Electrical & Computer Engineering

College of Engineering

Works Published in 2009

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Displaying works 1 - 20 of 317 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2009 conference paper

Algebraic approach to recovering topological information in distributed camera networks

2009 International Conference on Information Processing in Sensor Networks. https://ieeexplore.ieee.org/document/5211929

Source: ORCID
Added: February 10, 2023

2009 conference paper

Robust construction of the Camera Network Complex for topology recovery

2009 Third ACM/IEEE International Conference on Distributed Smart Cameras (ICDSC).

By: E. Lobaton, R. Vasudevan*, S. Sastry* & R. Bajcsy*

Source: ORCID
Added: February 10, 2023

2009 journal article

Modeling and Optimization Analysis of a Single-Flagellum Micro-Structure Through the Method of Regularized Stokeslets

IEEE Transactions on Control Systems Technology, 17(4), 907–916.

By: E. Lobaton & A. Bayen*

author keywords: Adjoint optimization; animation and simulation; biologically-inspired robots; microrobotics
Source: ORCID
Added: February 10, 2023

2009 article

Compression Adjustable Fabric and Garments

Reid Jr, L. G., Grant, E., Hegarty, M. S., & Livingston, F. (2009, September).

By: L. Reid Jr, E. Grant, M. Hegarty & F. Livingston

Source: ORCID
Added: February 5, 2023

2009 article

Health Monitoring and Management System

Reid Jr, L. G., Grant, E., Hegarty, M. S., & Livingston, F. (2009, September).

By: L. Reid Jr, E. Grant, M. Hegarty & F. Livingston

Source: ORCID
Added: February 5, 2023

2009 conference paper

High-Throughput Low-Complexity MIMO Detector Based on K-Best Algorithm

GLSVLSI '09: Proceedings of the 19th ACM Great Lakes symposium on VLSI, 451–456.

By: N. Moezzi-Madani & W. Davis

Event: Great Lakes Symposium on VLSI (GLSVLSI on May 10-12, 2009

Source: NC State University Libraries
Added: July 9, 2022

2009 speech

The Benefits of 3D Networks-on-Chip

Davis, W. R. (2009, December). Presented at the Silicon Integration Initiative (Si2) Low-Power Coalition Technical Steering Group Web-Meeting.

By: W. Davis

Event: Silicon Integration Initiative (Si2) Low-Power Coalition Technical Steering Group Web-Meeting on December 10, 2009

Source: NC State University Libraries
Added: July 1, 2022

2009 speech

Prototyping in 3D-ICs: Design Flow Needs

Davis, W. R. (2009, October). Presented at the Silicon Integration Inititative (Si2) and Global Semiconductor Association (GSA) Workshop on Requirements for 3D Design Flow Interoperability Standards.

By: W. Davis

Event: Silicon Integration Inititative (Si2) and Global Semiconductor Association (GSA) Workshop on Requirements for 3D Design Flow Interoperability Standards on October 1, 2009

Source: NC State University Libraries
Added: July 1, 2022

2009 speech

Save Your Energy: A Fast and Accurate Approach to NoC Power Estimation

Mineo, C., & Davis, W. R. (2009, February). Presented at the Workshop on 3D Integration and Interconnect-Centric Architectures (in conjunction with the International Symposium on High Performance Computer Architecture.

By: C. Mineo & W. Davis

Event: Workshop on 3D Integration and Interconnect-Centric Architectures (in conjunction with the International Symposium on High Performance Computer Architecture on February 15, 2009

Source: NC State University Libraries
Added: July 1, 2022

2009 conference paper

Investigation of High Electrical Gradients in High Voltage Power Modules

Presented at the FREEDM Systems Center Conference, Raleigh, NC.

By: Y. Guo, P. Jao & D. Hopkins

Event: FREEDM Systems Center Conference at Raleigh, NC on May 18-19, 2009

Source: NC State University Libraries
Added: October 23, 2021

2009 conference paper

Assessment of Critical Issues for High Temperature, High Voltage Power Modules

Presented at the FREEDM Systems Center Conference, Raleigh, NC.

By: D. Hopkins, Y. Guo & P. Jao

Event: FREEDM Systems Center Conference at Raleigh, NC on May 18-19, 2009

Source: NC State University Libraries
Added: October 23, 2021

2009 conference paper

Electromigration Time to Failure of SnAgCuNi Solder Joints

Presented at the American Society of Mechanical Engineers (ASME) 2009 InterPack Conference, San Francisco, CA.

By: C. Basaran, S. Li, D. Hopkins & D. Veychard

Event: American Society of Mechanical Engineers (ASME) 2009 InterPack Conference at San Francisco, CA on July 19-23, 2009

Source: NC State University Libraries
Added: October 23, 2021

2009 conference paper

A 6.5kV IGBT Development Module for Renewable Energy Systems

Presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.

By: G. Wang, Y. Du, Y. Guo, D. Hopkins, S. Bhattacharya & A. Huang

Event: 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics at San Jose, CA on November 1-5, 2009

Source: NC State University Libraries
Added: October 23, 2021

2009 conference paper

Investigation of SiC Power Module Requirement for Smart Grid Applications

Poster presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.

By: Y. Guo, P. Jao, G. Wang, Y. Du, S. Bhattacharya & D. Hopkins

Event: 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics at San Jose, CA on November 1-5, 2009

Source: NC State University Libraries
Added: October 23, 2021

2009 journal article

A Dynamic Model for a Gas-Liquid Corona Discharge Using Neural Networks

IEEE Transactions on Power Delivery, 24(3), 1234–1239.

By: A. Hosny*, D. Hopkins, Z. Gay & M. Safiuddin*

author keywords: Electromagnetic Transients Program (EMTP); neural networks; pulsed corona discharge
Sources: Crossref, ORCID
Added: September 5, 2021

2009 journal article

Electromigration time to failure of SnAgCuNi solder joints

Journal of Applied Physics, 106(1), 013707.

By: C. Basaran, S. Li, D. Hopkins & D. Veychard

author keywords: copper alloys; current density; electrical resistivity; electromigration; integrated circuits; nickel alloys; silver alloys; solders; tin alloys
Sources: Crossref, ORCID
Added: September 5, 2021

2009 chapter

Fuzzy Logic Based Control

In IEEE Industrial Electronics Handbook. New York: IEEE.

By: M. Chow

Source: NC State University Libraries
Added: August 14, 2021

2009 journal article

Nanostructured conducting polymer based reagentless capacitive immunosensor

Biomedical Microdevices, 12(1), 63–70.

By: A. Bandodkar, C. Dhand*, S. Arya*, M. Pandey* & B. Malhotra*

author keywords: Polyaniline; Electrophoretic deposition; Parallel plate capacitor; Immunosensor
Sources: Crossref, ORCID
Added: January 5, 2021

2009 journal article

Low Density Lipoprotein Detection Based on Antibody Immobilized Self-Assembled Monolayer: Investigations of Kinetic and Thermodynamic Properties

The Journal of Physical Chemistry B, 113(43), 14405–14412.

By: Z. Matharu*, A. Bandodkar, G. Sumana*, P. Solanki*, E. Ekanayake*, K. Kaneto*, V. Gupta*, B. Malhotra*

Sources: Crossref, ORCID
Added: October 30, 2020

2009 conference paper

Transform kernel selection strategy for the H.264

Annual Summit and Conference, APSIPA, 64–70.

By: C. Wong & W. Siu

Event: APSIPA

Source: ORCID
Added: October 16, 2020