Electrical & Computer Engineering

Bi–Directional Solid-State Circuit Breaker for MV Applications Based on SuperCascode Switching

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, February 12). Presented at the Power America Annual Meeting, Raleigh, NC.

Trends in Power Electronics Packaging

Hopkins, D. C. (2019, April 10). Tutorial presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

Morgan, A., Kanale, A., Han, K., Baliga, J., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

High Frequency Self-Oscillating WBG-based Power Conversion

Morgan, A., Gao, B., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

ERCD Power Stage Characterization for MV SSCB Application

Sinha, S. S., Ballard, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

Development of a High Frequency LLC Resonant Converter for Investigation of MLCCs for EV applications

Guven, M., Gao, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

WBG Solid State Circuit Protection using 10kV/200 A Super Cascode power module

Mehrotra, U., & Hopkins, D. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

Opportunities in Power Applications using Epoxy Resin Composite Dielectrics

Hopkins, D., & Ballard, B. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Cheng, T.-H., Gao, B., Boteler, L., & Hopkins, D. (2019, November 13). Presented at the PCB Carolina, Raleigh, NC.

Power Packaging Assembly Challenges

Hopkins, D. C. (2019, March 27). Invited keynote presented at the A.R.E.A. Consortium Meeting Universal Instruments, Binghamton, NY.

1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop

Kanale, A., Cheng, T.-H., Hanl, K., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2019, September 29). Presented at the International Conference on Silicon Carbide and Related Materials, Kyoto, Japan.

Characterization of a Topside Cooled Epoxy-Resin Composite Dielectric (ERCD) Package for Bi-Directional Power Switch

Cheng, T.-H., Gao, B., Nishiguchi, K., & Hopkins, D. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Hopkins, D. C., Cheng, T.-H., Gao, B., & Boteler, L. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

Designing for Switching Stresses in a Circuit Breaker Application using SiC Semiconductors

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, October 29). Tutorial presented at the 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA, Raleigh, NC.

Design and Integration of WBG Solid State Circuit Protection

Hopkins, D. C., Ballard, B., & Mehrotra, U. (2019, March 17). Tutorial presented at the IEEE Applied Power Electronics Conference, Anaheim, CA.

Edge Interconnect Packaging of Integrated Circuits for Power Systems

(US Patent No. 10,325,875B2).

Thermal Characteristics and Simulation of an Integrated GaN eHEMT Power Module

2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). Presented at the 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe).

A High-Bandwidth Resistive Current Sensing Technology for Breakers and Desaturation Protection

2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

Flexible Large Power Solid State Transformer (FLP-SST)

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

2019 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2019 IEEE Applied Power Electronics Conference and Exposition (APEC).