College of Engineering
Displaying works 1 - 20 of 539 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2016 conference paper
Performance comparison of three optimized alternative pulse shaping filters with the raised cosine filter for wireless applications
1st International Conference on Computer and Information Engineering, ICCIE 2015, 9–12.
2016 journal article
Separating hyperfine from spin-orbit interactions in organic semiconductors by multi-octave magnetic resonance using coplanar waveguide microresonators
Applied Physics Letters, 109(10), 103303.
2016 journal article
Computationally fast EM field propagation through axi-symmetric media using cylindrical harmonic decomposition
Opt. Express, 24(25), 29246–29268.
2016 journal article
W-band sparse synthetic aperture for computational imaging
Opt. Express, 24(8), 8317.
2016 journal article
Hybrid cavity-coupled plasmonic biosensors for low concentration, label-free and selective biomolecular detection
Optics Express, 24(22), 25785–25796.
2016 journal article
Unified Electromagnetic-Electronic Design of Light Trapping Silicon Solar Cells
Scientific Reports, 6(1).
2016 conference paper
Action classification from motion capture data using topological data analysis
2016 IEEE Global Conference on Signal and Information Processing (GlobalSIP).
2016 conference paper
Hierarchical activity clustering analysis for robust graphical structure recovery
2016 IEEE Global Conference on Signal and Information Processing (GlobalSIP).
2016 journal article
Highly Stretchable Fully-Printed CNT-Based Electrochemical Sensors and Biofuel Cells: Combining Intrinsic and Design-Induced Stretchability
Nano Letters, 16(1), 721–727.
2016 speech
Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond
Presented at the RTP CFO Forum.
Event: RTP CFO Forum on March 4, 2016
2016 speech
Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules
Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.
Event: Carolina PCB at McKimmon Center, Raleigh, NC
2016 conference paper
Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules
Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.
Event: International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016) at Raleigh, NC on June 13-15, 2016
2016 conference paper
A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)
Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.
Event: Electronics Packaging Symp & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016
2016 conference paper
Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics
Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.
Event: Electronics Packaging Symposium & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016
2016 conference paper
Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing
Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.
Event: 49th International Symposium on Microelectronics at Pasadena, CA on October 10-13, 2016
2016 journal article
A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient
A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.
2016 conference paper
Advanced multi-physics simulation for high performance power electronic packaging design
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
2016 conference paper
A folded GaN VRM with high electrical and thermal performance
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
2016 journal article
Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications
International Symposium on Microelectronics, 2016(1), 000391–000396.
2016 article
Languages and Compilers for Parallel Computing: 28th International Workshop, LCPC 2015, Raleigh, NC, USA, September 9-11, 2015, Revised Selected Papers
Springer.