Displaying works 301 - 320 of 510 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2021 article
Placement of mmWave Base Stations for Serving Urban Drone Corridors
2021 IEEE 93RD VEHICULAR TECHNOLOGY CONFERENCE (VTC2021-SPRING).
2021 article
Use of LoRa for UAV Remote ID with Multi-User Interference and Different Spreading Factors
2021 IEEE 93RD VEHICULAR TECHNOLOGY CONFERENCE (VTC2021-SPRING).
2021 article
Secure 5G Network for a Nationwide Drone Corridor
2021 IEEE AEROSPACE CONFERENCE (AEROCONF 2021).
2021 article
A Taxonomy and Survey on Experimentation Scenarios for Aerial Advanced Wireless Testbed Platforms
2021 IEEE AEROSPACE CONFERENCE (AEROCONF 2021).
Contributors: M. Chowdhury n, C. Anjinappa n, I. Guvenc n , M. Sichitiu n , O. Ozdemir n, U. Bhattacherjee n, R. Dutta n , V. Marojevic *, B. Floyd n
2021 journal article
A 125 mu m x 245 mu m Mainly Digital UHF EPC Gen2 Compatible RFID Tag in 55 nm CMOS Process
IEEE JOURNAL OF RADIO FREQUENCY IDENTIFICATION, 5(3), 317–323.
2021 article
Networked HIL Simulation System for Modeling Large-scale Power Systems
2020 52ND NORTH AMERICAN POWER SYMPOSIUM (NAPS).
2021 article
3.3 kV 4H-SiC Planar-Gate MOSFETs Manufactured using Gen-5 PRESiCE (TM) Technology in a 4-inch Wafer Commercial Foundry
SOUTHEASTCON 2021, pp. 555–558.
2021 journal article
A Two-Stage Auction Mechanism for Cloud Resource Allocation
IEEE TRANSACTIONS ON CLOUD COMPUTING, 9(3), 881–895.
2021 journal article
Load Control A new era of intelligent automation
IEEE ELECTRIFICATION MAGAZINE, 9(3), 18–28.
2021 journal article
A Random-Weight Privacy-Preserving Algorithm With Error Compensation for Microgrid Distributed Energy Management
IEEE TRANSACTIONS ON INFORMATION FORENSICS AND SECURITY, 16, 4352–4362.
2021 conference paper
Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design
Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021
2021 conference paper
Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules
Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021
2021 conference paper
Advances in Highly Thermally Conductive Organic Power Packaging
Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021
2021 conference paper
Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)
Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.
Event: IEEE Applied Power Electronics Conference on June 14-17, 2021
2021 conference paper
Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications
Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.
Event: IEEE Energy Conversion Congress and Exposition at Vancouver, Canada on October 10-14, 2021
2021 conference paper
Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower
Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 conference paper
E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method
Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 conference paper
Scalable Cascaded SuperCascode High Voltage Power Switch
Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 conference paper
A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules
Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021
2021 journal article
Design Optimization of a Synchronous Reluctance Machine for High-Performance Applications
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 57(5), 4720–4732.
Citation Index includes data from a number of different sources. If you have questions about the sources of data in the Citation Index or need a set of data which is free to re-distribute, please contact us.
Certain data included herein are derived from the Web of Science© and InCites© (2024) of Clarivate Analytics. All rights reserved. You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.