Electrical and Computer Engineering

Works Published in 2013

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Displaying works 141 - 160 of 383 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2013 conference paper

Spin logic via controlled correlation in a topological insulator-nanomagnet hybrid structure

71st Device Research Conference. Presented at the 2013 71st Annual Device Research Conference (DRC).

By: X. Duan n, Y. Semenov n & K. Kim n

co-author countries: United States of America 🇺🇸

Event: 2013 71st Annual Device Research Conference (DRC)

Source: Crossref
Added: March 29, 2019

2013 conference paper

Rationale for a 3D heterogeneous multi-core processor

2013 IEEE 31st International Conference on Computer Design (ICCD), 154–168.

By: E. Rotenberg n, B. Dwiel n, E. Forbes n, Z. Zhang n, R. Widialaksono n, R. Chowdhury n, N. Tshibangu n, S. Lipa n ...

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE 31st International Conference on Computer Design (ICCD) at Asheville, NC on October 6-9, 2013

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2013 conference paper

Design and test of 2.5D and 3D stacked ICs

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems. Presented at the 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

By: P. Franzon n

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

Applications and design styles for 3DIC

2013 IEEE International Electron Devices Meeting. Presented at the 2013 IEEE International Electron Devices Meeting (IEDM), Washington, DC.

By: P. Franzon n, E. Rotenberg n, J. Tuck n, W. Davis n, H. Zhou n, J. Schabel n, Z. Zhang n, J. Park n ...

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE International Electron Devices Meeting (IEDM) at Washington, DC on December 9-11, 2013

Sources: Crossref, ORCID, NC State University Libraries
Added: March 24, 2019

2013 conference paper

3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers. Presented at the 2013 IEEE International Solid-State Circuits Conference (ISSCC 2013).

By: A. Bhuyan*, J. Choe*, B. Lee*, I. Wygant*, A. Nikoozadeh*, O. Oralkan n, B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE International Solid-State Circuits Conference (ISSCC 2013)

Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

GPU-based real-time imaging software suite for medical ultrasound

2013 IEEE International Ultrasonics Symposium (IUS). Presented at the 2013 IEEE International Ultrasonics Symposium (IUS).

By: J. Choe*, A. Nikoozadeh*, O. Oralkan n & B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE International Ultrasonics Symposium (IUS)

author keywords: Real-time imaging; Volumetric imaging; GPU; CMUT
Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

A 32×32 integrated CMUT array for volumetric ultrasound imaging

2013 IEEE International Ultrasonics Symposium (IUS). Presented at the 2013 IEEE International Ultrasonics Symposium (IUS).

By: A. Bhuyan*, C. Chang*, J. Choe*, B. Lee*, A. Nikoozadeh*, O. Oralkan n, B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE International Ultrasonics Symposium (IUS)

author keywords: 3D volumetric imaging; capacitive micromachined ultrasonic transducer (CMUT); 2D array; phased array imaging; ultrasound; real-time; flip-chip bonding; integrated circuits
Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

Small-world networks empowered large machine-to-machine communications

2013 IEEE Wireless Communications and Networking Conference (WCNC). Presented at the 2013 IEEE Wireless Communications and Networking Conference (WCNC).

co-author countries: China 🇨🇳 Taiwan, Province of China 🇹🇼 United States of America 🇺🇸

Event: 2013 IEEE Wireless Communications and Networking Conference (WCNC)

Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

End-to-end delay reduction via in-network computation in cognitive radio sensor networks

2013 IEEE Global Communications Conference (GLOBECOM). Presented at the 2013 IEEE Global Communications Conference (GLOBECOM 2013).

By: S. Lin*

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE Global Communications Conference (GLOBECOM 2013)

Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

Multi-dimensional wide-area visualization of power system dynamics using Synchrophasors

2013 IEEE Power & Energy Society General Meeting. Presented at the 2013 IEEE Power & Energy Society General Meeting.

By: S. Thakur* & A. Chakrabortty n

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE Power & Energy Society General Meeting

Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

A multi-user network testbed for wide-area monitoring and control of power systems using distributed synchrophasors

Proceedings of the the fourth international conference on Future energy systems - e-Energy '13. Presented at the the the fourth international conference.

By: M. Weiss n, A. Chakrabortty n & Y. Xin*

co-author countries: United States of America 🇺🇸

Event: the the fourth international conference

Sources: Crossref, ORCID
Added: March 24, 2019

2013 conference paper

A study on group communication in distributed wide-area measurement system networks in large power systems

2013 IEEE Global Conference on Signal and Information Processing. Presented at the 2013 IEEE Global Conference on Signal and Information Processing (GlobalSIP).

