Displaying works 1 - 20 of 323 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2009 journal article
III-nitride photonic-crystal light-emitting diodes with high extraction efficiency
Nature Photonics, 3(3), 163–169.
Contributors: J. Wierer* , A. David * & M. Megens*
2009 conference paper
Advanced Packaging for Power and Energy
42nd Symposium on Microelectronics (IMAPS 2009). Presented at the 42nd Symposium on Microelectronics (IMAPS 2009), San Jose, CA.
Event: 42nd Symposium on Microelectronics (IMAPS 2009) at San Jose, CA on November 1-5, 2009
2009 conference paper
Integrated Packaging Techniques
24th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 24th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Washington, D.C.
Event: 24th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC) at Washington, D.C. on February 15-19, 2009
2009 journal article
Changes in Taste and Smell: Drug Interactions and Food Preferences
Nutrition Reviews, 52(8), 11–14.
2009 journal article
Effects of Aging on the Human Taste System
Annals of the New York Academy of Sciences, 1170(1), 725–729.
2009 chapter book
Sensory Impairment: Taste and Smell Impairments with Aging
2009 conference paper
Algebraic approach to recovering topological information in distributed camera networks
2009 International Conference on Information Processing in Sensor Networks. https://ieeexplore.ieee.org/document/5211929
Contributors: E. Lobaton
2009 conference paper
Robust construction of the Camera Network Complex for topology recovery
2009 Third ACM/IEEE International Conference on Distributed Smart Cameras (ICDSC).
2009 journal article
Modeling and Optimization Analysis of a Single-Flagellum Micro-Structure Through the Method of Regularized Stokeslets
IEEE Transactions on Control Systems Technology, 17(4), 907–916.
2009 article
Compression Adjustable Fabric and Garments
Reid Jr, L. G., Grant, E., Hegarty, M. S., & Livingston, F. (2009, September).
2009 article
Health Monitoring and Management System
Reid Jr, L. G., Grant, E., Hegarty, M. S., & Livingston, F. (2009, September).
2009 conference paper
High-Throughput Low-Complexity MIMO Detector Based on K-Best Algorithm
GLSVLSI '09: Proceedings of the 19th ACM Great Lakes symposium on VLSI, 451–456.
Event: Great Lakes Symposium on VLSI (GLSVLSI on May 10-12, 2009
2009 speech
The Benefits of 3D Networks-on-Chip
Davis, W. R. (2009, December). Presented at the Silicon Integration Initiative (Si2) Low-Power Coalition Technical Steering Group Web-Meeting.
Event: Silicon Integration Initiative (Si2) Low-Power Coalition Technical Steering Group Web-Meeting on December 10, 2009
2009 speech
Prototyping in 3D-ICs: Design Flow Needs
Davis, W. R. (2009, October). Presented at the Silicon Integration Inititative (Si2) and Global Semiconductor Association (GSA) Workshop on Requirements for 3D Design Flow Interoperability Standards.
Event: Silicon Integration Inititative (Si2) and Global Semiconductor Association (GSA) Workshop on Requirements for 3D Design Flow Interoperability Standards on October 1, 2009
2009 speech
Save Your Energy: A Fast and Accurate Approach to NoC Power Estimation
Mineo, C., & Davis, W. R. (2009, February). Presented at the Workshop on 3D Integration and Interconnect-Centric Architectures (in conjunction with the International Symposium on High Performance Computer Architecture.
Event: Workshop on 3D Integration and Interconnect-Centric Architectures (in conjunction with the International Symposium on High Performance Computer Architecture on February 15, 2009
2009 conference paper
Investigation of High Electrical Gradients in High Voltage Power Modules
Presented at the FREEDM Systems Center Conference, Raleigh, NC.
Event: FREEDM Systems Center Conference at Raleigh, NC on May 18-19, 2009
2009 conference paper
Assessment of Critical Issues for High Temperature, High Voltage Power Modules
Presented at the FREEDM Systems Center Conference, Raleigh, NC.
Event: FREEDM Systems Center Conference at Raleigh, NC on May 18-19, 2009
2009 conference paper
Electromigration Time to Failure of SnAgCuNi Solder Joints
Presented at the American Society of Mechanical Engineers (ASME) 2009 InterPack Conference, San Francisco, CA.
Event: American Society of Mechanical Engineers (ASME) 2009 InterPack Conference at San Francisco, CA on July 19-23, 2009
2009 conference paper
A 6.5kV IGBT Development Module for Renewable Energy Systems
Presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.
Event: 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics at San Jose, CA on November 1-5, 2009
2009 conference paper
Investigation of SiC Power Module Requirement for Smart Grid Applications
Poster presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.
Event: 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics at San Jose, CA on November 1-5, 2009