Electrical & Computer Engineering

College of Engineering

Works Published in 2003

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2003 conference paper

Wireless communications using integrated antennas

Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003, 111–113.

By: K. O, K. Kim, B. Floyd, J. Mehta, H. Yoon, C. Hung, D. Bravo, T. Dickson ...

Source: ORCID
Added: December 10, 2021

2003 conference paper

60GHz transceiver circuits in SiGe bipolar technology

Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 47.

By: S. Reynolds, B. Floyd, U. Pfeiffer & T. Zwick

Source: ORCID
Added: December 10, 2021

2003 journal article

Measuring Joint Reliability: Applying the Moire Interferometry Technique

Advanced Microelectronics Magazine, 12(5), 17–20.

By: H. Ye, C. Basaran & D. Hopkins

Source: NC State University Libraries
Added: October 28, 2021

2003 journal article

Flip Chip and BGA Solder Joint Reliability

Advanced Packaging, 12(5), 17–19.

By: H. Ye, C. Basaran, D. Hopkins, H. Liu & A. Cartright

Source: NC State University Libraries
Added: October 28, 2021

2003 journal article

Measurement of Electrical Current Density Effects in Solder Joints

Advancing Microelectronics, 30(5).

By: H. Ye, D. Hopkins & C. Basaran

Source: NC State University Libraries
Added: October 28, 2021

2003 conference paper

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

By: D. Hopkins & J. Moronski

Event: APEC 2002 - Applied Power Electronics Conference and Exposition at Dallas, TX on March 10-14, 2002

Sources: Crossref, ORCID
Added: September 5, 2021

2003 conference paper

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

By: H. Ye, C. Basaran, D. Hopkins & A. Cartwright

Event: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems at San Diego, CA on May 30 - June 1, 2002

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures, 40(15), 4021–4032.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Measurement of high electrical current density effects in solder joints

Microelectronics Reliability, 43(12), 2021–2029.

By: H. Ye, D. Hopkins & C. Basaran

Sources: Crossref, ORCID
Added: September 4, 2021

2003 thesis

A novel compiler framework for a chip-multiprocessor architecture with thread-level speculation

University of Illinois at Urbana-Champaign.

By: J. Tuck

Source: ORCID
Added: August 18, 2021

2003 conference paper

Web-based Asset Management Tools

Proceedings of DistribuTech Conference. Presented at the DistribuTech Conference, Las Vegas, NV.

By: J. Hasselstrom, D. Lubkeman, F. Li, J. Wang & Y. Liao

Event: DistribuTech Conference at Las Vegas, NV

Source: NC State University Libraries
Added: March 19, 2021

2003 report

Performance modeling of memory latency hiding techniques

[Technical Report,]. Raleigh, NC: Department of Electrical and Computer Engineering, North Carolina State University.

By: H. Zhou & T. Conte

Source: NC State University Libraries
Added: February 20, 2021

2003 conference paper

Extending OpenMP to support slipstream execution mode

Proceedings - International Parallel and Distributed Processing Symposium, IPDPS 2003, 10.

By: K. Ibrahim & G. Byrd

Source: ORCID
Added: February 15, 2021

2003 conference paper

A new introductory laboratory course for electrical and computer engineering

ASEE Annual Conference Proceedings, 11378–11391.

By: M. Öztürk, J. Trussell, C. Townsend, G. Byrd, A. Mortazavi, M. Baran, T. Conte, B. O’Neal, G. Bilbro, J. Brickley

Source: ORCID
Added: February 15, 2021

2003 report

Code size aware compilation for real-time applications

[Technical Report]. Computer Science Department, University of Central Florida.

By: H. Zhou

Source: NC State University Libraries
Added: February 8, 2021

2003 conference paper

Enhancing Memory Level Parallelism via Recovery-Free Value Prediction

The 2003 International Conference on Supercomputing (ICS'03), 326–335.

By: H. Zhou & T. Conte

Source: NC State University Libraries
Added: February 8, 2021

2003 conference paper

Welcome from the general chair

Technical Digest - International Electron Devices Meeting.

By: L. Lunardi, J. Welser & J. Candelaria

Source: ORCID
Added: September 21, 2020