College of Engineering
Displaying works 1 - 20 of 434 in total
Sorted by most recent date added to the index first, which may not be the same as publication date order.
2017 report
Distribution Planning Criteria and Tools for Future Distributed Energy Resource Penetration Scenarios using Probabilistic Approaches
[CAPER Report]. Raleigh, NC: North Carolina State University and Clemson University.
2017 journal article
Design, package, and hardware verification of a high voltage current switch
IEEE Journal of Emerging and Selected Topics in Power Electronics, (99).
2017 conference paper
Physical Design of a Stacked Heterogeneous Multi-Core Processor
Davis, W. R. (2017, September 19). Presented at the Oxford Circuits and Systems Conference, Oxford, UK.
Event: Oxford Circuits and Systems Conference at Oxford, UK on September 19, 2017
2017 journal article
Analysis and Design of Current Control Schemes for LCL-Type Grid-Connected Inverter Based on a General Mathematical Model
IEEE Transactions on Power Electronics.
2017 conference paper
Reliability assessment and comparison between centralized and distributed energy management system in islanding microgrid
2017 North American Power Symposium (NAPS).
2017 speech
Grid Modernization – FREEDM Systems Center
Presented at the Interagency Advanced Power Group-Electronics Systems Working Group, Tallahassee, FL.
Event: Interagency Advanced Power Group-Electronics Systems Working Group at Tallahassee, FL on January 10-12, 2017
2017 conference paper
3D Printing Power Supply in Package Power Supply on Chip versus Discrete Packaging
Panel Discussion presented at the IEEE Applied Power Electronics Conference, Tampa, FL.
Event: IEEE Applied Power Electronics Conference at Tampa, FL on March 26-30, 2017
2017 conference paper
Heterogeneous Integration Integrated Power Devices Roadmap
Presented at the Electronics Packaging Symposium and Workshop, Niskayuna, NY.
Event: Electronics Packaging Symposium and Workshop at Niskayuna, NY on September 19-20, 2017
2017 conference paper
True 3D Power Packaging - Higher Densities Through Orthogonality
Presented at the ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.
Event: ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK) at San Francisco, CA on August 29 - September 1, 2017
2017 conference paper
Characterization of Novel Materials for Thin Flexible Power Substrates for High-Density Power Electronics
Hopkins, D. C., Zhao, X., Jagannadham, K., Reainthippayasakul, W., Lanagan, M. T., Jiang, Y., … Fukawa, Y. (2017, August 29). Keynote presented at the ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.
Event: ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK) at San Francisco, CA on August 29 - September 1, 2017
2017 journal article
Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules
International Symposium on Microelectronics, 2017(1), 000312–000317.
2017 journal article
Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies
International Symposium on Microelectronics, 2017(1), 000353–000359.
2017 journal article
Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications
International Symposium on Microelectronics, 2017(1), 000151–000156.
2017 journal article
Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors
International Symposium on Microelectronics, 2017(1), 000224–000230.
2017 conference paper
Proteus: A flexible and fast software supported hardware logging approach for nvm
Proceedings of the 50th Annual IEEE/ACM International Symposium on Microarchitecture, 178–190.
2017 conference paper
Hardware supported persistent object address translation
2017 50th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO), 800–812.
Event: IEEE
2017 conference paper
Efficient checkpointing of loop-based codes for non-volatile main memory
2017 26th International Conference on Parallel Architectures and Compilation Techniques (PACT), 318–329.
Event: IEEE
2017 conference paper
Leveraging near data processing for high-performance checkpoint/restart
Proceedings of the International Conference for High Performance Computing, Networking, Storage and Analysis, 1–12.
2017 conference paper
Improving the effectiveness of searching for isomorphic chains in superword level parallelism
2017 50th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO), 718–729.
Event: IEEE
2017 conference paper
The viability of conductive medical epoxy as an implantable electrode material
Proceedings of IEEE Sensors, 2017-December, 1–3.
