Electrical and Computer Engineering

III-nitride photonic-crystal light-emitting diodes with high extraction efficiency

Nature Photonics, 3(3), 163–169.

Advanced Packaging for Power and Energy

42nd Symposium on Microelectronics (IMAPS 2009). Presented at the 42nd Symposium on Microelectronics (IMAPS 2009), San Jose, CA.

Integrated Packaging Techniques

24th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 24th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Washington, D.C.

Changes in Taste and Smell: Drug Interactions and Food Preferences

Nutrition Reviews, 52(8), 11–14.

Effects of Aging on the Human Taste System

Annals of the New York Academy of Sciences, 1170(1), 725–729.

Sensory Impairment: Taste and Smell Impairments with Aging

Algebraic approach to recovering topological information in distributed camera networks

2009 International Conference on Information Processing in Sensor Networks. https://ieeexplore.ieee.org/document/5211929

Robust construction of the Camera Network Complex for topology recovery

2009 Third ACM/IEEE International Conference on Distributed Smart Cameras (ICDSC).

Modeling and Optimization Analysis of a Single-Flagellum Micro-Structure Through the Method of Regularized Stokeslets

IEEE Transactions on Control Systems Technology, 17(4), 907–916.

Compression Adjustable Fabric and Garments

Reid Jr, L. G., Grant, E., Hegarty, M. S., & Livingston, F. (2009, September).

Health Monitoring and Management System

Reid Jr, L. G., Grant, E., Hegarty, M. S., & Livingston, F. (2009, September).

High-Throughput Low-Complexity MIMO Detector Based on K-Best Algorithm

GLSVLSI '09: Proceedings of the 19th ACM Great Lakes symposium on VLSI, 451–456.

The Benefits of 3D Networks-on-Chip

Davis, W. R. (2009, December). Presented at the Silicon Integration Initiative (Si2) Low-Power Coalition Technical Steering Group Web-Meeting.

Prototyping in 3D-ICs: Design Flow Needs

Davis, W. R. (2009, October). Presented at the Silicon Integration Inititative (Si2) and Global Semiconductor Association (GSA) Workshop on Requirements for 3D Design Flow Interoperability Standards.

Save Your Energy: A Fast and Accurate Approach to NoC Power Estimation

Mineo, C., & Davis, W. R. (2009, February). Presented at the Workshop on 3D Integration and Interconnect-Centric Architectures (in conjunction with the International Symposium on High Performance Computer Architecture.

Investigation of High Electrical Gradients in High Voltage Power Modules

Presented at the FREEDM Systems Center Conference, Raleigh, NC.

Assessment of Critical Issues for High Temperature, High Voltage Power Modules

Presented at the FREEDM Systems Center Conference, Raleigh, NC.

Electromigration Time to Failure of SnAgCuNi Solder Joints

Presented at the American Society of Mechanical Engineers (ASME) 2009 InterPack Conference, San Francisco, CA.

A 6.5kV IGBT Development Module for Renewable Energy Systems

Presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.

Investigation of SiC Power Module Requirement for Smart Grid Applications

Poster presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.