Electrical & Computer Engineering

College of Engineering

Works Published in 2021

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Displaying works 241 - 260 of 418 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2021 article

Networked HIL Simulation System for Modeling Large-scale Power Systems

2020 52ND NORTH AMERICAN POWER SYMPOSIUM (NAPS).

Sources: Web Of Science, ORCID
Added: September 13, 2021

2021 article

3.3 kV 4H-SiC Planar-Gate MOSFETs Manufactured using Gen-5 PRESiCE (TM) Technology in a 4-inch Wafer Commercial Foundry

SOUTHEASTCON 2021, pp. 555–558.

By: A. Agarwal, J. Baliga, M. Francois*, E. Maxwell*, N. Berliner* & M. Papageorge*

Source: Web Of Science
Added: September 13, 2021

2021 journal article

A Two-Stage Auction Mechanism for Cloud Resource Allocation

IEEE TRANSACTIONS ON CLOUD COMPUTING, 9(3), 881–895.

Source: Web Of Science
Added: September 13, 2021

2021 journal article

Load Control A new era of intelligent automation

IEEE ELECTRIFICATION MAGAZINE, 9(3), 18–28.

By: N. Lu

Sources: Web Of Science, ORCID
Added: September 13, 2021

2021 journal article

A Random-Weight Privacy-Preserving Algorithm With Error Compensation for Microgrid Distributed Energy Management

IEEE TRANSACTIONS ON INFORMATION FORENSICS AND SECURITY, 16, 4352–4362.

By: F. Ye*, Z. Cheng, X. Cao* & M. Chow

Sources: Web Of Science, ORCID
Added: September 13, 2021

2021 conference paper

Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design

Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: U. Mehrotra, A. Morgan, M. McKeown & D. Hopkins

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules

Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: T. Cheng & D. Hopkins

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Advances in Highly Thermally Conductive Organic Power Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: D. Hopkins, T. Cheng & U. Mehrotra

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)

Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.

By: D. Hopkins, T. Cheng, U. Mehrotra & W. Yu

Event: IEEE Applied Power Electronics Conference on June 14-17, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications

Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.

By: S. Shah, S. Bhattacharya, A. Kanale, T. Cheng, U. Mehrotra, A. Agarwal, B. Baliga, D. Hopkins

Event: IEEE Energy Conversion Congress and Exposition at Vancouver, Canada on October 10-14, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower

Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: K. Maru & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method

Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: S. Sinha & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Scalable Cascaded SuperCascode High Voltage Power Switch

Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: U. Mehrotra & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules

Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: D. Hopkins, W. Yu, U. Mehrotra, T. Cheng, S. Sinha, K. Maru, N. Mescia

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 journal article

Design Optimization of a Synchronous Reluctance Machine for High-Performance Applications

IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 57(5), 4720–4732.

By: M. Chowdhury, A. Tesfamicael*, M. Islam* & I. Husain

Source: Web Of Science
Added: September 7, 2021

2021 conference paper

A New Cascaded SuperCascode High Voltage Power Switch

2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2251–2257.

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC) at Phoenix, AZ on June 14-17, 2021

Sources: Crossref, ORCID, Web Of Science
Added: September 5, 2021

2021 journal article

Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems

IEEE Journal of Emerging and Selected Topics in Power Electronics, 1–1.

By: U. Mehrotra n, B. Ballard n & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2021 journal article

A Novel Submodule Level Fault-Tolerant Approach for MMC With Integrated Scale-Up Architecture

IEEE Journal of Emerging and Selected Topics in Industrial Electronics, 2(3), 343–352.

Source: ORCID
Added: September 5, 2021

2021 conference paper

Switching Characteristics of a 1.2 kV, 50 mΩ SiC Monolithic Bidirectional Field Effect Transistor (BiDFET) with Integrated JBS Diodes

2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 1267–1274.

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

Sources: Web Of Science, ORCID, Crossref
Added: September 4, 2021

2021 conference paper

Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices

2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2351–2356.

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

Sources: Crossref, ORCID, Web Of Science
Added: September 4, 2021