Electrical & Computer Engineering

College of Engineering

Works Published in 2017

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2017 journal article

Analysis and Design of Current Control Schemes for LCL-Type Grid-Connected Inverter Based on a General Mathematical Model

IEEE Transactions on Power Electronics.

Source: ORCID
Added: April 24, 2022

2017 conference paper

Reliability assessment and comparison between centralized and distributed energy management system in islanding microgrid

2017 North American Power Symposium (NAPS).

By: Z. Cheng, J. Duan & M. Chow

Source: ORCID
Added: April 17, 2022

2017 speech

Grid Modernization – FREEDM Systems Center

Presented at the Interagency Advanced Power Group-Electronics Systems Working Group, Tallahassee, FL.

Event: Interagency Advanced Power Group-Electronics Systems Working Group at Tallahassee, FL on January 10-12, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

3D Printing Power Supply in Package Power Supply on Chip versus Discrete Packaging

Panel Discussion presented at the IEEE Applied Power Electronics Conference, Tampa, FL.

Event: IEEE Applied Power Electronics Conference at Tampa, FL on March 26-30, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

Heterogeneous Integration Integrated Power Devices Roadmap

Presented at the Electronics Packaging Symposium and Workshop, Niskayuna, NY.

Event: Electronics Packaging Symposium and Workshop at Niskayuna, NY on September 19-20, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

True 3D Power Packaging - Higher Densities Through Orthogonality

Presented at the ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

By: D. Hopkins & H. Ke

Event: ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK) at San Francisco, CA on August 29 - September 1, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 conference paper

Characterization of Novel Materials for Thin Flexible Power Substrates for High-Density Power Electronics

Hopkins, D. C., Zhao, X., Jagannadham, K., Reainthippayasakul, W., Lanagan, M. T., Jiang, Y., … Fukawa, Y. (2017, August 29). Keynote presented at the ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

By: D. Hopkins, X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan, Y. Jiang, B. Gao, K. Nishiguchi, Y. Fukawa

Event: ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK) at San Francisco, CA on August 29 - September 1, 2017

Source: NC State University Libraries
Added: October 16, 2021

2017 journal article

Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules

International Symposium on Microelectronics, 2017(1), 000312–000317.

By: A. Morgan, X. Zhao, J. Rouse & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies

International Symposium on Microelectronics, 2017(1), 000353–000359.

By: X. Zhao, K. Jagannadham & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications

International Symposium on Microelectronics, 2017(1), 000151–000156.

By: X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors

International Symposium on Microelectronics, 2017(1), 000224–000230.

By: H. Ke, Y. Jiang, A. Morgan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 conference paper

Proteus: A flexible and fast software supported hardware logging approach for nvm

Proceedings of the 50th Annual IEEE/ACM International Symposium on Microarchitecture, 178–190.

By: S. Shin, S. Tirukkovalluri, J. Tuck & Y. Solihin

Source: ORCID
Added: August 18, 2021

2017 conference paper

Hardware supported persistent object address translation

2017 50th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO), 800–812.

By: T. Wang, S. Sambasivam, Y. Solihin & J. Tuck

Event: IEEE

Source: ORCID
Added: August 18, 2021

2017 conference paper

Efficient checkpointing of loop-based codes for non-volatile main memory

2017 26th International Conference on Parallel Architectures and Compilation Techniques (PACT), 318–329.

By: H. Elnawawy, M. Alshboul, J. Tuck & Y. Solihin

Event: IEEE

Source: ORCID
Added: August 18, 2021

2017 conference paper

Leveraging near data processing for high-performance checkpoint/restart

Proceedings of the International Conference for High Performance Computing, Networking, Storage and Analysis, 1–12.

By: A. Agrawal, G. Loh & J. Tuck

Source: ORCID
Added: August 18, 2021

2017 conference paper

Improving the effectiveness of searching for isomorphic chains in superword level parallelism

2017 50th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO), 718–729.

By: J. Huh & J. Tuck

Event: IEEE

Source: ORCID
Added: August 18, 2021

2017 conference paper

The viability of conductive medical epoxy as an implantable electrode material

Proceedings of IEEE Sensors, 2017-December, 1–3.

By: J. Reynolds, J. Valero-Sarmiento, J. Dieffenderfer & A. Bozkurt

Source: ORCID
Added: June 2, 2021

2017 conference paper

Nanocellulose electrodes for interfacing plant electrochemistry

Proceedings of IEEE Sensors.

By: K. Keller, M. Wilkins, J. Reynolds, J. Dieffenderfer, C. Hood, M. Daniele, A. Bozkurt, M. Tunc-Ozdemir

Source: ORCID
Added: June 2, 2021

2017 journal article

3D face recognition in the Fourier domain using deformed circular curves

Multidimensional Systems and Signal Processing, 28(1), 105–127.

By: D. Lee & H. Krim

Source: Crossref
Added: December 31, 2020

2017 report

Prototype to Patient Treatment: Dialogue on Safety, Regulation, Privacy, Security, and Acceptability for Wearable Medical Devices — A Workshop Report

(National Science Foundation Grant Report No. 1160483).

By: R. Foley, P. Asare, J. Delborne, J. Lach & V. Misra

Sources: Crossref, ORCID
Added: December 4, 2020