Electrical & Computer Engineering

Performance comparison of three optimized alternative pulse shaping filters with the raised cosine filter for wireless applications

1st International Conference on Computer and Information Engineering, ICCIE 2015, 9–12.

Separating hyperfine from spin-orbit interactions in organic semiconductors by multi-octave magnetic resonance using coplanar waveguide microresonators

Applied Physics Letters, 109(10), 103303.

Computationally fast EM field propagation through axi-symmetric media using cylindrical harmonic decomposition

Opt. Express, 24(25), 29246–29268.

W-band sparse synthetic aperture for computational imaging

Opt. Express, 24(8), 8317.

Hybrid cavity-coupled plasmonic biosensors for low concentration, label-free and selective biomolecular detection

Optics Express, 24(22), 25785–25796.

Unified Electromagnetic-Electronic Design of Light Trapping Silicon Solar Cells

Scientific Reports, 6(1).

Action classification from motion capture data using topological data analysis

2016 IEEE Global Conference on Signal and Information Processing (GlobalSIP).

Hierarchical activity clustering analysis for robust graphical structure recovery

2016 IEEE Global Conference on Signal and Information Processing (GlobalSIP).

Highly Stretchable Fully-Printed CNT-Based Electrochemical Sensors and Biofuel Cells: Combining Intrinsic and Design-Induced Stretchability

Nano Letters, 16(1), 721–727.

Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond

Presented at the RTP CFO Forum.

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.

Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules

Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.

A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)

Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.

Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics

Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.

Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

Languages and Compilers for Parallel Computing: 28th International Workshop, LCPC 2015, Raleigh, NC, USA, September 9-11, 2015, Revised Selected Papers

Springer.