Electrical & Computer Engineering

Integration of Distributed Transient Measurement Technology into Power System, Control and Protection

In D. Rizy, W. Myers, L. Eilts, & C. Clemans (Eds.), Workshop on Real-Time Control and Operation of Electric Power Systems (pp. 149–159). Oak Ridge, TN: Oak Ridge National Laboratory.

A Measure of Relative Robustness for Feedforward Neural Networks Subject to Small Input Perturbations

International Journal of Neural Systems, 03(03), 291–299.

IVA-8 High-Speed InP/InGaAs p-n-p Heterojunction Bipolar Transistors

IEEE Transactions on Electron Devices, 39(11), 2659.

Optoelectronic applications of heterojunction bipolar transistor technology: promises and problems

Proceedings of SPIE - The International Society for Optical Engineering, 1680, 27–32.

Microwave multiple-state resonant tunneling bipolar transistors

Electron Device Letters, v(n), 219–221.

A 10 Gbit/s OEIC photoreceiver using InP/InGaAs heterojunction bipolar transistors

Electronics Letters, 28(5), 466–468.

IIA-3 p⁺ Polysilicon Emitters for Sub-0.5 µm High-Performance p-n-p

IEEE Transactions on Electron Devices, 39(11), 2637–2638.

On suboptimum detection for asynchronous code-division multiple access channels

Proceedings of the Conference on Information Sciences and Systems, 838–838. Princeton, NJ, USA.

Effect of N-Channel and P-Channel doping on the IV characteristics of Alinas-Gainas hemts

Institute of Physics Conference Series, 120, 287–292.

An efficient table-driven decoder for one-half rate convolutional codes

ACM-SE 30 Proceedings of the 30th annual Southeast regional conference, 116–123.

Ensemble Monte-Carlo simulation of electron-transport in GAAS N+ -N -N+ Structures with laterally varying doping

Proceedings of the 8th International Conference on the Numerical Analysis of Semiconductor Devices and Integrated Circuits, 125–126.

Introducing the through-line deembedding procedure

1992 IEEE MTT-S International Microwave Symposium Digest. Presented at the Albuquerque, NM, USA.

Cost/performance issues in multichip module packaging

Proceedings of the Japan International Conference on Microelectronics.

Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance

Proceedings of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 125–127.

Automating Design for Signal Integrity

Proceedings 1992 IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 10–13.

Tools to aid in Wiring Rule Generation for High Speed Interconnects

Proceedings 1992 Design Automation Conference, 466–471.

Confined phonon modes and hot-electron energy relaxation in semiconductor microstructures

Semiconductor Science and Technology, 7(3B), B60–B66.

Case Studies in Medical Instrument Design, Record of workshop held in conjunction with the '91 Annual Meeting

Orlando, FL: IEEE EMBS Society.

Application Of A Multi-level Ceramic Integrated Circuit Package For Epicardial Mapping

Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society. Presented at the Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society.

Flexible Electrode Array For Retinal Stimulation

Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society. Presented at the Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society.