Electrical & Computer Engineering

Heterogeneous Integration Roadmap Update-integrated power electronics (IPE)

Hopkins, D. C. (2018, June 25). Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing, College Park, MD.

Comparing Power Packaging Through A Thermal Resistance Circle Based on Finite Element Analysis

Chen, T., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

6.5kV, 100A, 175kHz Super Cascode Power Module (SCPM)

Gao, B., Morgan, A., Xu, Y., Zhao, X., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

Scalable MV/HV Super Cascode Power Module

Gao, B., Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Development of De-encapsulation Process for WBG Semiconductor Packaging Rework and Failure Analysis

Golding, C., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Parasitic Integration for 500kHz ZVS DC-DC Converter Using New Polymer Material in IMS Module

Guven, M., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Self-Oscillating WBG-based VHF Power Conversion for FREEDM Applications

Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Increasing Electrical and Thermal Performances of VRMs by Using Folded Flexible Substrate

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

6.5kV SiC JFET-based Super Cascode Power Module with High Avalanche Energy Handling Capability

2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

New Short Circuit Failure Mechanism for 1.2kV 4H-SiC MOSFETs and JBSFETs

2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

WIRELESS POWER TRANSFER APPARATUS USING ENCLOSURES WITH ENHANCED MAGNETIC FEATURES AND METHODS OF FABRICATING THE SAME

Compton, B., Xu, J., Wang, X., Zheng, Q., & Pahl, B. (2018, October 30). Patsnap.

Inter-disciplinary research challenges in computer systems for the 2020s

National Science Foundation, USA, Tech. Rep.

A 24-44 GHz UWB LNA for 5G Cellular Frequency Bands

Global Symposium on Millimeter Waves (GSMM).

Preliminary Evaluation of an Injectable Sensor for Subcutaneous Photoplethysmography in Animals

2018 IEEE Biomedical Circuits and Systems Conference (BioCAS).

Neuro Interfaces: Neuro-Nano Interfaces: Utilizing Nano-Coatings and Nanoparticles to Enable Next-Generation Electrophysiological Recording, Neural Stimulation, and Biochemical Modulation (Adv. Funct. Mater. 12/2018)

Advanced Functional Materials, 28(12), 1870079.

A Four-step Method for Capstone Design Teams to Gather Relevant and Well-defined Product Requirements

2018 ASEE Annual Conference & Exposition Proceedings.

System and method for charging receiver devices

(US Patent No. US20180041066A1). Retrieved from https://patents.google.com/patent/US20180041066A1/en

Dc converters with modified droop control and method of use

(US Patent No. US20180083545A1). Retrieved from https://patents.google.com/patent/US20180083545A1/en

DC converters with modified droop control and method of use

(US Patent No. US10097095B2). Retrieved from https://patents.google.com/patent/US10097095B2/en

Signal reshaping approximation

Su, G.-M., Wong, C.-W., Chou, H.-T., & Kottayil, N. K. A. M. B. A. L. L. U. R. (2018, September).