Electrical & Computer Engineering

Design Considerations of a Centralized Load Controller Using Thermostatically Controlled Appliances for Continuous Regulation Reserves

Ieee Transactions on Smart Grid, 4(2), 914–921.

Demand-side Management of Air Conditioning Cooling Loads for Intra-hour Load Balancing

In 2013 Ieee Pes Innovative Smart Grid Technologies. http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000320500800116&KeyUID=WOS:000320500800116

A Comparison of Forecast Error Generators for Modeling Wind and Load Uncertainty

In 2013 Ieee Power and Energy Society General Meeting. http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000331874303159&KeyUID=WOS:000331874303159

A 60 GHz Doherty power amplifier with 14% PAE at 6-dB back off

Proceedings SRC Techcon Conference.

Spin logic via controlled correlation in a topological insulator-nanomagnet hybrid structure

71st Device Research Conference. Presented at the 2013 71st Annual Device Research Conference (DRC).

Rationale for a 3D heterogeneous multi-core processor

2013 IEEE 31st International Conference on Computer Design (ICCD), 154–168.

Design and test of 2.5D and 3D stacked ICs

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

Applications and design styles for 3DIC

2013 IEEE International Electron Devices Meeting. Presented at the 2013 IEEE International Electron Devices Meeting (IEDM), Washington, DC.

3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers. Presented at the 2013 IEEE International Solid-State Circuits Conference (ISSCC 2013).

GPU-based real-time imaging software suite for medical ultrasound

2013 IEEE International Ultrasonics Symposium (IUS). Presented at the 2013 IEEE International Ultrasonics Symposium (IUS).

A 32×32 integrated CMUT array for volumetric ultrasound imaging

2013 IEEE International Ultrasonics Symposium (IUS). Presented at the 2013 IEEE International Ultrasonics Symposium (IUS).

Small-world networks empowered large machine-to-machine communications

2013 IEEE Wireless Communications and Networking Conference (WCNC). Presented at the 2013 IEEE Wireless Communications and Networking Conference (WCNC).

End-to-end delay reduction via in-network computation in cognitive radio sensor networks

2013 IEEE Global Communications Conference (GLOBECOM). Presented at the 2013 IEEE Global Communications Conference (GLOBECOM 2013).

Multi-dimensional wide-area visualization of power system dynamics using Synchrophasors

2013 IEEE Power & Energy Society General Meeting. Presented at the 2013 IEEE Power & Energy Society General Meeting.

A multi-user network testbed for wide-area monitoring and control of power systems using distributed synchrophasors

Proceedings of the the fourth international conference on Future energy systems - e-Energy '13. Presented at the the the fourth international conference.

A study on group communication in distributed wide-area measurement system networks in large power systems

2013 IEEE Global Conference on Signal and Information Processing. Presented at the 2013 IEEE Global Conference on Signal and Information Processing (GlobalSIP).

Many-Body Effects in Valleytronics: Direct Measurement of Valley Lifetimes in Single-Layer MoS2

Nano Letters, 14(1), 202–206.

Innovations in Ultrasound Instrumentation for Image Guidance

In Intraoperative Imaging and Image-Guided Therapy (pp. 163–171).

Precise Neural Stimulation in the Retina Using Focused Ultrasound

Journal of Neuroscience, 33(10), 4550–4560.

A comparison between conventional and collapse-mode capacitive micromachined ultrasonic transducers in 10-MHz 1-D arrays

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 60(6), 1245–1255.