Electrical & Computer Engineering

College of Engineering

Works Published in 2016

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Sorted by most recent date added to the index first, which may not be the same as publication date order.

2016 speech

Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond

Presented at the RTP CFO Forum.

Event: RTP CFO Forum on March 4, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 speech

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.

Event: Carolina PCB at McKimmon Center, Raleigh, NC

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules

Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.

By: Y. Xu & D. Hopkins

Event: International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016) at Raleigh, NC on June 13-15, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)

Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.

By: D. Hopkins, Y. Xu, H. Ke & A. Morgan

Event: Electronics Packaging Symp & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics

Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.

By: X. Zhao, B. Gao & D. Hopkins

Event: Electronics Packaging Symposium & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.

By: X. Zhao, H. Ke, Y. Jiang, A. Morgan, Y. Xu & D. Hopkins

Event: 49th International Symposium on Microelectronics at Pasadena, CA on October 10-13, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 journal article

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

By: X. Zhao, H. Ke, Y. Jiang, A. Morgan, Y. Xu & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: X. Zhao, Y. Xu & D. Hopkins

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: B. Gao & D. Hopkins

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 journal article

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

By: X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2016 article

Languages and Compilers for Parallel Computing: 28th International Workshop, LCPC 2015, Raleigh, NC, USA, September 9-11, 2015, Revised Selected Papers

Springer.

By: X. Shen, F. Mueller & J. Tuck

Source: ORCID
Added: August 18, 2021

2016 journal article

A review of maximum power-point tracking techniques for photovoltaic systems

International Journal of Sustainable Energy, 35(5), 478–501.

By: A. Anurag, S. Bal, S. Sourav & M. Nanda

Sources: Crossref, ORCID
Added: March 21, 2021

2016 conference paper

Selective GPU Cache Bypassing for Un-Coalesced Loads

In X. Liao (Ed.), 22nd IEEE International Conference on Parallel and Distributed Systems : ICPADS 2016 : proceedings : 13-16 December 2016, Wuhan, Hubei, China.

By: C. Zhao, F. Wang, Z. Lin, H. Zhou & N. Zheng

Ed(s): X. Liao

Event: 22nd IEEE International Conference on Parallel and Distributed Systems at Wuhan, Hubei, China on December 13-16, 2016

Sources: NC State University Libraries, ORCID
Added: January 30, 2021

2016 journal article

Fault contribution from large photovoltaic systems in building power supply networks

Journal of Building Engineering, 5, 222–230.

By: S. Bhattacharya, T. Saha & M. Hossain

Sources: Crossref, ORCID
Added: November 20, 2020

2016 journal article

Information on the MAST ENF Power Signature Dataset

By: A. Hajj-Ahmad, C. Wong & M. Wu

Source: ORCID
Added: October 16, 2020

2016 journal article

Commentary : Hypothesis Focused Ultrasound and NXY-059 in Experimental Cerebral Ischemia: A New Therapeutic Opportunity?

CNS & Neurological Disorders - Drug Targets, 15(9), 1010–1013.

By: B. Yulug, L. Hanoglu, F. Yamaner, E. Kilic & W. Schabitz

Source: ORCID
Added: September 26, 2020

2016 conference paper

Comparative analysis of power density in Si MOSFET and GaN HEMT based flyback converters

2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG). Presented at the 2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG).

By: R. Nune, A. Anurag, S. Anand & Y. Chauhan

Event: 2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

Sources: Crossref, ORCID
Added: September 16, 2020

2016 journal article

Erratum to: The Effect of Multivalley Bandstructure on Thermoelectric Properties of Al x Ga1−x As

Journal of Electronic Materials, 45(6), 3249–3250.

By: P. Norouzzadeh & D. Vashaee

Source: Crossref
Added: August 28, 2020

2016 journal article

Erratum: “Electron band bending of polar, semipolar and non-polar GaN surfaces” [J. Appl. Phys. 119, 105303 (2016)]

Journal of Applied Physics, 119(15), 159901.

By: I. Bartoš, O. Romanyuk, J. Houdkova, P. Paskov, T. Paskova & P. Jiříček

Source: Crossref
Added: August 28, 2020

2016 conference paper

Thermomagnetic liquid cooling: A novel variable speed motor drives thermal management solution

Proceedings - 2015 IEEE International Electric Machines and Drives Conference, IEMDC 2015, 1768–1773.

By: G. Karimi-Moghaddam, R. Gould & S. Bhattacharya

Source: ORCID
Added: August 9, 2020