Electrical and Computer Engineering

Comparative Evaluation of Current Sensors for High-Power SiC Converter Applications

2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021), pp. 2206–2210.

Design and Development of A Hybrid DC Circuit Breaker for 380V DC Distribution System

2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021), pp. 1122–1127.

Design of a Fault-tolerant Controller for Three-phase Active front End Converter used for Power Conditioning Applications

2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021), pp. 2804–2811.

Collaborative Trajectory Optimization for Outage-aware Cellular-Enabled UAVs

2021 IEEE 93RD VEHICULAR TECHNOLOGY CONFERENCE (VTC2021-SPRING).

RL-Based Waveform Adaptation With Partial Overlapping Tones in HetNets

IEEE COMMUNICATIONS LETTERS, 25(9), 3129–3133.

Placement of mmWave Base Stations for Serving Urban Drone Corridors

2021 IEEE 93RD VEHICULAR TECHNOLOGY CONFERENCE (VTC2021-SPRING).

Use of LoRa for UAV Remote ID with Multi-User Interference and Different Spreading Factors

2021 IEEE 93RD VEHICULAR TECHNOLOGY CONFERENCE (VTC2021-SPRING).

Secure 5G Network for a Nationwide Drone Corridor

2021 IEEE AEROSPACE CONFERENCE (AEROCONF 2021).

A Taxonomy and Survey on Experimentation Scenarios for Aerial Advanced Wireless Testbed Platforms

2021 IEEE AEROSPACE CONFERENCE (AEROCONF 2021).

A 125 mu m x 245 mu m Mainly Digital UHF EPC Gen2 Compatible RFID Tag in 55 nm CMOS Process

IEEE JOURNAL OF RADIO FREQUENCY IDENTIFICATION, 5(3), 317–323.

Networked HIL Simulation System for Modeling Large-scale Power Systems

2020 52ND NORTH AMERICAN POWER SYMPOSIUM (NAPS).

3.3 kV 4H-SiC Planar-Gate MOSFETs Manufactured using Gen-5 PRESiCE (TM) Technology in a 4-inch Wafer Commercial Foundry

SOUTHEASTCON 2021, pp. 555–558.

A Two-Stage Auction Mechanism for Cloud Resource Allocation

IEEE TRANSACTIONS ON CLOUD COMPUTING, 9(3), 881–895.

Load Control A new era of intelligent automation

IEEE ELECTRIFICATION MAGAZINE, 9(3), 18–28.

A Random-Weight Privacy-Preserving Algorithm With Error Compensation for Microgrid Distributed Energy Management

IEEE TRANSACTIONS ON INFORMATION FORENSICS AND SECURITY, 16, 4352–4362.

Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design

Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules

Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Advances in Highly Thermally Conductive Organic Power Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)

Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.

Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications

Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.