College of Engineering
Displaying works 1 - 20 of 207 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2003 conference paper
On the optimum secrecy capacity of multiple relay networks
2014 17th International Conference on Computer and Information Technology, ICCIT 2014, 514–517.
2003 conference paper
Impact of underwater bandwidth on cross-correlation based node estimation technique
2014 17th International Conference on Computer and Information Technology, ICCIT 2014, 494–497.
2003 conference paper
Impact analysis of input and output block size of DCT-SCFDMA system
2014 17th International Conference on Computer and Information Technology, ICCIT 2014, 440–445.
2003 conference paper
Effect of node number in range based node localization technique for underwater communications network
2014 17th International Conference on Computer and Information Technology, ICCIT 2014, 413–417.
2003 conference paper
Analysis of PAPR reduction of DFT-SCFDMA system using different sub-carrier mapping schemes
2014 17th International Conference on Computer and Information Technology, ICCIT 2014, 435–439.
2003 chapter
Real-Time System-on-a-Chip Emulation
In G. Martin & H. Chang (Eds.), Winning the SoC Revolution (pp. 229–253).
Ed(s): G. Martin* & H. Chang *
2003 conference paper
Getting High-Performance Silicon from System-Level Design
IEEE Computer Society Annual Symposium on VLSI, 2003. Proceedings., 238–243.
Event: IEEE Computer Society Annual Symposium on VLSI at Tampa, FL on February 20-21, 2003
2003 journal article
500 Mb/s Soft Output Viterbi Decoder
IEEE Journal of Solid State Circuits, 38(7), 1234–1241.
2003 conference paper
Automated Design Flows for High-Performance Systems
Davis, W. R. (2003, February 11). Presented at the OpenAccess Conference, San Jose, CA.
Event: OpenAccess Conference at San Jose, CA on February 11, 2003
2003 speech
System-Level Design: Past, Present, and Future
Davis, W. R. (2003, February). Presented at the University of Tennessee ECE Department Seminar, Knoxville, TN.
Event: University of Tennessee ECE Department Seminar at Knoxville, TN
2003 conference paper
Wireless communications using integrated antennas
Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003, 111–113.
2003 conference paper
60GHz transceiver circuits in SiGe bipolar technology
Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 47. http://www.scopus.com/inward/record.url?eid=2-s2.0-2442715211&partnerID=MN8TOARS
2003 journal article
Measuring Joint Reliability: Applying the Moire Interferometry Technique
Advanced Microelectronics Magazine, 12(5), 17–20.
2003 journal article
Flip Chip and BGA Solder Joint Reliability
Advanced Packaging, 12(5), 17–19.
2003 journal article
Measurement of Electrical Current Density Effects in Solder Joints
Advancing Microelectronics, 30(5).
2003 conference paper
Partitioning digitally programmable power-control for applications to ballasts
APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.
Event: APEC 2002 - Applied Power Electronics Conference and Exposition at Dallas, TX on March 10-14, 2002
2003 conference paper
Reliability of solder joints under electrical stressing - strain evolution of solder joints
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.
Event: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems at San Diego, CA on May 30 - June 1, 2002
2003 journal article
Mechanical degradation of microelectronics solder joints under current stressing
International Journal of Solids and Structures, 40(26), 7269–7284.
2003 journal article
Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
Applied Physics Letters, 82(7), 1045–1047.
2003 journal article
Numerical simulation of stress evolution during electromigration in IC interconnect lines
IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.