-scale Power Systems
2020 52ND NORTH AMERICAN POWER SYMPOSIUM (NAPS).
2021 article
3.3 kV 4H-SiC Planar-Gate MOSFETs Manufactured using Gen-5 PRESiCE (TM) Technology in a 4-inch Wafer Commercial Foundry
SOUTHEASTCON 2021, pp. 555–558.
2021 journal article
A Two-Stage Auction Mechanism for Cloud Resource Allocation
IEEE TRANSACTIONS ON CLOUD COMPUTING, 9(3), 881–895.
2021 journal article
Load Control A new era of intelligent automation
IEEE ELECTRIFICATION MAGAZINE, 9(3), 18–28.
2021 journal article
A Random-Weight Privacy-Preserving Algorithm With Error Compensation for Microgrid Distributed Energy Management
IEEE TRANSACTIONS ON INFORMATION FORENSICS AND SECURITY, 16, 4352–4362.
2021 conference paper
Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design
Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021
2021 conference paper
Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules
Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021
2021 conference paper
Advances in Highly Thermally Conductive Organic Power Packaging
Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021
2021 conference paper
Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)
Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.
Event: IEEE Applied Power Electronics Conference on June 14-17, 2021
2021 conference paper
Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications
Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.
Event: IEEE Energy Conversion Congress and Exposition at Vancouver, Canada on October 10-14, 2021
2021 conference paper
Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower
Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 conference paper
E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method
Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 conference paper
Scalable Cascaded SuperCascode High Voltage Power Switch
Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 conference paper
A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules
Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 journal article
Design Optimization of a Synchronous Reluctance Machine for High-Performance Applications
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 57(5), 4720–4732.
2021 conference paper
A New Cascaded SuperCascode High Voltage Power Switch
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2251–2257.
Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC) at Phoenix, AZ on June 14-17, 2021
2021 journal article
Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems
IEEE Journal of Emerging and Selected Topics in Power Electronics, 1–1.
2021 journal article
A Novel Submodule Level Fault-Tolerant Approach for MMC With Integrated Scale-Up Architecture
IEEE Journal of Emerging and Selected Topics in Industrial Electronics, 2(3), 343–352.
2021 conference paper
Switching Characteristics of a 1.2 kV, 50 mΩ SiC Monolithic Bidirectional Field Effect Transistor (BiDFET) with Integrated JBS Diodes
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 1267–1274.
Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)
2021 conference paper
Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2351–2356.
Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)