Electrical & Computer Engineering

College of Engineering

Works Published in 2003

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Displaying works 1 - 20 of 207 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2003 conference paper

On the optimum secrecy capacity of multiple relay networks

2014 17th International Conference on Computer and Information Technology, ICCIT 2014, 514–517.

By: M. Koli*, M. Sarkar*, S. Tazrin* & M. Pervej*

Source: ORCID
Added: May 17, 2023

2003 conference paper

Impact of underwater bandwidth on cross-correlation based node estimation technique

2014 17th International Conference on Computer and Information Technology, ICCIT 2014, 494–497.

By: S. Bain*, S. Chowdhury*, A. Asif*, M. Anower*, M. Pervej* & S. Haque*

Source: ORCID
Added: May 17, 2023

2003 conference paper

Impact analysis of input and output block size of DCT-SCFDMA system

2014 17th International Conference on Computer and Information Technology, ICCIT 2014, 440–445.

By: M. Pervej*, M. Sarkar*, T. Roy* & M. Koli*

Source: ORCID
Added: May 17, 2023

2003 conference paper

Effect of node number in range based node localization technique for underwater communications network

2014 17th International Conference on Computer and Information Technology, ICCIT 2014, 413–417.

By: M. Hasan*, A. Paul*, S. Haque*, S. Chowdhury*, M. Pervej* & M. Hossen*

Source: ORCID
Added: May 17, 2023

2003 conference paper

Analysis of PAPR reduction of DFT-SCFDMA system using different sub-carrier mapping schemes

2014 17th International Conference on Computer and Information Technology, ICCIT 2014, 435–439.

By: M. Pervej*, M. Sarkar*, T. Roy*, M. Hasan*, M. Rahman* & S. Bain*

Source: ORCID
Added: May 17, 2023

2003 chapter

Real-Time System-on-a-Chip Emulation

In G. Martin & H. Chang (Eds.), Winning the SoC Revolution (pp. 229–253).

By: K. Kuusilinna*, C. Chang*, H. Bluethgen*, W. Davis, B. Richards*, B. Nikolić*, R. Brodersen*

Ed(s): G. Martin* & H. Chang*

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2003 conference paper

Getting High-Performance Silicon from System-Level Design

IEEE Computer Society Annual Symposium on VLSI, 2003. Proceedings., 238–243.

By: W. Davis

Event: IEEE Computer Society Annual Symposium on VLSI at Tampa, FL on February 20-21, 2003

Sources: Web Of Science, ORCID
Added: July 9, 2022

2003 journal article

500 Mb/s Soft Output Viterbi Decoder

IEEE Journal of Solid State Circuits, 38(7), 1234–1241.

By: E. Yeo*, S. Augsburger, W. Davis & B. Nikolić

author keywords: iterative decoders; turbo codes; Viterbi decoder; VLSI
Source: Web Of Science
Added: July 9, 2022

2003 conference paper

Automated Design Flows for High-Performance Systems

Davis, W. R. (2003, February 11). Presented at the OpenAccess Conference, San Jose, CA.

By: W. Davis

Event: OpenAccess Conference at San Jose, CA on February 11, 2003

Source: NC State University Libraries
Added: July 1, 2022

2003 speech

System-Level Design: Past, Present, and Future

Davis, W. R. (2003, February). Presented at the University of Tennessee ECE Department Seminar, Knoxville, TN.

By: W. Davis

Event: University of Tennessee ECE Department Seminar at Knoxville, TN

Source: NC State University Libraries
Added: July 1, 2022

2003 conference paper

Wireless communications using integrated antennas

Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003, 111–113.

By: K. O*, K. Kim, B. Floyd, J. Mehta*, H. Yoon*, C. Hung*, D. Bravo*, T. Dickson* ...

Source: ORCID
Added: December 10, 2021

2003 conference paper

60GHz transceiver circuits in SiGe bipolar technology

Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 47. http://www.scopus.com/inward/record.url?eid=2-s2.0-2442715211&partnerID=MN8TOARS

By: S. Reynolds, B. Floyd, U. Pfeiffer & T. Zwick

Source: ORCID
Added: December 10, 2021

2003 journal article

Measuring Joint Reliability: Applying the Moire Interferometry Technique

Advanced Microelectronics Magazine, 12(5), 17–20.

By: H. Ye, C. Basaran & D. Hopkins

Source: NC State University Libraries
Added: October 28, 2021

2003 journal article

Flip Chip and BGA Solder Joint Reliability

Advanced Packaging, 12(5), 17–19.

By: H. Ye, C. Basaran, D. Hopkins, H. Liu & A. Cartright

Source: NC State University Libraries
Added: October 28, 2021

2003 journal article

Measurement of Electrical Current Density Effects in Solder Joints

Advancing Microelectronics, 30(5).

By: H. Ye, D. Hopkins & C. Basaran

Source: NC State University Libraries
Added: October 28, 2021

2003 conference paper

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

By: D. Hopkins & J. Moronski

Event: APEC 2002 - Applied Power Electronics Conference and Exposition at Dallas, TX on March 10-14, 2002

Sources: Crossref, ORCID
Added: September 5, 2021

2003 conference paper

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

By: H. Ye*, C. Basaran, D. Hopkins & A. Cartwright

Event: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems at San Diego, CA on May 30 - June 1, 2002

author keywords: electromigration; Moire Interferometry; electronic packaging; power electronics
Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

By: H. Ye*, C. Basaran* & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

By: H. Ye*, C. Basaran* & D. Hopkins

author keywords: deviatoric stress tensor; electromigration; FE; hydrostatic stress; PDEs; stress evolution
Sources: Crossref, ORCID
Added: September 5, 2021