2024 journal article
Fabrication of 32×32 2 D CMUT Arrays on a Borosilicate Glass Substrate With Silicon- Through-Wafer Interconnects Using Non- Aligned and Aligned Anodic Bonding
Journal of Microelectromechanical Systems.
By: M. Annayev n, A. Biliroğlu n, E. Şennik n, F. Yamaner n & Ö. Oralkan n