Electrical & Computer Engineering

Experimental Realization of a Metamaterial Detector Focal Plane Array

Phys. Rev. Lett., 109(17).

Analysis of Extrinsic Losses in a Corrugated Photonic Crystal Waveguide

Optics InfoBase Conference Papers. http://www.scopus.com/inward/record.url?eid=2-s2.0-85136245036&partnerID=MN8TOARS

Slow Surface Plasmon-Polaritons in a Metal-Dielectric Structure Incorporating a Lorentzian Gain Medium

Latin America Optics and Photonics Conference.

Total internal reflection of photorefractive spatial solitons at a metallic interface

Frontiers in Optics, FIO 2012.

Analysis of Gain Assisted Slow Surface Plasmon-Polaritons in a Symmetrically Cladded Metal Slab Structure

Frontiers in Optics 2012/Laser Science XXVIII.

Analysis of Extrinsic Losses in a Corrugated Photonic Crystal Waveguide

Latin America Optics and Photonics Conference.

Finite Lorentzian-like gain in the analysis of gain assisted slow surface plasmon-polaritons

Frontiers in Optics, FIO 2012. http://www.scopus.com/inward/record.url?eid=2-s2.0-84893043589&partnerID=MN8TOARS

Analysis of gain assisted slow surface plasmon-polaritons in a symmetrically cladded metal slab structure

Frontiers in Optics, FIO 2012. http://www.scopus.com/inward/record.url?eid=2-s2.0-84893144699&partnerID=MN8TOARS

Finite Lorentzian-Like Gain in the Analysis of Gain Assisted Slow Surface Plasmon-Polaritons

Frontiers in Optics 2012/Laser Science XXVIII.

Modeling Power Variability (from Small to Large

Davis, W. R. (2012, October 9). Presented at the Silicon Integration Inititative (Si2) Conference.

Modulated backscatter for ultra-low power uplinks from wearable and implantable devices

Proceedings of the 2012 ACM workshop on Medical communication systems - MedCOMM '12.

Near field modulated backscatter for in vivo biotelemetry

2012 IEEE International Conference on RFID (RFID).

Erratum: Stamp transfer electrodes for electrochemical sensing on non-planar and oversized surfaces (Analyst (2012) 137 (1570-1575) DOI:10.1039/C2AN35041F)

Analyst, 137(24), 5925.

Printable Packaging for High Power, High Temperature Power Module

Presented at the IEEE Applied Power Electronics Conference, Orlando, FL.

Point Source Thermal Management in Dense Power Modules and Systems

Special session presented at the IEEE Applied Power Electronics Conference, Orlando, FL.

Results for an Al/AlN composite 350°C SiC solid-state circuit breaker module

2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012, Orlando, FL.

Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power Package

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2012(HITEC), 000361–000372.

Development of Printed Power Packaging for a High Voltage SiC Module

International Symposium on Microelectronics, 2012(1), 000955–000960.

Mean time to failure of SnAgCuNi solder joints under DC

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Presented at the 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Efficient and accurate data dependence profiling using software signatures

Proceedings of the Tenth International Symposium on Code Generation and Optimization, 186–195.