Electrical & Computer Engineering

Comparison of Learning on the Design of a KANSEI Robot Testbed for Understanding Human-Machine Interaction

International Conference on KANSEI Engineering and Emotion Research.

Creating 3D Specific Systems: Architecture, Design and CAD

International Symposium on Microelectronics, 2010(1), 23–27.

Algorithm and hardware complexity reduction techniques for k-best sphere decoders

GLSVLSI '10: Proceedings of the 20th symposium on Great lakes symposium on VLSI, 471–476.

A Low-Area Flexible MIMO Detector for WiFi/WiMAX Standards

2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010). Presented at the 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), Dresden, Germany.

Low Power Hypercube Divided Memory FFT Engine Using 3D Integration

ACM Transactions on Design Automation of Electronic Systems, 16(1), 1–25.

Thermal Adaptive Clock Design for 3D Integrated Circuits

Chen, X., & Davis, W. R. (2010, September 13). Presented at the Semiconductor Research Corporation (SRC) TECHCON.

Modeling Layout-Dependent Stress Effects: Opportunities for OpenDFM

Davis, W. R. (2010, June 13). Presented at the Design Automation Conference (DAC) Open Design-for-Manufacturability (OpenDFM) Workshop.

Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs

Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, W. R. (2010, October). Presented at the International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Investigating Control of Vision Based Autonomous Navigation in the Image Plane

SAE International Journal of Commercial Vehicles, 3(1), 250–258.

Augmenting Bucholz Relay Using Embedded Mems Gas Sensor

Presented at the 2010 IEEE PES Transmission and Distribution Conference, New Orleans, LA.

Solid-State Protection: Dual-use for Microgrids

Presented at the Advanced Energy Conference, New York, NY.

Development and Testing of a 350 ̊C SiC MCPM with Cast Metal Matrix Composites

Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

Development of a SiC SSPC Module with Advanced High Temperature Packaging

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2010(HITEC), 000310–000315.

A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment

2010 IEEE Industry Applications Society Annual Meeting. Presented at the 2010 IEEE Industry Applications Society Annual Meeting.

Mmt: Exploiting fine-grained parallelism in dynamic memory management

2010 IEEE International Symposium on Parallel & Distributed Processing (IPDPS), 1–12.

Design Trade-offs for Memory Level Parallelism on an Asymmetric Multicore System

Pespma 2010-Workshop on Parallel Execution of Sequential Programs on Multi-core Architecture.

Special Issue on Artificial Immune Systems: Theory and Applications

Neural Computing and Applications, 19(4), 647–647.

Accelerating MATLAB Image Processing Toolbox Functions on GPUs

Proceedings of the 3rd Workshop on General-Purpose Computation on Graphics Processing Units, 75–85.

Ultra-low leakage and high breakdown Schottky diodes fabricated on free-standing GaN substrate

Semiconductor Science and Technology, 26(2), 022002.

Adaptive integer kernels and dyadic approximation error analysis for state-of-the-art video codecs

The Hong Kong Polytechnic University.