Electrical and Computer Engineering

Dynamic equalization during charging of serial energy storage elements

IEEE Transactions on Industry Applications, 29(2), 363–368.

Extension of battery life via charge equalization control

IEEE Transactions on Industrial Electronics, 40(1), 96–104.

Incorporating Mutual Coupling and Intermediate Loads into Fault Location Techniques using Digital Fault Recorder Data

Proceedings of Seventh Annual Conference for Fault & Disturbance Analysis. Presented at the Seventh Annual Conference for Fault & Disturbance Analysis, Texas A&M University, College Station, TX.

Object-oriented programming for power engineering education

Proceedings : SSST '93 : the Twenty-fifth Southeastern Symposium on System Theory : University of Alabama, Tuscaloosa, Alabama, March 7-9, 1993, 69–73.

High-speed monolithic p-i-n/HBT and HPT/HBT photoreceivers implemented with simple phototransistor structure

IEEE Photonics Technology Letters, 5(11), 1316–1318.

High-Speed, High-Current-Gain P-n-p InP/InGaAs Heterojunction Bipolar Transistors

IEEE Electron Device Letters, 14(1), 19–21.

High speed and high performance long wavelength OEICs using heterojunction bipolar transistors

Proceedings - 6th Annual IEEE International ASIC Conference and Exhibit, ASIC 1993, 490–493.

A fault location technique for rural distribution feeders

IEEE Transactions on Industry Applications, 29(6), 1170–1175.

Experimental characterization of interconnects and discontinuities in thin-film multichip module substrates

Proceedings of the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Presented at the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, USA.

LISAS: A Language for Instruction Set Architecture Specification

Proceedings 1993 ICCD Conference, 552–557.

Design advice systems for concurrent engineering: A constraint-based approach

Bowen, J., Bahler, D., & Franzon, P. (1993, January). Presented at the NSF Grantees Conference, Charlotte, NC.

Behavioral modeling of processors from instruction set specifications

In Open Verilog International 1993 Conference.

A simple method for noise tolerance characterization of digital circuits

Proceedings 1993 Great Lakes VLSI Conference.

Automatic A-Priori Generation of Delay and Noise Macromodels and Wiring Rules for MCMs

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93. Presented at the Santa Cruz, CA, USA.

Macromodels for Generating Signal Integrity and Timing Management Advice for Package Design

Proceedings of the IEEE 1993 ECTC Conference, 523–529.

A Signal Integrity Advisor for Automated Packaging Design

Proceedings of the 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Presented at the Monterey, CA, USA.

Comparison of methods for determining the capacitance of planar transmission lines with application to multichip module characterization

IEEE Trans. on Components Hybrids and Manufacturing Technology/Advanced Packaging.

Characteristics of In/sub 0.52/Al/sub 0.48/As/In/sub 0.53/Ga/sub 0.47/As/InP HEMT's with n-and p-channel doping

IEEE Transactions on Electron Devices, 40(12), 2362–2365.

Piezoelectric scattering of carriers from confined acoustic modes in cylindrical quantum wires

Physical Review B, 48(3), 1936–1938.

Simplified microscopic model for electron–optical-phonon interactions in quantum wells

Physical Review B, 48(19), 14671–14674.