Electrical and Computer Engineering

Works Published in 2016

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Displaying works 21 - 40 of 548 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2016 conference paper

Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics

Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.

By: X. Zhao, B. Gao & D. Hopkins

Event: Electronics Packaging Symposium & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.

By: X. Zhao, H. Ke, Y. Jiang, A. Morgan, Y. Xu & D. Hopkins

Event: 49th International Symposium on Microelectronics at Pasadena, CA on October 10-13, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 journal article

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

By: X. Zhao n, H. Ke n, Y. Jiang n, A. Morgan n, Y. Xu n & D. Hopkins n

co-author countries: United States of America 🇺🇸
Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

co-author countries: United States of America 🇺🇸

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: B. Gao & D. Hopkins*

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 journal article

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

co-author countries: United States of America 🇺🇸
Sources: Crossref, ORCID
Added: September 5, 2021

2016 article

Languages and Compilers for Parallel Computing: 28th International Workshop, LCPC 2015, Raleigh, NC, USA, September 9-11, 2015, Revised Selected Papers

Springer.

By: X. Shen, F. Mueller & J. Tuck

Source: ORCID
Added: August 18, 2021

2016 journal article

Lightweight runtime checking of C programs with RTC

Computer Languages, Systems & Structures, 45, 191–203.

By: R. Milewicz, R. Vanka, J. Tuck, D. Quinlan & P. Pirkelbauer

Source: ORCID
Added: August 18, 2021

2016 journal article

Minimizing axial dispersion in narrow packed column using superhydrophobic wall

Korean Journal of Chemical Engineering, 33(12), 3337–3342.

co-author countries: India 🇮🇳

Contributors: T. Saha*, S. Kumar* & S. Bhaumik*

author keywords: Axial Dispersion; Narrow Packed Column; Superhydrophobic Wall; Residence Time Distribution; Slip
Source: ORCID
Added: April 8, 2021

2016 journal article

A review of maximum power-point tracking techniques for photovoltaic systems

International Journal of Sustainable Energy, 35(5), 478–501.

By: A. Anurag*, S. Bal*, S. Sourav* & M. Nanda*

co-author countries: Switzerland 🇨🇭 India 🇮🇳 Singapore 🇸🇬
author keywords: maximum power-point tracking techniques; PV array; renewable energy; power electronics
Sources: Crossref, ORCID
Added: March 21, 2021

2016 conference paper

Selective GPU Cache Bypassing for Un-Coalesced Loads

In X. Liao (Ed.), 22nd IEEE International Conference on Parallel and Distributed Systems : ICPADS 2016 : proceedings : 13-16 December 2016, Wuhan, Hubei, China.

co-author countries: China 🇨🇳

Ed(s): X. Liao

Event: 22nd IEEE International Conference on Parallel and Distributed Systems at Wuhan, Hubei, China on December 13-16, 2016

Sources: NC State University Libraries, ORCID
Added: January 30, 2021

2016 conference paper

All-printed wearable electrochemical sensors and biofuel cells

Abstracts of Papers of the American Chemical Society, 251.

By: A. Bandodkar & J. Wang

Event: 251st American Chemical Society National Meeting at San Diego, California on March 13-17, 2016

Source: NC State University Libraries
Added: January 17, 2021

2016 thesis

Printed Wearable Electrochemical Sensors for Healthcare Monitoring

(PhD dissertation, University of California, San Diego). https://escholarship.org/uc/item/3nf886hp

By: A. Bandodkar

Source: NC State University Libraries
Added: January 17, 2021

2016 journal article

Novel Materials-Based Stretchable and Self-Healing Electrochemical Sensors for Wearable Applications

ECS Meeting Abstracts.

Amay Bandodkar

Sources: Crossref, ORCID
Added: January 5, 2021

2016 journal article

Review—Wearable Biofuel Cells: Past, Present and Future

Journal of The Electrochemical Society, 164(3), H3007–H3014.

By: A. Bandodkar*

co-author countries: United States of America 🇺🇸
Sources: Crossref, ORCID
Added: January 5, 2021

2016 journal article

All-printed magnetically self-healing electrochemical devices

Science Advances, 2(11), e1601465.

By: A. Bandodkar*, C. López*, A. Vinu Mohan*, L. Yin*, R. Kumar* & J. Wang*

co-author countries: United States of America 🇺🇸

Contributors: A. Bandodkar*, C. López*, A. Mohan*, L. Yin*, R. Kumar* & J. Wang*

Sources: Crossref, ORCID
Added: January 5, 2021

2016 journal article

Advanced Materials for Printed Wearable Electrochemical Devices: A Review

Advanced Electronic Materials, 3(1), 1600260.

By: J. Kim*, R. Kumar*, A. Bandodkar* & J. Wang*

co-author countries: United States of America 🇺🇸
Sources: Crossref, ORCID
Added: November 24, 2020

2016 journal article

Fault contribution from large photovoltaic systems in building power supply networks

Journal of Building Engineering, 5, 222–230.

co-author countries: Australia 🇦🇺
author keywords: Fault current; Inverter; Insulated Gate Bipolar Transistor (IGBT); Air circuit breaker (ACB); Moulded case circuit breaker (MCCB); Main distribution board (MDB); Photovoltaic (PV) system; Time current coordination (TCC)
Sources: Crossref, ORCID
Added: November 20, 2020

2016 conference paper

Wearable chemical sensors: Opportunities and challenges

2016 IEEE International Symposium on Circuits and Systems (ISCAS), 2016-July, 1122–1125.

co-author countries: United States of America 🇺🇸

Contributors: S. Imani*, P. Mercier*, A. Bandodkar*, J. Kim* & J. Wang*

Event: 2016 IEEE International Symposium on Circuits and Systems (ISCAS)

Sources: Crossref, ORCID
Added: October 30, 2020

2016 journal article

Noninvasive Alcohol Monitoring Using a Wearable Tattoo-Based Iontophoretic-Biosensing System

ACS Sensors, 1(8), 1011–1019.

co-author countries: United States of America 🇺🇸

Contributors: J. Kim*, I. Jeerapan*, S. Imani*, T. Cho*, A. Bandodkar*, S. Cinti*, P. Mercier*, J. Wang*

author keywords: sweat alcohol; tattoo sensor; wearable; wireless electronics; iontophoresis
Sources: Crossref, ORCID
Added: October 30, 2020

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