Electrical & Computer Engineering

Coordinating 3D designs: Interface IP, standards or free form?

2011 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan.

Predictive Process Design Kits

In Y. Cao (Ed.), Predictive Technology Model for Robust Nanoelectronic Design. Integrated Circuits and Systems (pp. 121–140).

Design and Computer Aided Design of 3DIC

In A. Sheibanyrad, F. Pétrot, & A. Jantsch (Eds.), 3D Integration for NoC-based SoC Architectures. Integrated Circuits and Systems (pp. 75–88).

An energy-efficient 64-QAM MIMO detector for emerging wireless standards

2011 Design, Automation & Test in Europe. Presented at the 2011 Design, Automation & Test in Europe, Grenoble, France.

Test & Reliability Challenges in 3D NoCs

Davis, W. R. (2011, June 5). Test & Reliability Challenges in 3D NoCs. Presented at the Design Automation Conference (DAC) Workshop on Diagnostic Services in Networks-on-Chip: Test, Debug, & On-Line Monitoring.

Architecture, Design, and CAD for 3D-ICs

Davis, W. R. (2011, October). Presented at the Institute of Microelectronics, Agency for Science, Technology, and Research (A*STAR), Singapore.

Detection of Multiple Preceding Cars in Busy Traffic Using Taillights

In Lecture Notes in Computer Science (pp. 338–347).

2011 IMS/RFIC/ARFTG workshops

IEEE Microwave Magazine, Vol. 12, pp. 52–57.

Packaging and Smart Power Systems

In M. H. Rashid (Ed.), Power Electronics Handbook (3rd ed., pp. 1275–1286).

High current and thermal transient design of a SiC SSPC for aircraft application

2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2011 IEEE Applied Power Electronics Conference and Exposition - APEC 2011.

High Thermal-Transient Packaging for a SiC-Based Solid State Circuit Breaker

International Symposium on Microelectronics, 2011(1), 000608–000618.

SPECIAL ISSUE ON HIGH-PERFORMANCE AND EMBEDDED ARCHITECTURES AND COMPILERS

ACM Transactions On, 8(4).

HAQu: Hardware-accelerated queueing for fine-grained threading on a chip multiprocessor

2011 IEEE 17th International Symposium on High Performance Computer Architecture, 99–110.

Article 28 (21 pages)-Efficiently Exploiting Memory Level Parallelism on Asymmetric Coupled Cores in the Dark Silicon Era

ACM Transactions on Architecture and Code Optimization-TACO, 8(4).

Welcome to ICCD 2011!

Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors.

Exploring Correlation for Indirect Branch Prediction

2nd JILP Workshop on Computer Architecture Competitions (JWAC-2): Championship Branch Prediction. Presented at the 2nd JILP Workshop on Computer Architecture Competitions (JWAC-2): Championship Branch Prediction, held with ISCA-38.

Developing a High Performance GPGPU Compiler using Cetus

Proceedings of the Cetus Users and Compiler Infrastructure Workshop, International Conference on Parallel Architectures and Compilation Techniques (PACT’11). Presented at the International Conference on Parallel Architectures and Compilation Techniques (PACT’11).

Microfabrication: Conformal Printing of Electrically Small Antennas on Three-Dimensional Surfaces (Adv. Mater. 11/2011)

Advanced Materials, 23(11), 1304–1304.

Novel Dispatch Algorithm for Regulation Service using a Hybrid Energy Storage System

2011 IEEE PES General Meeting : "the electrification of transportation & the grid of the future" 24-28 July 2011, Detroit, MI, USA. Presented at the IEEE Power & Energy Society General Meeting, Detroit, Michigan, USA.

Battery Energy Storage System Testing for Grid Standard Compliance and Application Performance

Conference proceedings 21st International Conference and Exhibition on Electricity Distribution : Messe Frankfurt, Frankfurt am Main, 6-9 June 2011, 0674. Frankfurt, Germany: Liege AIM.