Electrical and Computer Engineering

Works Published in 2002

search works

Displaying works 21 - 40 of 224 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2002 conference paper

Jitter in a wireless clock distribution system

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002, 154–156.

By: T. Dickson*, B. Floyd* & K. O

Contributors: T. Dickson*, B. Floyd* & K. O

Source: ORCID
Added: December 10, 2021

2002 conference paper

Wireless Interconnects for Clock Distribution

ACM/IEEE International Workshop on Timing Issues in the Specification and Synthesis of Digital Systems, 105–108.

By: B. Floyd*, X. Guo*, J. Caserta*, T. Dickson*, C. Hung*, K. Kim*, K. O*

Contributors: B. Floyd*, X. Guo*, J. Caserta*, T. Dickson*, C. Hung*, K. Kim*, K. O*

Source: ORCID
Added: December 10, 2021

2002 conference paper

Propagation layers for intra-chip wireless interconnection compatible with packaging and heat removal

IEEE Symposium on VLSI Circuits, Digest of Technical Papers, 36–37. http://www.scopus.com/inward/record.url?eid=2-s2.0-0036057339&partnerID=MN8TOARS

By: X. Guo, J. Caserta, R. Li, B. Floyd & K. O

Contributors: X. Guo, J. Caserta, R. Li, B. Floyd & K. O

Source: ORCID
Added: December 10, 2021

2002 conference paper

A direct-conversion receiver IC for WCDMA mobile systems

Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting, 61–64. http://www.scopus.com/inward/record.url?eid=2-s2.0-0036437922&partnerID=MN8TOARS

By: S. Reynolds, B. Floyd, T. Beukema, T. Zwick, U. Pfeiffer & H. Ainspan

Contributors: S. Reynolds, B. Floyd, T. Beukema, T. Zwick, U. Pfeiffer & H. Ainspan

Source: ORCID
Added: December 10, 2021

2002 conference paper

Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement

SPIE proceedings series, 4828, 231–236. SPIE: Bellingham, Washington.

By: H. Ye, C. Basaran & D. Hopkins

Event: 2002 International Microelectronics Assembly and Packaging Society (IMAPS) International Conference on Advanced Packaging and Systems at Reno, Nevada on March 10-13, 2002

Source: NC State University Libraries
Added: October 28, 2021

2002 conference paper

Measurement and Effects of High Electrical Current Stress in Solder Joints

Proceedings of the 35th International Symposium on Microelectronics, 427–432.

By: H. Ye, D. Hopkins & C. Basaran

Event: 35th International Symposium on Microelectronics at Denver, Colorado on September 4, 2002

Source: NC State University Libraries
Added: October 28, 2021

2002 conference paper

Synthesis of a new class of converters that utilize energy recirculation

Proceedings of 1994 Power Electronics Specialist Conference - PESC'94. Presented at the 1994 Power Electronics Specialist Conference - PESC'94, Taipei, Taiwan.

By: D. Hopkins* & D. Root

Event: 1994 Power Electronics Specialist Conference - PESC'94 at Taipei, Taiwan on June 20-25, 1994

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Packaging issues for next generation high voltage, high temperature power electronic modules

Proceedings of APEC 97 - Applied Power Electronics Conference. Presented at the APEC 97 - Applied Power Electronics Conference, Atlanta, GA.

By: J. Bowers*, D. Hopkins* & W. Sarjeant*

Event: APEC 97 - Applied Power Electronics Conference at Atlanta, GA on February 27, 1997

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

A framework for developing power electronics packaging

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

By: D. Hopkins*, S. Mathuna*, A. Alderman & J. Flannery*

co-author countries: Ireland 🇮🇪

Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Power packaging of a 12 kV, 240°C passive electronic module

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

By: J. Bowers*, D. Hopkins* & W. Sarjeant*

Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

A high speed pulser thyristor

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

By: A. Craig*, D. Hopkins* & J. Driscoll

Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Optimally selecting packaging technologies and circuit partitions based on cost and performance

APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058). Presented at the APEC 2000 - Applied Power Electronics Conference, New Orleans, LA.

By: J. Jacobsen & D. Hopkins*

Event: APEC 2000 - Applied Power Electronics Conference at New Orleans, LA on February 6-10, 2000

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Characterization of advanced materials for high voltage/high temperature power electronics packaging

APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181). Presented at the 16th Annual Applied Power Electronics Conference - APEC 2001, Anaheim, CA.

By: D. Hopkins* & J. Bowers*

Event: 16th Annual Applied Power Electronics Conference - APEC 2001 at Anaheim, CA on March 4-8, 2001

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2002 International Mechanical Engineering Congress and Exposition.

By: H. Ye*, C. Basaran* & D. Hopkins*

Event: ASME 2002 International Mechanical Engineering Congress and Exposition

Sources: Crossref, ORCID
Added: September 5, 2021

2002 journal article

Sphinx parallelization

Dept. of Computer Science, University of Illinois, Tech. Rep. UIUCDCS.

By: L. Baugh, J. Renau, J. Tuck & J. Torrellas

Source: ORCID
Added: August 18, 2021

2002 journal article

Morphable multithreaded memory tiles (M3T) architecture

University of Illinois UIUC-CS Technical Report.

By: J. Renau, J. Tuck, W. Liu & J. Torrellas

Source: ORCID
Added: August 18, 2021

2002 report

Sphinx Parallelization

By: J. Tuck, L. Baugh, J. Renau & J. Torrellas

Source: ORCID
Added: August 18, 2021

2002 report

Using Performance Bounds to Guide Pre-scheduling Code Optimizations

[Technical Report,]. Raleigh, NC: Department of Electrical and Computer Engineering, North Carolina State University.

By: H. Zhou & T. Conte

Source: NC State University Libraries
Added: February 20, 2021

2002 conference paper

Smooth orthogonal signal extensions for paraunitary tree-structured filter banks

ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings, 2. http://www.scopus.com/inward/record.url?eid=2-s2.0-0036297198&partnerID=MN8TOARS

By: M. Jiménez & N. Prelcic

Contributors: M. Jiménez & N. Prelcic

Source: ORCID
Added: October 8, 2020

2002 conference paper

Polynomial extension method for size-limited paraunitary filter banks

European Signal Processing Conference, 2002-March. http://www.scopus.com/inward/record.url?eid=2-s2.0-84960896268&partnerID=MN8TOARS

By: M. Jimenez & N. Prelcic

Contributors: M. Jimenez & N. Prelcic

Source: ORCID
Added: October 8, 2020

Citation Index includes data from a number of different sources. If you have questions about the sources of data in the Citation Index or need a set of data which is free to re-distribute, please contact us.

Certain data included herein are derived from the Web of Science© and InCites© (2024) of Clarivate Analytics. All rights reserved. You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.