College of Engineering
Displaying works 281 - 300 of 485 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2021 journal article
A 125 mu m x 245 mu m Mainly Digital UHF EPC Gen2 Compatible RFID Tag in 55 nm CMOS Process
IEEE JOURNAL OF RADIO FREQUENCY IDENTIFICATION, 5(3), 317–323.
2021 article
Networked HIL Simulation System for Modeling Large-scale Power Systems
2020 52ND NORTH AMERICAN POWER SYMPOSIUM (NAPS).
2021 article
3.3 kV 4H-SiC Planar-Gate MOSFETs Manufactured using Gen-5 PRESiCE (TM) Technology in a 4-inch Wafer Commercial Foundry
SOUTHEASTCON 2021, pp. 555–558.
2021 journal article
A Two-Stage Auction Mechanism for Cloud Resource Allocation
IEEE TRANSACTIONS ON CLOUD COMPUTING, 9(3), 881–895.
2021 journal article
Load Control A new era of intelligent automation
IEEE ELECTRIFICATION MAGAZINE, 9(3), 18–28.
2021 journal article
A Random-Weight Privacy-Preserving Algorithm With Error Compensation for Microgrid Distributed Energy Management
IEEE TRANSACTIONS ON INFORMATION FORENSICS AND SECURITY, 16, 4352–4362.
2021 conference paper
Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design
Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021
2021 conference paper
Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules
Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021
2021 conference paper
Advances in Highly Thermally Conductive Organic Power Packaging
Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021
2021 conference paper
Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)
Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.
Event: IEEE Applied Power Electronics Conference on June 14-17, 2021
2021 conference paper
Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications
Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.
Event: IEEE Energy Conversion Congress and Exposition at Vancouver, Canada on October 10-14, 2021
2021 conference paper
Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower
Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 conference paper
E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method
Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 conference paper
Scalable Cascaded SuperCascode High Voltage Power Switch
Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 conference paper
A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules
Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 journal article
Design Optimization of a Synchronous Reluctance Machine for High-Performance Applications
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 57(5), 4720–4732.
2021 conference paper
A New Cascaded SuperCascode High Voltage Power Switch
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2251–2257.
Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC) at Phoenix, AZ on June 14-17, 2021
2021 journal article
Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems
IEEE Journal of Emerging and Selected Topics in Power Electronics, 1–1.
2021 journal article
A Novel Submodule Level Fault-Tolerant Approach for MMC With Integrated Scale-Up Architecture
IEEE Journal of Emerging and Selected Topics in Industrial Electronics, 2(3), 343–352.
2021 conference paper
Switching Characteristics of a 1.2 kV, 50 mΩ SiC Monolithic Bidirectional Field Effect Transistor (BiDFET) with Integrated JBS Diodes
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 1267–1274.
Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)