Electrical and Computer Engineering

Works Published in 2019

copy embed code
Copy Embed Code Experiment

You can embed this resource into your own website. To do so, either use the code generated by us, or use the link and tweak the rest to your preferences. Copy the respective code or link below.

Displaying works 61 - 80 of 479 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2019 conference paper

ERCD Power Stage Characterization for MV SSCB Application

Sinha, S. S., Ballard, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

By: S. Sinha, B. Ballard & D. Hopkins

Event: Power America Summer Workshop at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Development of a High Frequency LLC Resonant Converter for Investigation of MLCCs for EV applications

Guven, M., Gao, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

By: M. Guven, B. Gao & D. Hopkins

Event: Power America Summer Workshop at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

WBG Solid State Circuit Protection using 10kV/200 A Super Cascode power module

Mehrotra, U., & Hopkins, D. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

By: U. Mehrotra & D. Hopkins

Event: Power America Summer Workshop 2019 at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Opportunities in Power Applications using Epoxy Resin Composite Dielectrics

Hopkins, D., & Ballard, B. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

By: D. Hopkins & B. Ballard

Event: Power America Summer Workshop 2019 at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Cheng, T.-H., Gao, B., Boteler, L., & Hopkins, D. (2019, November 13). Presented at the PCB Carolina, Raleigh, NC.

By: T. Cheng, B. Gao, L. Boteler & D. Hopkins

Event: PCB Carolina at Raleigh, NC on November 13, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Power Packaging Assembly Challenges

Hopkins, D. C. (2019, March 27). Invited keynote presented at the A.R.E.A. Consortium Meeting Universal Instruments, Binghamton, NY.

By: D. Hopkins

Event: A.R.E.A. Consortium Meeting Universal Instruments at Binghamton, NY on March 27-29, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop

Kanale, A., Cheng, T.-H., Hanl, K., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2019, September 29). Presented at the International Conference on Silicon Carbide and Related Materials, Kyoto, Japan.

By: A. Kanale, T. Cheng, K. Hanl, B. Baliga, S. Bhattacharya & D. Hopkins

Event: International Conference on Silicon Carbide and Related Materials at Kyoto, Japan on September 29 - October 4, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Characterization of a Topside Cooled Epoxy-Resin Composite Dielectric (ERCD) Package for Bi-Directional Power Switch

Cheng, T.-H., Gao, B., Nishiguchi, K., & Hopkins, D. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

By: T. Cheng, B. Gao, K. Nishiguchi & D. Hopkins

Event: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) at Anaheim, CA on October 7-9, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Hopkins, D. C., Cheng, T.-H., Gao, B., & Boteler, L. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

By: D. Hopkins, T. Cheng, B. Gao & L. Boteler

Event: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) at Anaheim, CA on October 7-9, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Designing for Switching Stresses in a Circuit Breaker Application using SiC Semiconductors

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, October 29). Tutorial presented at the 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA, Raleigh, NC.

By: B. Ballard, U. Mehrotra & D. Hopkins

Event: 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA at Raleigh, NC on October 29-31, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Design and Integration of WBG Solid State Circuit Protection

Hopkins, D. C., Ballard, B., & Mehrotra, U. (2019, March 17). Tutorial presented at the IEEE Applied Power Electronics Conference, Anaheim, CA.

By: D. Hopkins, B. Ballard & U. Mehrotra

Event: IEEE Applied Power Electronics Conference at Anaheim, CA on March 17-21, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 report

Edge Interconnect Packaging of Integrated Circuits for Power Systems

(US Patent No. 10,325,875B2).

By: J. Kulick & D. Hopkins

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Thermal Characteristics and Simulation of an Integrated GaN eHEMT Power Module

2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). Presented at the 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe).

By: A. Jorgensen*, T. Cheng n, D. Hopkins n, S. Beczkowski*, C. Uhrenfeldt* & S. Munk-Nielsen*

co-author countries: Denmark 🇩🇰 United States of America 🇺🇸

Event: 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Sources: Crossref, ORCID
Added: September 5, 2021

2019 conference paper

A High-Bandwidth Resistive Current Sensing Technology for Breakers and Desaturation Protection

2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

co-author countries: United States of America 🇺🇸

Event: 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)

Sources: Crossref, ORCID
Added: September 5, 2021

2019 report

Flexible Large Power Solid State Transformer (FLP-SST)

By: S. Bhattacharya n

co-author countries: United States of America 🇺🇸
Source: ORCID
Added: September 5, 2021

2019 conference paper

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

2019 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2019 IEEE Applied Power Electronics Conference and Exposition (APEC).

By: A. Morgan n, A. Kanale n, K. Han n, J. Baliga n & D. Hopkins n

co-author countries: United States of America 🇺🇸

Event: 2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

Sources: Crossref, ORCID
Added: August 30, 2021

2019 journal article

Dynamic modelling of the iron deficiency modulated transcriptome response in Arabidopsis thaliana roots

In Silico Plants, 1(1), diz005.

By: A. Koryachko, A. Matthiadis, S. Haque, D. Muhammad, J. Ducoste, J. Tuck, T. Long, C. Williams

Source: ORCID
Added: August 18, 2021

2019 journal article

Dynamic DNA-based information storage

BioRxiv, 836429.

By: K. Lin, A. Keung & J. Tuck

Source: ORCID
Added: August 18, 2021

2019 conference paper

A Wearable Wrist-Band with Compressive Sensing based Ultra-Low Power Photoplethysmography Readout Circuit

2019 IEEE 16th International Conference on Wearable and Implantable Body Sensor Networks (BSN).

Parvez Ahmmed

Source: ORCID
Added: June 4, 2021

2019 report

Multiple-use renewable electrochemical sensors based on direct drawing of enzymatic inks

(US Patent No. 10,501,770).

By: J. Wang & A. Bandodkar

Source: NC State University Libraries
Added: April 8, 2021

Citation Index includes data from a number of different sources. If you have questions about the sources of data in the Citation Index or need a set of data which is free to re-distribute, please contact us.

Certain data included herein are derived from the Web of Science© and InCites© (2024) of Clarivate Analytics. All rights reserved. You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.