Electrical & Computer Engineering

Real-Time System-on-a-Chip Emulation

In G. Martin & H. Chang (Eds.), Winning the SoC Revolution (pp. 229–253).

Getting High-Performance Silicon from System-Level Design

IEEE Computer Society Annual Symposium on VLSI, 2003. Proceedings., 238–243.

500 Mb/s Soft Output Viterbi Decoder

IEEE Journal of Solid State Circuits, 38(7), 1234–1241.

Automated Design Flows for High-Performance Systems

Davis, W. R. (2003, February 11). Presented at the OpenAccess Conference, San Jose, CA.

System-Level Design: Past, Present, and Future

Davis, W. R. (2003, February). Presented at the University of Tennessee ECE Department Seminar, Knoxville, TN.

Wireless communications using integrated antennas

Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003, 111–113.

60GHz transceiver circuits in SiGe bipolar technology

Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 47. http://www.scopus.com/inward/record.url?eid=2-s2.0-2442715211&partnerID=MN8TOARS

Measuring Joint Reliability: Applying the Moire Interferometry Technique

Advanced Microelectronics Magazine, 12(5), 17–20.

Flip Chip and BGA Solder Joint Reliability

Advanced Packaging, 12(5), 17–19.

Measurement of Electrical Current Density Effects in Solder Joints

Advancing Microelectronics, 30(5).

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures, 40(15), 4021–4032.

Measurement of high electrical current density effects in solder joints

Microelectronics Reliability, 43(12), 2021–2029.

A novel compiler framework for a chip-multiprocessor architecture with thread-level speculation

University of Illinois at Urbana-Champaign.

Web-based Asset Management Tools

Proceedings of DistribuTech Conference. Presented at the DistribuTech Conference, Las Vegas, NV.

Performance modeling of memory latency hiding techniques

[Technical Report,]. Raleigh, NC: Department of Electrical and Computer Engineering, North Carolina State University.