College of Engineering
Displaying works 1 - 20 of 448 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2016 speech
Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond
Presented at the RTP CFO Forum.
Event: RTP CFO Forum on March 4, 2016
2016 speech
Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules
Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.
Event: Carolina PCB at McKimmon Center, Raleigh, NC
2016 conference paper
Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules
Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.
Event: International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016) at Raleigh, NC on June 13-15, 2016
2016 conference paper
A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)
Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.
Event: Electronics Packaging Symp & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016
2016 conference paper
Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics
Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.
Event: Electronics Packaging Symposium & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016
2016 conference paper
Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing
Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.
Event: 49th International Symposium on Microelectronics at Pasadena, CA on October 10-13, 2016
2016 journal article
A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient
A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.
2016 conference paper
Advanced multi-physics simulation for high performance power electronic packaging design
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
2016 conference paper
A folded GaN VRM with high electrical and thermal performance
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
2016 journal article
Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications
International Symposium on Microelectronics, 2016(1), 000391–000396.
2016 article
Languages and Compilers for Parallel Computing: 28th International Workshop, LCPC 2015, Raleigh, NC, USA, September 9-11, 2015, Revised Selected Papers
Springer.
2016 journal article
A review of maximum power-point tracking techniques for photovoltaic systems
International Journal of Sustainable Energy, 35(5), 478–501.
2016 conference paper
Selective GPU Cache Bypassing for Un-Coalesced Loads
In X. Liao (Ed.), 22nd IEEE International Conference on Parallel and Distributed Systems : ICPADS 2016 : proceedings : 13-16 December 2016, Wuhan, Hubei, China.
Ed(s): X. Liao
Event: 22nd IEEE International Conference on Parallel and Distributed Systems at Wuhan, Hubei, China on December 13-16, 2016
2016 journal article
Fault contribution from large photovoltaic systems in building power supply networks
Journal of Building Engineering, 5, 222–230.
2016 journal article
Information on the MAST ENF Power Signature Dataset
2016 journal article
Commentary : Hypothesis Focused Ultrasound and NXY-059 in Experimental Cerebral Ischemia: A New Therapeutic Opportunity?
CNS & Neurological Disorders - Drug Targets, 15(9), 1010–1013.
2016 conference paper
Comparative analysis of power density in Si MOSFET and GaN HEMT based flyback converters
2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG). Presented at the 2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG).
Event: 2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)
2016 journal article
Erratum to: The Effect of Multivalley Bandstructure on Thermoelectric Properties of Al x Ga1−x As
Journal of Electronic Materials, 45(6), 3249–3250.
2016 journal article
Erratum: “Electron band bending of polar, semipolar and non-polar GaN surfaces” [J. Appl. Phys. 119, 105303 (2016)]
Journal of Applied Physics, 119(15), 159901.
2016 conference paper
Thermomagnetic liquid cooling: A novel variable speed motor drives thermal management solution
Proceedings - 2015 IEEE International Electric Machines and Drives Conference, IEMDC 2015, 1768–1773.