By: Y. Xin* & A. Chakrabortty n

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE Global Conference on Signal and Information Processing (GlobalSIP)

Sources: Crossref, ORCID
Added: March 24, 2019

2013 journal article

Many-Body Effects in Valleytronics: Direct Measurement of Valley Lifetimes in Single-Layer MoS2

Nano Letters, 14(1), 202–206.

By: C. Mai n, A. Barrette n, Y. Yu n, Y. Semenov n, K. Kim n, L. Cao n, K. Gundogdu n

co-author countries: United States of America 🇺🇸
author keywords: MoS2; valley relaxation; transient absorption; many-body interactions; transition metal dichalcogenides; two-dimensional materials
Source: Crossref
Added: March 19, 2019

2013 chapter

Innovations in Ultrasound Instrumentation for Image Guidance

In Intraoperative Imaging and Image-Guided Therapy (pp. 163–171).

By: P. Khuri-Yakub*, Ö. Oralkan n & A. Nikoozadeh*

co-author countries: United States of America 🇺🇸
Sources: Crossref, ORCID
Added: March 18, 2019

2013 journal article

Precise Neural Stimulation in the Retina Using Focused Ultrasound

Journal of Neuroscience, 33(10), 4550–4560.

By: M. Menz*, O. Oralkan*, P. Khuri-Yakub* & S. Baccus*

co-author countries: United States of America 🇺🇸
MeSH headings : Ambystoma; Animals; Biophysics; Cadmium Chloride / pharmacology; Female; In Vitro Techniques; Male; Membrane Potentials / drug effects; Membrane Potentials / physiology; Membrane Potentials / radiation effects; Neurons / drug effects; Neurons / physiology; Neurons / radiation effects; Photic Stimulation; Retina / cytology; Sound; Visual Pathways / drug effects; Visual Pathways / physiology; Visual Pathways / radiation effects
Sources: Crossref, ORCID
Added: March 9, 2019

2013 journal article

A comparison between conventional and collapse-mode capacitive micromachined ultrasonic transducers in 10-MHz 1-D arrays

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 60(6), 1245–1255.

co-author countries: United States of America 🇺🇸
MeSH headings : Equipment Design; Finite Element Analysis; Microtechnology / instrumentation; Transducers; Ultrasonography / instrumentation
Sources: Crossref, ORCID
Added: March 9, 2019

2013 journal article

GPU-Based Real-Time Volumetric Ultrasound Image Reconstruction for a Ring Array

IEEE Transactions on Medical Imaging, 32(7), 1258–1264.

By: J. Choe*, A. Nikoozadeh*, O. Oralkan n & B. Khuri-Yakub*

co-author countries: United States of America 🇺🇸
author keywords: Capacitive micromachined ultrasonic transducer (CMUT); graphics processing unit (GPU); maximum intensity projection (MIP); real-time imaging; ring array; ultrasound imaging; volumetric imaging
MeSH headings : Computer Graphics; Equipment Design; Image Processing, Computer-Assisted / methods; Phantoms, Imaging; Signal Processing, Computer-Assisted; Software; Transducers; Ultrasonography / instrumentation; Ultrasonography / methods
Sources: Crossref, ORCID
Added: March 9, 2019

2013 journal article

Dynamic Response of Model Lipid Membranes to Ultrasonic Radiation Force

PLoS ONE, 8(10), e77115.

co-author countries: United States of America 🇺🇸

Ed(s): W. Phillips

MeSH headings : Electric Capacitance; Hydrodynamics; Lipid Bilayers / radiation effects; Patch-Clamp Techniques; Ultrasonography
Sources: Crossref, ORCID
Added: March 9, 2019

2013 chapter

Measurement-Based Methods for Model Reduction of Power Systems Using Synchrophasors

In Power Electronics and Power Systems (pp. 159–197).

co-author countries: United States of America 🇺🇸
Sources: Crossref, ORCID
Added: March 9, 2019

2013 journal article

Measurement Bounds for Sparse Signal Ensembles via Graphical Models

IEEE Transactions on Information Theory, 59(7), 4280–4289.

By: M. Duarte*, M. Wakin*, D. Baron n, S. Sarvotham* & R. Baraniuk*

co-author countries: United States of America 🇺🇸
author keywords: Compressive sensing (CS); random projections; signal ensembles; sparsity
Sources: Crossref, ORCID
Added: March 9, 2019