Electrical & Computer Engineering

Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond

Presented at the RTP CFO Forum.

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.

Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules

Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.

A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)

Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.

Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics

Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.

Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

Languages and Compilers for Parallel Computing: 28th International Workshop, LCPC 2015, Raleigh, NC, USA, September 9-11, 2015, Revised Selected Papers

Springer.

A review of maximum power-point tracking techniques for photovoltaic systems

International Journal of Sustainable Energy, 35(5), 478–501.

Selective GPU Cache Bypassing for Un-Coalesced Loads

In X. Liao (Ed.), 22nd IEEE International Conference on Parallel and Distributed Systems : ICPADS 2016 : proceedings : 13-16 December 2016, Wuhan, Hubei, China.

Fault contribution from large photovoltaic systems in building power supply networks

Journal of Building Engineering, 5, 222–230.

Information on the MAST ENF Power Signature Dataset

Commentary : Hypothesis Focused Ultrasound and NXY-059 in Experimental Cerebral Ischemia: A New Therapeutic Opportunity?

CNS & Neurological Disorders - Drug Targets, 15(9), 1010–1013.

Comparative analysis of power density in Si MOSFET and GaN HEMT based flyback converters

2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG). Presented at the 2016 10th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG).

Erratum to: The Effect of Multivalley Bandstructure on Thermoelectric Properties of Al x Ga1−x As

Journal of Electronic Materials, 45(6), 3249–3250.

Erratum: “Electron band bending of polar, semipolar and non-polar GaN surfaces” [J. Appl. Phys. 119, 105303 (2016)]

Journal of Applied Physics, 119(15), 159901.

Thermomagnetic liquid cooling: A novel variable speed motor drives thermal management solution

Proceedings - 2015 IEEE International Electric Machines and Drives Conference, IEMDC 2015, 1768–1773.