College of Engineering
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2003 conference paper
Wireless communications using integrated antennas
Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003, 111–113.
2003 conference paper
60GHz transceiver circuits in SiGe bipolar technology
Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 47.
2003 journal article
Measuring Joint Reliability: Applying the Moire Interferometry Technique
Advanced Microelectronics Magazine, 12(5), 17–20.
2003 journal article
Flip Chip and BGA Solder Joint Reliability
Advanced Packaging, 12(5), 17–19.
2003 journal article
Measurement of Electrical Current Density Effects in Solder Joints
Advancing Microelectronics, 30(5).
2003 conference paper
Partitioning digitally programmable power-control for applications to ballasts
APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.
Event: APEC 2002 - Applied Power Electronics Conference and Exposition at Dallas, TX on March 10-14, 2002
2003 conference paper
Reliability of solder joints under electrical stressing - strain evolution of solder joints
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.
Event: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems at San Diego, CA on May 30 - June 1, 2002
2003 journal article
Mechanical degradation of microelectronics solder joints under current stressing
International Journal of Solids and Structures, 40(26), 7269–7284.
2003 journal article
Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
Applied Physics Letters, 82(7), 1045–1047.
2003 journal article
Numerical simulation of stress evolution during electromigration in IC interconnect lines
IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.
2003 journal article
Damage mechanics of microelectronics solder joints under high current densities
International Journal of Solids and Structures, 40(15), 4021–4032.
2003 journal article
Measurement of high electrical current density effects in solder joints
Microelectronics Reliability, 43(12), 2021–2029.
2003 thesis
A novel compiler framework for a chip-multiprocessor architecture with thread-level speculation
University of Illinois at Urbana-Champaign.
2003 conference paper
Web-based Asset Management Tools
Proceedings of DistribuTech Conference. Presented at the DistribuTech Conference, Las Vegas, NV.
Event: DistribuTech Conference at Las Vegas, NV
2003 report
Performance modeling of memory latency hiding techniques
[Technical Report,]. Raleigh, NC: Department of Electrical and Computer Engineering, North Carolina State University.
2003 conference paper
Extending OpenMP to support slipstream execution mode
Proceedings - International Parallel and Distributed Processing Symposium, IPDPS 2003, 10.
2003 conference paper
A new introductory laboratory course for electrical and computer engineering
ASEE Annual Conference Proceedings, 11378–11391.
2003 report
Code size aware compilation for real-time applications
[Technical Report]. Computer Science Department, University of Central Florida.
2003 conference paper
Enhancing Memory Level Parallelism via Recovery-Free Value Prediction
The 2003 International Conference on Supercomputing (ICS'03), 326–335.
2003 conference paper
Welcome from the general chair
Technical Digest - International Electron Devices Meeting.
