Electrical & Computer Engineering

College of Engineering

Works Published in 2010

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Displaying works 1 - 20 of 328 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2010 conference paper

On the Design of a KANSEI Robot Testbed for Understanding Human Machine Interaction

International Conference on KANSEI Engineering and Emotion Research. Presented at the International Conference on KANSEI Engineering and Emotion Research, Paris, France.

By: F. Livingston, E. Grant & G. Lee

Event: International Conference on KANSEI Engineering and Emotion Research at Paris, France

Source: NC State University Libraries
Added: February 11, 2023

2010 conference paper

A methodology for remote virtual interaction in teleimmersive environments

Proceedings of the first annual ACM SIGMM conference on Multimedia systems.

By: R. Vasudevan*, E. Lobaton, G. Kurillo*, R. Bajcsy*, T. Bernardin*, B. Hamann*, K. Nahrstedt*

Source: ORCID
Added: February 10, 2023

2010 conference paper

Real-time stereo-vision system for 3D teleimmersive collaboration

2010 IEEE International Conference on Multimedia and Expo.

By: R. Vasudevan*, Z. Zhou*, G. Kurillo*, E. Lobaton, R. Bajcsy* & K. Nahrstedt*

author keywords: 3D video; compression; real time; teleimmersion
Source: ORCID
Added: February 10, 2023

2010 journal article

A Distributed Topological Camera Network Representation for Tracking Applications

IEEE Transactions on Image Processing, 19(10), 2516–2529.

By: E. Lobaton, R. Vasudevan*, R. Bajcsy* & S. Sastry*

author keywords: Multitarget tracking; network coverage; sensor networks; simplicial homology; smart camera networks
Source: ORCID
Added: February 10, 2023

2010 conference paper

Comparison of Learning on the Design of a KANSEI Robot Testbed for Understanding Human-Machine Interaction

International Conference on KANSEI Engineering and Emotion Research.

By: F. Livingston, E. Grant & G. Lee

Source: ORCID
Added: February 5, 2023

2010 conference paper

Creating 3D Specific Systems: Architecture, Design and CAD

International Symposium on Microelectronics, 2010(1), 23–27.

By: P. Franzon n, W. Davis, T. Thorolfsson n & S. Melamed n

Event: Intlernational Microelectronics and Packaging Society (iMAPS) Symposium at Raleigh, NC

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2010 conference paper

Algorithm and hardware complexity reduction techniques for k-best sphere decoders

GLSVLSI '10: Proceedings of the 20th symposium on Great lakes symposium on VLSI, 471–476.

By: N. Moezzi-Madani n, T. Thorolfsson n & W. Davis

Event: Great Lakes Symposium on VLSI (GLSVLSI

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2010 conference paper

A Low-Area Flexible MIMO Detector for WiFi/WiMAX Standards

2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010). Presented at the 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), Dresden, Germany.

By: N. Moezzi-Madani, T. Thorolfsson & W. Davis

Event: 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) at Dresden, Germany on March 8-12, 2010

Sources: NC State University Libraries, ORCID
Added: July 9, 2022

2010 journal article

Low Power Hypercube Divided Memory FFT Engine Using 3D Integration

ACM Transactions on Design Automation of Electronic Systems, 16(1), 1–25.

By: T. Thorolfsson n, S. Melamed n, W. Davis & P. Franzon n

author keywords: Design; 3DIC; scaling; TSV; FFT
Sources: Web Of Science, ORCID
Added: July 9, 2022

2010 conference paper

Thermal Adaptive Clock Design for 3D Integrated Circuits

Chen, X., & Davis, W. R. (2010, September 13). Presented at the Semiconductor Research Corporation (SRC) TECHCON.

By: X. Chen & W. Davis

Event: Semiconductor Research Corporation (SRC) TECHCON on September 13-14, 2010

Source: NC State University Libraries
Added: July 1, 2022

2010 conference paper

Modeling Layout-Dependent Stress Effects: Opportunities for OpenDFM

Davis, W. R. (2010, June 13). Presented at the Design Automation Conference (DAC) Open Design-for-Manufacturability (OpenDFM) Workshop.

By: W. Davis

Event: Design Automation Conference (DAC) Open Design-for-Manufacturability (OpenDFM) Workshop on June 13, 2010

Source: NC State University Libraries
Added: July 1, 2022

2010 conference paper

Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs

Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, W. R. (2010, October). Presented at the International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

By: S. Melamed, T. Thorolfsson, A. Srinivasan, E. Cheng, P. Franzon & W. Davis

Event: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) on October 6-8, 2010

Source: NC State University Libraries
Added: July 1, 2022

2010 journal article

Investigating Control of Vision Based Autonomous Navigation in the Image Plane

SAE International Journal of Commercial Vehicles, 3(1), 250–258.

By: R. Gupta, W. Snyder n & W. Pitts n

Source: ORCID
Added: July 1, 2022

2010 journal article

Nanostructured conducting polymer based reagentless capacitive immunosensor

Biomedical Microdevices, 12(1), 63–70.

By: A. Bandodkar, C. Dhand*, S. Arya*, M. Pandey* & B. Malhotra*

author keywords: Polyaniline; Electrophoretic deposition; Parallel plate capacitor; Immunosensor
Source: ORCID
Added: April 8, 2022

2010 conference paper

Augmenting Bucholz Relay Using Embedded Mems Gas Sensor

Presented at the 2010 IEEE PES Transmission and Distribution Conference, New Orleans, LA.

By: K. Bhat & D. Hopkins

Event: 2010 IEEE PES Transmission and Distribution Conference at New Orleans, LA on April 19-22, 2010

Source: NC State University Libraries
Added: October 16, 2021

2010 conference paper

Solid-State Protection: Dual-use for Microgrids

Presented at the Advanced Energy Conference, New York, NY.

By: D. Hopkins

Event: Advanced Energy Conference at New York, NY on November 8-9, 2010

Source: NC State University Libraries
Added: October 16, 2021

2010 conference paper

Development and Testing of a 350 ̊C SiC MCPM with Cast Metal Matrix Composites

Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

By: D. Hopkins, Y. Guo, A. Aravamudhan & J. Scofield

Event: International Electronics Packaging Symposium at Niskayuna, NY on September 9-10, 2010

Source: NC State University Libraries
Added: October 16, 2021

2010 journal article

Development of a SiC SSPC Module with Advanced High Temperature Packaging

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2010(HITEC), 000310–000315.

By: D. Hopkins, Y. Guo*, H. Dwyer* & J. Scofield*

Sources: Crossref, ORCID
Added: September 5, 2021

2010 conference paper

A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment

2010 IEEE Industry Applications Society Annual Meeting. Presented at the 2010 IEEE Industry Applications Society Annual Meeting.

By: K. Bhat*, K. Oh* & D. Hopkins

Event: 2010 IEEE Industry Applications Society Annual Meeting

Sources: Crossref, ORCID
Added: September 5, 2021

2010 conference paper

Mmt: Exploiting fine-grained parallelism in dynamic memory management

2010 IEEE International Symposium on Parallel & Distributed Processing (IPDPS), 1–12.

By: D. Tiwari, S. Lee, J. Tuck & Y. Solihin

Event: IEEE

Source: ORCID
Added: August 18, 2021