College of Engineering
Displaying works 81 - 100 of 426 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2021 article
Advanced Secure DNS Name Autoconfiguration with Authentication for Enterprise IoT Network
2021 IEEE GLOBAL COMMUNICATIONS CONFERENCE (GLOBECOM).
2021 article
SPICE Modeling and CMOS Circuit Development of a SiC Power IC Technology
2021 IEEE INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS), pp. 966–969.
2021 article
Critical Design Considerations for Static and Dynamic Performances on 6.5 kV 4H-SiC MOSFETs Fabricated in a 6-inch SiC Foundry
2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), pp. 361–365.
2021 article
Development of Isolated CMOS and HV MOSFET on an N- epi/P- epi/4H-SiC N+ Substrate for Power IC Applications
2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), pp. 118–122.
2021 article
Comparison of the Capacitances and Switching Losses of 1.2 kV Common-Source and Common-Drain Bidirectional Switch Topologies
2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), pp. 112–117.
2021 article
Excellent Static and Dynamic Scaling of Power Handling Capability of the BaSIC(DMM) Topology with 1.2 kV SiC Power MOSFETs
2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), pp. 14–17.
2021 article
Analytical Method to Optimize the Cascaded SuperCascode Power Switch Balancing Network
2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), pp. 107–111.
2021 article
Performance Evaluation of 3.3 kV SiC MOSFET and Schottky Diode for Medium Voltage Current Source Inverter Application
2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), pp. 366–371.
2021 article
Multi-ANN embedded system based on a custom 3D-DRAM
2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).
2021 article
A Review of 3D-Dynamic Random-Access Memory based Near-Memory Computation
2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).
2021 article
A Virtual Platform for Object Detection Systems
2021 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC).
2021 article
Exploring Thread Coarsening on FPGA
2021 IEEE 28TH INTERNATIONAL CONFERENCE ON HIGH PERFORMANCE COMPUTING, DATA, AND ANALYTICS (HIPC 2021), pp. 436–441.
2021 article
PILOT: a Runtime System to Manage Multi-tenant GPU Unified Memory Footprint
2021 IEEE 28TH INTERNATIONAL CONFERENCE ON HIGH PERFORMANCE COMPUTING, DATA, AND ANALYTICS (HIPC 2021), pp. 442–447.
2021 article
Novel 3D-printed Electrodes for Implantable Biopotential Monitoring
2021 43RD ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE & BIOLOGY SOCIETY (EMBC), pp. 7120–7123.
2021 article
Investigating the Relationship between Cough Detection and Sampling Frequency for Wearable Devices
2021 43RD ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE & BIOLOGY SOCIETY (EMBC), pp. 7103–7107.
2021 article
Preliminary Evaluation of a Solar-Powered Wristband for Continuous Multi-Modal Electrochemical Monitoring
2021 43RD ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE & BIOLOGY SOCIETY (EMBC), pp. 7316–7319.
2021 article
Toward Automated Analysis of Fetal Phonocardiograms: Comparing Heartbeat Detection from Fetal Doppler and Digital Stethoscope Signals
2021 43RD ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE & BIOLOGY SOCIETY (EMBC), pp. 975–979.
2021 article
A Wearable Patch for Prolonged Sweat Lactate Harvesting and Sensing
2021 43RD ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE & BIOLOGY SOCIETY (EMBC), pp. 6863–6866.
2021 article
Simultaneous Localization of Biobotic Insects using Inertial Data and Encounter Information
2021 43RD ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE & BIOLOGY SOCIETY (EMBC), pp. 4649–4653.
2021 article
Modular Power Flow Enhancer for Transmission Networks under Unbalanced Power Grid Conditions
IECON 2021 - 47TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY.