Displaying works 61 - 80 of 485 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2019 conference paper
Comparison of 10/20/40 GHz Quadrature VCOs for W-band FMCW Radar Systems in 90nm SiGe BiCMOS Technology
2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019.
Contributors: W. Wang n & B. Floyd n
2019 conference paper
Energy Consumption Analysis of Electric Three Wheelers in Bangladesh
2019 IEEE International Conference on Power, Electrical, and Electronics and Industrial Applications (PEEIACON). Presented at the 2019 IEEE International Conference on Power, Electrical, and Electronics and Industrial Applications (PEEIACON), Dhaka, Bangladesh.
Event: 2019 IEEE International Conference on Power, Electrical, and Electronics and Industrial Applications (PEEIACON) at Dhaka, Bangladesh on November 29 - December 1, 2019
2019 conference paper
Bi–Directional Solid-State Circuit Breaker for MV Applications Based on SuperCascode Switching
Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, February 12). Presented at the Power America Annual Meeting, Raleigh, NC.
Event: Power America Annual Meeting at Raleigh, NC on February 12-14, 2019
2019 conference paper
Trends in Power Electronics Packaging
Hopkins, D. C. (2019, April 10). Tutorial presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM Systems Center Annual Research Symposium at Raleigh, NC on April 10-12, 2019
2019 conference paper
New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency
Morgan, A., Kanale, A., Han, K., Baliga, J., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM Systems Center Annual Research Symposium at Raleigh, NC on April 10-12, 2019
2019 conference paper
High Frequency Self-Oscillating WBG-based Power Conversion
Morgan, A., Gao, B., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.
Event: FREEDM Systems Center Annual Research Symposium at Raleigh, NC on April 10-12, 2019
2019 conference paper
ERCD Power Stage Characterization for MV SSCB Application
Sinha, S. S., Ballard, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.
Event: Power America Summer Workshop at Raleigh, NC on August 6-8, 2019
2019 conference paper
Development of a High Frequency LLC Resonant Converter for Investigation of MLCCs for EV applications
Guven, M., Gao, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.
Event: Power America Summer Workshop at Raleigh, NC on August 6-8, 2019
2019 conference paper
WBG Solid State Circuit Protection using 10kV/200 A Super Cascode power module
Mehrotra, U., & Hopkins, D. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.
Event: Power America Summer Workshop 2019 at Raleigh, NC on August 6-8, 2019
2019 conference paper
Opportunities in Power Applications using Epoxy Resin Composite Dielectrics
Hopkins, D., & Ballard, B. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.
Event: Power America Summer Workshop 2019 at Raleigh, NC on August 6-8, 2019
2019 conference paper
Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging
Cheng, T.-H., Gao, B., Boteler, L., & Hopkins, D. (2019, November 13). Presented at the PCB Carolina, Raleigh, NC.
Event: PCB Carolina at Raleigh, NC on November 13, 2019
2019 conference paper
Power Packaging Assembly Challenges
Hopkins, D. C. (2019, March 27). Invited keynote presented at the A.R.E.A. Consortium Meeting Universal Instruments, Binghamton, NY.
Event: A.R.E.A. Consortium Meeting Universal Instruments at Binghamton, NY on March 27-29, 2019
2019 conference paper
1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop
Kanale, A., Cheng, T.-H., Hanl, K., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2019, September 29). Presented at the International Conference on Silicon Carbide and Related Materials, Kyoto, Japan.
Event: International Conference on Silicon Carbide and Related Materials at Kyoto, Japan on September 29 - October 4, 2019
2019 conference paper
Characterization of a Topside Cooled Epoxy-Resin Composite Dielectric (ERCD) Package for Bi-Directional Power Switch
Cheng, T.-H., Gao, B., Nishiguchi, K., & Hopkins, D. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.
Event: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) at Anaheim, CA on October 7-9, 2019
2019 conference paper
Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging
Hopkins, D. C., Cheng, T.-H., Gao, B., & Boteler, L. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.
Event: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) at Anaheim, CA on October 7-9, 2019
2019 conference paper
Designing for Switching Stresses in a Circuit Breaker Application using SiC Semiconductors
Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, October 29). Tutorial presented at the 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA, Raleigh, NC.
Event: 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA at Raleigh, NC on October 29-31, 2019
2019 conference paper
Design and Integration of WBG Solid State Circuit Protection
Hopkins, D. C., Ballard, B., & Mehrotra, U. (2019, March 17). Tutorial presented at the IEEE Applied Power Electronics Conference, Anaheim, CA.
Event: IEEE Applied Power Electronics Conference at Anaheim, CA on March 17-21, 2019
2019 report
Edge Interconnect Packaging of Integrated Circuits for Power Systems
(US Patent No. 10,325,875B2).
2019 conference paper
Thermal Characteristics and Simulation of an Integrated GaN eHEMT Power Module
2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). Presented at the 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe).
Event: 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)
2019 conference paper
A High-Bandwidth Resistive Current Sensing Technology for Breakers and Desaturation Protection
2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).
Event: 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)
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