College of Engineering
Displaying works 1 - 20 of 329 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2011 conference paper
Properties of 1D soliton-plasmon interactions
Optics InfoBase Conference Papers.
2011 conference paper
Properties of 1D soliton-plasmon interactions
Optics InfoBase Conference Papers. http://www.scopus.com/inward/record.url?eid=2-s2.0-84893594376&partnerID=MN8TOARS
2011 conference paper
Power-tunable plasmon resonance sensor using Kerr nonlinearity
Frontiers in Optics 2011/Laser Science XXVII.
2011 conference paper
Omnidirectional reflector in a ternary metallo-dielectric structure
In R. Rodríguez-Vera & R. Díaz-Uribe (Eds.), 22nd Congress of the International Commission for Optics: Light for the Development of the World (Vol. 8011).
Ed(s): R. Rodríguez-Vera & R. Díaz-Uribe
2011 conference paper
An analytical analysis of the nonlinear modes of the coupled silicon-on-insulator waveguides
In R. Rodríguez-Vera & R. Díaz-Uribe (Eds.), 22nd Congress of the International Commission for Optics: Light for the Development of the World (Vol. 8011).
Ed(s): R. Rodríguez-Vera & R. Díaz-Uribe
2011 conference paper
Robust topological features for deformation invariant image matching
2011 International Conference on Computer Vision.
2011 conference paper
Planning curvature-constrained paths to multiple goals using circle sampling
2011 IEEE International Conference on Robotics and Automation.
2011 journal article
High-Quality Visualization for Geographically Distributed 3-D Teleimmersive Applications
IEEE Transactions on Multimedia, 13(3), 573–584.
2011 journal article
Coordinating 3D designs: Interface IP, standards or free form?
2011 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.
Event: 2011 IEEE International 3D Systems Integration Conference (3DIC) at Osaka, Japan on January 31 - February 2, 2011
2011 chapter
Predictive Process Design Kits
In Y. Cao (Ed.), Predictive Technology Model for Robust Nanoelectronic Design. Integrated Circuits and Systems (pp. 121–140).
Ed(s): Y. Cao
2011 chapter
Design and Computer Aided Design of 3DIC
In A. Sheibanyrad, F. Pétrot, & A. Jantsch (Eds.), 3D Integration for NoC-based SoC Architectures. Integrated Circuits and Systems (pp. 75–88).
Ed(s): A. Sheibanyrad, F. Pétrot & A. Jantsch
2011 conference paper
An energy-efficient 64-QAM MIMO detector for emerging wireless standards
2011 Design, Automation & Test in Europe. Presented at the 2011 Design, Automation & Test in Europe, Grenoble, France.
Event: 2011 Design, Automation & Test in Europe at Grenoble, France on March 14-18, 2011
2011 conference paper
Test & Reliability Challenges in 3D NoCs
Davis, W. R. (2011, June 5). Test & Reliability Challenges in 3D NoCs. Presented at the Design Automation Conference (DAC) Workshop on Diagnostic Services in Networks-on-Chip: Test, Debug, & On-Line Monitoring.
Event: Design Automation Conference (DAC) Workshop on Diagnostic Services in Networks-on-Chip: Test, Debug, & On-Line Monitoring on June 5, 2011
2011 speech
Architecture, Design, and CAD for 3D-ICs
Davis, W. R. (2011, October). Presented at the Institute of Microelectronics, Agency for Science, Technology, and Research (A*STAR), Singapore.
Event: Institute of Microelectronics, Agency for Science, Technology, and Research (A*STAR) at Singapore on October 3, 2011
2011 chapter
Detection of Multiple Preceding Cars in Busy Traffic Using Taillights
In Lecture Notes in Computer Science (pp. 338–347).
2011 article
2011 IMS/RFIC/ARFTG workshops
IEEE Microwave Magazine, Vol. 12, pp. 52–57.
2011 chapter
Packaging and Smart Power Systems
In M. H. Rashid (Ed.), Power Electronics Handbook (3rd ed., pp. 1275–1286).
Ed(s): M. Rashid
2011 conference paper
High current and thermal transient design of a SiC SSPC for aircraft application
2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2011 IEEE Applied Power Electronics Conference and Exposition - APEC 2011.
Event: 2011 IEEE Applied Power Electronics Conference and Exposition - APEC 2011
2011 journal article
High Thermal-Transient Packaging for a SiC-Based Solid State Circuit Breaker
International Symposium on Microelectronics, 2011(1), 000608–000618.
2011 journal article
SPECIAL ISSUE ON HIGH-PERFORMANCE AND EMBEDDED ARCHITECTURES AND COMPILERS
ACM Transactions On, 8(4).