Electrical & Computer Engineering

College of Engineering

Works Published in 2020

Sorted by most recent date added to the index first, which may not be the same as publication date order.

2020 conference paper

Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing

Cheng, T.-H., Mehrotra, U., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

By: T. Cheng, U. Mehrotra & D. Hopkins

Event: Power America Institute Annual Meeting at Raleigh, NC on February 25-27, 2020

Source: NC State University Libraries
Added: September 11, 2021

2020 conference paper

Dynamic and Thermal IOL Test Systems for 3.3kV-6.5kV Die Development

Murthy, P., Mehrotra, U., Yu, W., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

By: P. Murthy, U. Mehrotra, W. Yu & D. Hopkins

Event: Power America Institute Annual Meeting at Raleigh, NC on February 25-27, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 conference paper

Traditional DBC-Based Power Modules for Test in Developing 3.3kV-15kV WBG Devices

Mehrotra, U., Morgan, A., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

By: U. Mehrotra, A. Morgan & D. Hopkins

Event: Power America Institute Annual Meeting at Raleigh, NC on February 25-27, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 speech

Creating a Fast Turn Lab to Package Developmental Power Devices with a Packaging Example

Hopkins, D. C. (2020, August). Presented at the NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices, Raleigh, NC.

Event: NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices at Raleigh, NC on August 3-5, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 speech

ParaPower – Leveraging Finite Difference Simulator for Quick Thermal Design

Sinha, S. S., & Hopkins, D. C. (2020, January). Webinar presented at the FREEDM Systems Center & PREES Lab, NC State University, Raleigh, NC.

By: S. Sinha & D. Hopkins

Event: FREEDM Systems Center & PREES Lab, NC State University at Raleigh, NC on January 24, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 conference paper

Ultra-High Density Double-Sided Half Bridge Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2020, July 23). Invited paper presented at the Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC).

By: D. Hopkins, T. Cheng & U. Mehrotra

Event: Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC) on July 23, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 article

Energy- vs Spectral-Efficiency for Energy-Harvesting Hybrid RF/VLC Networks

2020 54TH ASILOMAR CONFERENCE ON SIGNALS, SYSTEMS, AND COMPUTERS.

Sources: Web Of Science, ORCID
Added: September 7, 2021

2020 journal article

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

International Symposium on Microelectronics, 2020(1), 000277–000281.

By: T. Cheng, K. Nishiguchi, Y. Fukawa, B. Baliga, S. Bhattacharya & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2020 conference paper

High Current Medium Voltage Bidirectional Solid State Circuit Breaker using SiC JFET Super Cascode

2020 IEEE Energy Conversion Congress and Exposition (ECCE). Presented at the 2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI.

By: U. Mehrotra, B. Ballard & D. Hopkins

Event: 2020 IEEE Energy Conversion Congress and Exposition (ECCE) at Detroit, MI on October 11-15, 2020

Sources: Crossref, ORCID
Added: September 5, 2021

2020 journal article

Lithium Battery Cell Level Fusing with Aluminum Heavy Wire Bonds

International Symposium on Microelectronics, 2020(1), 000009–000014.

By: U. Mehrotra, A. Brazzle, M. McKeown & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2020 conference paper

Optimized Highly Efficient SSCB Using Organic Substrate Packaging for Electric Vehicle Applications

2020 IEEE Transportation Electrification Conference & Expo (ITEC). Presented at the 2020 IEEE Transportation Electrification Conference & Expo (ITEC).

By: U. Mehrotra, B. Ballard, T. Cheng, B. Baliga, S. Bhattacharya & D. Hopkins

Event: 2020 IEEE Transportation Electrification Conference & Expo (ITEC)

Sources: Crossref, ORCID
Added: September 5, 2021

2020 conference paper

Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate

2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).

By: U. Mehrotra, T. Cheng, A. Kanale, A. Agarwal, K. Han, B. Baliga, S. Bhattacharya, D. Hopkins

Event: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Sources: Crossref, ORCID
Added: September 5, 2021

2020 journal article

Adaptive Droop Control Method for Suppressing Circulating Currents in DC Microgrids

IEEE Open Access Journal of Power and Energy, 7, 100–110.

By: N. Ghanbari & S. Bhattacharya

Source: ORCID
Added: September 5, 2021

2020 journal article

Power Conversion With a Magnetically-Geared Permanent Magnet Generator for Low-Speed Wave Energy Converter

IEEE Transactions on Industry Applications, 56(5), 5308–5318.

By: S. Hazra, P. Kamat, S. Bhattacharya, W. Ouyang & S. Englebretson

Source: ORCID
Added: September 5, 2021

2020 article

Machine Learning and Hardware security: Challenges and Opportunities -Invited Talk

2020 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER AIDED-DESIGN (ICCAD).

By: F. Regazzoni, S. Bhasin, A. Pour, I. Alshaer, F. Aydin, A. Aysu, V. Beroulle, G. Di Natale ...

Sources: Web Of Science, ORCID
Added: August 30, 2021

2020 article

BoMaNet: Boolean Masking of an Entire Neural Network

2020 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER AIDED-DESIGN (ICCAD).

By: A. Dubey, R. Cammarota & A. Aysu

Source: Web Of Science
Added: August 30, 2021

2020 article

Improved Rotor Position Estimation in Extended Back-EMF Based Position Sensorless Control for IPMSMs with Non-Sinusoidal Back-EMF

2020 IEEE INDUSTRY APPLICATIONS SOCIETY ANNUAL MEETING.

Sources: Web Of Science, ORCID
Added: August 30, 2021

2020 article

2.3-kV, 5-A 4H-SiC Ti and Ni JBS Rectifiers manufactured in Commercial Foundry: Impact of Implant Lateral Straggle

2020 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA).

By: A. Agarwal, K. Han & B. Baliga

Source: Web Of Science
Added: August 23, 2021

2020 article

Achieving Short Circuit Capability for 600 V GaN FETs Using a Gate-Source-Shorted Si Depletion-Mode MOSFET in Series with the Source

2020 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA).

By: A. Kanale & B. Baliga

Source: Web Of Science
Added: August 23, 2021

2020 article

Dislocation-Based Thermodynamic Models of V-Pits Formation and Strain Relaxation in InGaN/GaN Epilayers on Si Substrates

TMS 2020 149TH ANNUAL MEETING & EXHIBITION SUPPLEMENTAL PROCEEDINGS.

By: K. Khafagy, T. Hatem & S. Bedair

Source: Web Of Science
Added: August 23, 2021