Electrical & Computer Engineering

College of Engineering

Works Published in 2016

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Displaying works 1 - 20 of 539 in total

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2016 conference paper

Performance comparison of three optimized alternative pulse shaping filters with the raised cosine filter for wireless applications

1st International Conference on Computer and Information Engineering, ICCIE 2015, 9–12.

By: T. Roy*, M. Pervej* & M. Morshed*

Source: ORCID
Added: May 17, 2023

2016 journal article

Separating hyperfine from spin-orbit interactions in organic semiconductors by multi-octave magnetic resonance using coplanar waveguide microresonators

Applied Physics Letters, 109(10), 103303.

By: G. Joshi*, R. Miller*, L. Ogden*, M. Kavand*, S. Jamali*, K. Ambal*, S. Venkatesh, D. Schurig* ...

Source: ORCID
Added: March 15, 2023

2016 journal article

Computationally fast EM field propagation through axi-symmetric media using cylindrical harmonic decomposition

Opt. Express, 24(25), 29246–29268.

By: S. Venkatesh & D. Schurig*

Source: ORCID
Added: March 15, 2023

2016 journal article

W-band sparse synthetic aperture for computational imaging

Opt. Express, 24(8), 8317.

By: S. Venkatesh, N. Viswanathan* & D. Schurig*

Source: ORCID
Added: March 15, 2023

2016 journal article

Hybrid cavity-coupled plasmonic biosensors for low concentration, label-free and selective biomolecular detection

Optics Express, 24(22), 25785–25796.

By: A. Vázquez-Guardado, A. Smith, W. Wilson, J. Ortega, J. Perez & D. Chanda

Source: ORCID
Added: March 13, 2023

2016 journal article

Unified Electromagnetic-Electronic Design of Light Trapping Silicon Solar Cells

Scientific Reports, 6(1).

By: J. Boroumand*, S. Das*, A. Vázquez-Guardado, D. Franklin* & D. Chanda*

Source: ORCID
Added: March 13, 2023

2016 conference paper

Action classification from motion capture data using topological data analysis

2016 IEEE Global Conference on Signal and Information Processing (GlobalSIP).

By: A. Dirafzoon n, N. Lokare n & E. Lobaton

Source: ORCID
Added: February 10, 2023

2016 conference paper

Hierarchical activity clustering analysis for robust graphical structure recovery

2016 IEEE Global Conference on Signal and Information Processing (GlobalSIP).

By: N. Lokare n, D. Benavides n, S. Juneja n & E. Lobaton

Source: ORCID
Added: February 10, 2023

2016 journal article

Highly Stretchable Fully-Printed CNT-Based Electrochemical Sensors and Biofuel Cells: Combining Intrinsic and Design-Induced Stretchability

Nano Letters, 16(1), 721–727.

By: A. Bandodkar, I. Jeerapan*, J. You*, R. Nuñez-Flores* & J. Wang*

author keywords: Printed electronics; electrochemical sensors; carbon nanotubes; biofuel cells; stretchable devices
Source: ORCID
Added: April 8, 2022

2016 speech

Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond

Presented at the RTP CFO Forum.

By: D. Hopkins

Event: RTP CFO Forum on March 4, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 speech

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.

By: D. Hopkins

Event: Carolina PCB at McKimmon Center, Raleigh, NC

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules

Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.

By: Y. Xu & D. Hopkins

Event: International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016) at Raleigh, NC on June 13-15, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)

Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.

By: D. Hopkins, Y. Xu, H. Ke & A. Morgan

Event: Electronics Packaging Symp & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics

Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.

By: X. Zhao, B. Gao & D. Hopkins

Event: Electronics Packaging Symposium & Heterogeneous Integration Workshop at Binghamton, NY on October 6-7, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 conference paper

Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.

By: X. Zhao, H. Ke, Y. Jiang, A. Morgan, Y. Xu & D. Hopkins

Event: 49th International Symposium on Microelectronics at Pasadena, CA on October 10-13, 2016

Source: NC State University Libraries
Added: October 16, 2021

2016 journal article

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

By: X. Zhao n, H. Ke n, Y. Jiang n, A. Morgan n, Y. Xu n & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: X. Zhao n, Y. Xu n & D. Hopkins

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: B. Gao n & D. Hopkins

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 journal article

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

By: X. Zhao n, K. Jagannadham n, W. Reainthippayasakul*, M. Lanagan* & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2016 article

Languages and Compilers for Parallel Computing: 28th International Workshop, LCPC 2015, Raleigh, NC, USA, September 9-11, 2015, Revised Selected Papers

Springer.

By: X. Shen, F. Mueller & J. Tuck

Source: ORCID
Added: August 18, 2021