Electrical & Computer Engineering

Impact analysis of different inputs and outputs block sizes of DFT-SCFDMA system

2nd International Conference on Electrical Engineering and Information and Communication Technology, iCEEiCT 2015.

Effect of signal length in cross-correlation based underwater network size estimation

2nd International Conference on Electrical Engineering and Information and Communication Technology, iCEEiCT 2015.

W-Band Sparse Synthetic Aperture for Computational Imaging

Imaging and Applied Optics 2015.

Receiver/transmitter configuration optimization for compressed computational millimeter-wave imaging

2015 USNC-URSI Radio Science Meeting (Joint with AP-S Symposium).

Polarization-independent actively tunable colour generation on imprinted plasmonic surfaces

Nature Communications, 6, 7337.

Multi-spectral infrared spectroscopy for robust plastic identification

Applied Optics, 54(24), 7396–7405.

Exploration and topological mapping with Hexbugs

Proceedings of the 14th International Conference on Information Processing in Sensor Networks.

FreePDK15: An Open-Source Predictive Process Design Kit for 15nm FinFET Technology

In ISPD '15: Proceedings of the 2015 Symposium on International Symposium on Physical Design (pp. 165–170).

High Altitude Infrasound Measurements using Balloon-Borne Arrays

American Geophysical Union, Fall Meeting 2015. https://ui.adsabs.harvard.edu/abs/2015AGUFM.S54B..06B/abstract

Single-wire radio frequency transmission lines in biological tissue

Applied Physics Letters, 106(18), 183705.

Tattoo-based noninvasive glucose monitoring: A proof-of-concept study

Analytical Chemistry, 87(1), 394–398.

Additive Manufacturing In Power Electronics Packaging

Special session presented at the IEEE Applied Power Electronics Conference, Charlotte, NC.

3D Power Electronics Packaging and Additive Manufacturing

Hopkins, D. C. (2015, November). Presented at the 3rd IEEE Workshop on Wide Bandgap Power Devices and Applications, Blacksburg, VA.

Additive Manufacturing (a.k.a. 3D Printing) for Designing Power Electronic Systems

Hopkins, D. C. (2015, October 20). Presented at the Manufacturing Conference 2015 (MFGCON), Raleigh, NC.

Physical Rf Circuit Techniques And The Implications On Future Power Module Design

Morgan, A. J., Hopkins, D. C., & McKeown, M. (2015, May). Presented at the International Microelectronics Assembly & Packaging Society, Northeast Symposium.

The Evolution and Future Development of Power Electronics as an Essential Element of Power Generation/Delivery, Energy Efficiency, and Industrial Automation

Lawrence, R., & Hopkins, D. C. (2015, December 12). Presented at the North Carolina IEEE Power Electronic Society (PELS) Chapter Seminar, Raleigh, NC.

A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode

International Symposium on Microelectronics, 2015(1), 000359–000364.

Source Mark: A Source-Level Approach for Identifying Architecture and Optimization Agnostic Regions for Performance Analysis

2015 IEEE International Symposium on Workload Characterization, 160–171.

Runtime checking C programs

Proceedings of the 30th Annual ACM Symposium on Applied Computing, 2107–2114.

Revisiting ILP Designs for Throughput-Oriented GPGPU Architecture

Proceedings of the 2015 15th IEEE/ACM International Symposium on Cluster, Cloud and Grid Computing, 121–130.