College of Engineering
Displaying works 1 - 20 of 328 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2010 conference paper
On the Design of a KANSEI Robot Testbed for Understanding Human Machine Interaction
International Conference on KANSEI Engineering and Emotion Research. Presented at the International Conference on KANSEI Engineering and Emotion Research, Paris, France.
Event: International Conference on KANSEI Engineering and Emotion Research at Paris, France
2010 conference paper
A methodology for remote virtual interaction in teleimmersive environments
Proceedings of the first annual ACM SIGMM conference on Multimedia systems.
2010 conference paper
Real-time stereo-vision system for 3D teleimmersive collaboration
2010 IEEE International Conference on Multimedia and Expo.
2010 journal article
A Distributed Topological Camera Network Representation for Tracking Applications
IEEE Transactions on Image Processing, 19(10), 2516–2529.
2010 conference paper
Comparison of Learning on the Design of a KANSEI Robot Testbed for Understanding Human-Machine Interaction
International Conference on KANSEI Engineering and Emotion Research.
2010 conference paper
Creating 3D Specific Systems: Architecture, Design and CAD
International Symposium on Microelectronics, 2010(1), 23–27.
Event: Intlernational Microelectronics and Packaging Society (iMAPS) Symposium at Raleigh, NC
2010 conference paper
Algorithm and hardware complexity reduction techniques for k-best sphere decoders
GLSVLSI '10: Proceedings of the 20th symposium on Great lakes symposium on VLSI, 471–476.
Event: Great Lakes Symposium on VLSI (GLSVLSI
2010 conference paper
A Low-Area Flexible MIMO Detector for WiFi/WiMAX Standards
2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010). Presented at the 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), Dresden, Germany.
Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010
2010 journal article
Low Power Hypercube Divided Memory FFT Engine Using 3D Integration
ACM Transactions on Design Automation of Electronic Systems, 16(1), 1–25.
2010 conference paper
Thermal Adaptive Clock Design for 3D Integrated Circuits
Chen, X., & Davis, W. R. (2010, September 13). Presented at the Semiconductor Research Corporation (SRC) TECHCON.
Event: Semiconductor Research Corporation (SRC) TECHCON on September 13-14, 2010
2010 conference paper
Modeling Layout-Dependent Stress Effects: Opportunities for OpenDFM
Davis, W. R. (2010, June 13). Presented at the Design Automation Conference (DAC) Open Design-for-Manufacturability (OpenDFM) Workshop.
Event: Design Automation Conference (DAC) Open Design-for-Manufacturability (OpenDFM) Workshop on June 13, 2010
2010 conference paper
Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs
Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, W. R. (2010, October). Presented at the International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Event: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) on October 6-8, 2010
2010 journal article
Investigating Control of Vision Based Autonomous Navigation in the Image Plane
SAE International Journal of Commercial Vehicles, 3(1), 250–258.
2010 journal article
Nanostructured conducting polymer based reagentless capacitive immunosensor
Biomedical Microdevices, 12(1), 63–70.
2010 conference paper
Augmenting Bucholz Relay Using Embedded Mems Gas Sensor
Presented at the 2010 IEEE PES Transmission and Distribution Conference, New Orleans, LA.
Event: 2010 IEEE PES Transmission and Distribution Conference at New Orleans, LA on April 19-22, 2010
2010 conference paper
Solid-State Protection: Dual-use for Microgrids
Presented at the Advanced Energy Conference, New York, NY.
Event: Advanced Energy Conference at New York, NY on November 8-9, 2010
2010 conference paper
Development and Testing of a 350 ̊C SiC MCPM with Cast Metal Matrix Composites
Presented at the International Electronics Packaging Symposium, Niskayuna, NY.
Event: International Electronics Packaging Symposium at Niskayuna, NY on September 9-10, 2010
2010 journal article
Development of a SiC SSPC Module with Advanced High Temperature Packaging
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2010(HITEC), 000310–000315.
2010 conference paper
A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment
2010 IEEE Industry Applications Society Annual Meeting. Presented at the 2010 IEEE Industry Applications Society Annual Meeting.
Event: 2010 IEEE Industry Applications Society Annual Meeting
2010 conference paper
Mmt: Exploiting fine-grained parallelism in dynamic memory management
2010 IEEE International Symposium on Parallel & Distributed Processing (IPDPS), 1–12.
Event: IEEE