Electrical & Computer Engineering

College of Engineering

Works Published in 2010

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2010 chapter

An Evaluation of the Flywheel Potential for Providing Regulation Service in California

In Ieee Power and Energy Society General Meeting 2010.

By: N. Lu, M. Weimar, Y. Makarov, F. Rudolph, S. Murthy, J. Arseneaux, C. Loutan, Ieee

Source: ORCID
Added: May 6, 2019

2010 conference paper

Packaging of large and low-pitch size 2D ultrasonic transducer arrays

Proceedings of the 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), 508–511.

By: D. Lin, X. Zhuang, R. Wodnicki, C. Woychik, M. Kupnik, Ö. Oralkan, B. Khuri-Yakub

Event: 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010)

Sources: Crossref, ORCID
Added: April 24, 2019

2010 conference paper

Thermal Investigatoin of Tier Swapping to Improve the Thermal Profile of Memory-on-Logic 3DICs

IEEE THERMINIC, 1–6.

By: S. Melamed, T. Thorolfsson, A. Srinivasan, E. Cheng, P. Franozn & W. Davis

Source: NC State University Libraries
Added: April 11, 2019

2010 conference paper

The NCSU Tezzaron design kit

2010 IEEE International 3D Systems Integration Conference (3DIC), 1–15.

By: S. Lipa, T. Thorolfsson & P. Franzon

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: April 11, 2019

2010 conference paper

Creating 3D specific systems: Architecture, design and CAD

2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010). Presented at the 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010).

By: P. Franzon, W. Davis & T. Thorolffson

Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE

19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems. Presented at the 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

By: B. Su, W. Pitts, P. Franzon & J. Wilson

Event: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Logic-on-logic 3D integration and placement

2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).

By: T. Thorolfsson, G. Luo, J. Cong & P. Franzon

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications

2010 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2010 IEEE International 3D Systems Integration Conference (3DIC).

By: P. Franzon, J. Wilson & M. Li

Event: 2010 IEEE International 3D Systems Integration Conference (3DIC)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Miniaturized ultrasound imaging probes enabled by CMUT arrays with integrated frontend electronic circuits

2010 Annual International Conference of the IEEE Engineering in Medicine and Biology. Presented at the 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2010).

By: B. Khuri-Yakub, O. Oralkan, A. Nikoozadeh, I. Wygant, S. Zhuang, M. Gencel, J. Choe, D. Stephens ...

Event: 2010 32nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2010)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Simulating capacitive micromachined ultrasonic transducers (CMUTs) using field II

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 International Ultrasonics Symposium.

By: D. Baek, O. Oralkan, M. Kupnik, M. Willatzen, B. Khuri-Yakub & J. Jensen

Event: 2010 International Ultrasonics Symposium

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Monitoring radiofrequency catheter ablation using thermal strain imaging

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).

By: C. Seo, D. Stephens, J. Cannata, A. Dentinger, F. Lin, S. Park, D. Wildes, K. Thomenius ...

Event: 2010 IEEE Ultrasonics Symposium (IUS)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Design optimization for a 2-D sparse transducer array for 3-D ultrasound imaging

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).

By: J. Choe, O. Oralkan & P. Khuri-Yakub

Event: 2010 IEEE Ultrasonics Symposium (IUS)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

3-D Deep penetration photoacoustic imaging with a 2-D CMUT array

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).

By: T. Ma, S. Kothapalli, S. Vaithilingam, O. Oralkan, A. Kamaya, I. Wygant, X. Zhuang, S. Gambhir ...

Event: 2010 IEEE Ultrasonics Symposium (IUS)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Forward-looking intracardiac imaging catheters using fully integrated CMUT arrays

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 IEEE Ultrasonics Symposium (IUS).

By: A. Nikoozadeh, O. Oralkan, M. Gencel, J. Choe, D. Stephens, A. de la Rama, P. Chen, F. Lin ...

Event: 2010 IEEE Ultrasonics Symposium (IUS)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Ultrasound compatible RF ablation electrode design for catheter based guidance of RF ablation — In vivo results with thermal strain imaging

2010 IEEE International Ultrasonics Symposium. Presented at the 2010 International Ultrasonics Symposium.

By: D. Stephens, J. Cannata, C. Seo, J. Jeong, E. Sun, W. Cao, A. Nikoozadeh, O. Oralkan ...

Event: 2010 International Ultrasonics Symposium

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Highly sensitive detection of DMMP using a CMUT-based chemical sensor

2010 IEEE Sensors. Presented at the 2010 Ninth IEEE Sensors Conference (SENSORS 2010).

By: H. Lee, K. Park, M. Kupnik, O. Oralkan & B. Khuri-Yakub

Event: 2010 Ninth IEEE Sensors Conference (SENSORS 2010)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Zero-bias resonant sensor with an oxide-nitride layer as charge trap

2010 IEEE Sensors. Presented at the 2010 Ninth IEEE Sensors Conference (SENSORS 2010).

By: K. Park, M. Kupnik, H. Lee, O. Oralkan & B. Khuri-Yakub

Event: 2010 Ninth IEEE Sensors Conference (SENSORS 2010)

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Spectrum Aware Opportunistic Routing in Cognitive Radio Networks

2010 IEEE Global Telecommunications Conference GLOBECOM 2010. Presented at the GLOBECOM 2010 - 2010 IEEE Global Communications Conference.

By: S. Lin & K. Chen

Event: GLOBECOM 2010 - 2010 IEEE Global Communications Conference

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Optimal placement of PMUs for identification of power system models using noisy measurement data

IEEE PES General Meeting. Presented at the Energy Society General Meeting.

By: A. Chakrabortty & M. Szczodrak

Event: Energy Society General Meeting

Sources: Crossref, ORCID
Added: March 24, 2019

2010 conference paper

Building a dynamic electromechanical model for the pacific AC intertie using PMU measurements

IEEE PES General Meeting. Presented at the Energy Society General Meeting.

By: A. Chakrabortty & A. Salazar

Event: Energy Society General Meeting

Sources: Crossref, ORCID
Added: March 24, 2019