Electrical & Computer Engineering

IEEE 802.11 Saturation Throughput Analysis in the Presence of Hidden Terminals

IEEE-ACM TRANSACTIONS ON NETWORKING, 20(2), 557–570.

FABSCALAR: AUTOMATING SUPERSCALAR CORE DESIGN

IEEE MICRO, 32(3), 48–59.

Efficient 3D FDTD analysis of arbitrary birefringent and dichroic media with obliquely incident sources

PHYSICS AND SIMULATION OF OPTOELECTRONIC DEVICES XX, Vol. 8255.

Area-Efficient Antenna-Scalable MIMO Detector for K-best Sphere Decoding

JOURNAL OF SIGNAL PROCESSING SYSTEMS FOR SIGNAL IMAGE AND VIDEO TECHNOLOGY, 68(2), 171–182.

Progress on large-area polarization grating fabrication

ACQUISITION, TRACKING, POINTING, AND LASER SYSTEMS TECHNOLOGIES XXVI, Vol. 8395.

High-Performance Solenoidal RF Transformers on High-Resistivity Silicon Substrates for 3D Integrated Circuits

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 60(7), 2066–2072.

Effect of viscosities on structure and instability of sprays from a swirl atomizer

EXPERIMENTAL THERMAL AND FLUID SCIENCE, 39, 158–166.

Demonstration of communication using neutrinos

Modern Physics Letters A, 27(12).

Comparison of modeling techniques in circuit variability analysis

INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS, 25(3), 288–302.

Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods

JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 28(1), 27–38.

The Evolution of Optical Networking

Tomkos, I., Mukherjee, B., Korotky, S. K., Tucker, R. S., & Lunardi, L. (2012, May). PROCEEDINGS OF THE IEEE, Vol. 100, pp. 1017–1022.

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

A Unified Optimizing Compiler Framework for Different GPGPU Architectures

ACM TRANSACTIONS ON ARCHITECTURE AND CODE OPTIMIZATION, 9(2).

THD minimization applied directly on the line-to-line voltage of multilevel inverters

IEEE Transactions on Industrial Electronics, 59(1), 373–380.

Scaling Issues in Ferroelectric Barium Strontium Titanate Tunable Planar Capacitors

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 59(2), 198–204.

Performance of the 802.11p Physical Layer in Vehicle-to-Vehicle Environments

IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, 61(1), 3–14.

Passivity Enforcement for Admittance Models of Distributed Networks Using an Inverse Eigenvalue Method

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 60(1), 8–20.

Momentum and heat transfer of the Falkner-Skan flow with algebraic decay: An analytical solution

COMMUNICATIONS IN NONLINEAR SCIENCE AND NUMERICAL SIMULATION, 17(6), 2476–2488.

Active damping of output LC filter resonance for vector-controlled VSI-fed AC motor drives

IEEE Transactions on Industrial Electronics, 59(1), 334–342.

A Survey on the Electrification of Transportation in a Smart Grid Environment

IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, 8(1), 1–10.